TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-158
REVISION
PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets
1 of 11
AUTHORIZED BY
DATE
B
31 Aug 06
D. Horchler
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality, and reliability requirements of the PLCC SMT
connector products (FCI USA product series PLCC-XXP-T-SMT and PLCC-XXP-T-SMT-SOD).
2.0
SCOPE
This specification is applicable to the termination characteristics of the surface mount PLCC sockets
accepting EIA/JEDEC Standard plastic J-leaded chip carrier IC’s in lead counts of 20, 28, 32, 44, 52, 68, and
84.
3.0
GENERAL
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
Objective
Scope
General
Applicable Documents
Requirements
Electrical Characteristics
Mechanical Characteristics
Environmental Conditions
Quality Assurance Provisions
4.0
APPLICABLE DOCUMENTS
4.1
SPECIFICATIONS
Engineering Drawings: 59000, 59001, 59002
4.2
EIA and MILITARY STANDARDS
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
EIA 364-XX:
MIL-C-45662:
MIL-STD-202:
MIL-STD-883:
MIL-STD-1344:
Test Methods for Electronic Component Parts and Connectors
Equipment Calibration
Test Methods for Electronic and Electical Component Parts
Test Methods and Procedures for Microelectronics
Test Methods for Electronic Connectors
4.3
FEDERAL SPECIFICATIONS
4.3.1
QQ-N-290: Nickel Plating (Electrodeposited)
4.3.2
QQ-B-750: Phosphor Bronze Alloy Strip
OTHER STANDARDS AND SPECIFICATIONS
4.4.1
UL-94:
Tests for Flammability of Plastic Materials
4.4
Copyright
Form E-3334
Rev E
FCI
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 29, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-158
REVISION
PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets
2 of 11
AUTHORIZED BY
DATE
B
31 Aug 06
D. Horchler
CLASSIFICATION
UNRESTRICTED
4.5
FCI SPECIFICATIONS
4.5.1
4.5.2
4.5.3
4.5.4
4.5.5
4.5.6
4.5.7
4.5.8
BUS-03-113:
BUS-03-114:
BUS-03-115:
BUS-15-002:
BUS-15-006:
BUS-16-010:
BUS-19-002:
BUS-19-040:
Inductance Measurement
Capacitance Measurement
Insulation Resistance
Nickel Finish
Electrodeposited 93-7 and 90-10 Tin-Lead
Phosphor Bronze Strip
Solderability
Plating Adhesion
4.6
FCI LAB REPORTS - SUPPORTING DATA
ETR-0015
Surface Mount PLCC Socket (partial qualification report)
5.0
REQUIREMENTS
5.1
DESIGN AND CONSTRUCTION
Product shall be of design, construction, and physical dimensions specified on the applicable
product drawings.
5.2
MATERIALS
5.2.1
Contacts: The base material shall be phosphor bronze strip, in accordance with QQ-B-
750. See Section 5.3 for plating requirements.
Insulator Housing. The insulators shall be molded of Polyphenylene Sulfide (PPS), 40%
glass filled, rated flame retardant V-0 or better in accordance with UL-94.
5.2.2
5.3
FINISH
The contacts shall be plated with 150 micro-inches min. Tin-Lead over 40 micro-inches min. Nickel.
Platings to meet requirements of BUS-15-002/B (Nickel) and BUS-15-006/B (Tin-Lead).
5.4
RATINGS
5.4.1
Operating Temperature Range: -55°C to +125°C
Copyright
Form E-3334
Rev E
FCI
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 29, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-158
REVISION
PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets
3 of 11
AUTHORIZED BY
DATE
B
31 Aug 06
D. Horchler
CLASSIFICATION
UNRESTRICTED
6.0
ELECTRICAL CHARACTERISTICS
6.1
CURRENT RATING
The maximum current rating based upon a 30°C temperature rise over ambient is 1.0 Amp AC/DC
per contact, with ambient temperature of 25°C ± 5°C.
6.2
LOW LEVEL CONTACT RESISTANCE (LLCR)
When tested in accrodance with MIL-STD-1344, Method 3002, the low - level contact resistance
shall not exceed 20 milliohms initial. The maximum change in LLCR from initial is 6 milliohms. The
following details shall apply:
A.
B.
C.
Method of connection: Attach current and voltage leads as shown in Figure 1.0.
Test Voltage: 50 millivolts DC max open circuit.
Test Current: Not to exceed 100 milliamperes.
6.3
INSULATION RESISTANCE
When tested in accordance with MIL-STD-1344, Method 3003, Condition B, the insulation resistance
of the connector shall not be less than 10,000 MΩ. The following details shall apply:
A.
B.
Test voltage: 600 volts DC
Measurement points: The insulation resistance shall be measured between adjacent
circuits of unmated socket assemblies.
6.4
DIELECTRIC WITHSTANDING VOLTAGE
When tested in accordance with MIL-STD-1344, Method 3001, there shall be no evidence of arc-
over or insulation breakdown. The following details shall apply:
A.
B.
C.
Test voltage: 600 VAC RMS at 60 hz.
Test Duration: 60 seconds
Measurement points: The dielectric withstanding voltage shall be applied across adjacent
circuits of unmated socket assemblies.
Copyright
Form E-3334
Rev E
FCI
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 29, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-158
REVISION
PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets
4 of 11
AUTHORIZED BY
DATE
B
31 Aug 06
D. Horchler
CLASSIFICATION
UNRESTRICTED
6.5
CAPACITANCE
When tested in accordance with MIL-STD-202, Method 305, contact capacitance should be 1.0
picofarad maximum. The following details shall apply:
A. Measurement points: Test between adjacent circuits at random locations of unmated sockets
at 1 MHz.
6.6
INDUCTANCE
Tested in accordance with BUS-03-113:
Self Inductance: 2.0 nH maximum at 500 KHz.
Mutual Inductance: 1.0 nH maximum at 500 KHz.
7.0
MECHANICAL CHARACTERISTICS
7.1
CONTACT RETENTION
Individual contacts shall withstand a downward axial load of 10 ounces (283 grams) minimum.
7.2
DURABILITY
Using nominal size gage, no damage to insulator housing or contacts shall occur after 25 cycles
(mate and unmate) at insertion rate of .5 inch/minute. The socket shall also meet the contact
resistance requirements of paragraph 6.2 after durability testing.
7.3
MATING FORCE
After PLCC sockets are preconditioned (mate and unmate, 5 cycles) with a nominal size PLCC
gage, the insertion force shall be 10 ounces maximum per contact when mated with a PLCC gage at
maximum insertion rate of .5 inch per minute.
7.4
UNMATING FORCE
After PLCC sockets are preconditioned (mate and unmate, 5 cycles) with a nominal size PLCC
gage, the withdrawal force shall be 0.5 ounces minimum per contact when mated with a PLCC gage
at maximum withdrawal rate of .5 inch per minute.
7.5
NORMAL FORCE
The individual contact normal force shall not be less than 5.3 ounces (150 grams) initial when
measured as shown in Figure 2.0. Connectors shall be soldered to PC Boards.
7.6
Copyright
Form E-3334
Rev E
FCI
PLATING ADHESION BENDING TEST
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 29, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-158
REVISION
PLCC (Plastic Leaded Chip Carrier) Surface Mount Sockets
5 of 11
AUTHORIZED BY
DATE
B
31 Aug 06
D. Horchler
CLASSIFICATION
UNRESTRICTED
Testing and acceptance per BUS-19-040/A, Plating Adhesion Bend Test (equivalent to ASTM B571-
84).
7.7
MECHANICAL SHOCK – MIL-STD-1344, METHOD 2004, TEST G
A.
B.
C.
50 g’s for 0.11 ms half-sine.
Shocks: 3 shocks in both directions along each of 3 orthogonal axes (18 total).
No discontinuities greater than 1.0 microseconds.
7.8
VIBRATION – MIL-STD-1344, METHOD 2005
A.
B.
C.
D.
Condition: III
Vibration Amplitude: 15G
Sweep time and duration: 10-60-10 Hz in one minute, 2 hours along each of 3 orthogonal
axes (6 hours total).
No discontinuities greater than 1.0 microseconds
8.0
ENVIRONMENTAL CONDITIONS
After exposure to the following environmental conditions in accordance with the specified test procedures
and/or details, the product shall show no physical damage and shall meet the electrical and mechanical
requirements per paragraphs 6.0 and 7.0 as specified in the Table 1.0 test sequences. Unless specified
otherwise, the assemblies shall be mated during exposure.
8.1
HUMIDITY TEMPERATURE CYCLING – MIL-STD-1344, Method 1002 Type II
A.
B.
C.
D.
E.
Test time:
240 hours
Relative humidity: 95%
Temperature:
25 to 65°C
Samples:
mated during exposure.
Pre-test to post-test Contact Resistance change cannot exceed 30% of initial reading
when tested per paragraph 6.2. Insulation Resistance must also meet requirements of
paragraph 6.3.
8.2
THERMAL SHOCK – MIL-STD-202, METHOD 107, CONDITION B
A.
Number of Cycles: 5
Copyright
Form E-3334
Rev E
FCI
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 29, 2010
.
Embedded System
京公网安备 11010802033920号
EEWORLD
