SPECIFICATION
· Supplier : Samsung electro-mechanics
· Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
CL
①
①
Series
②
Size
③
Dielectric
④
Capacitance
⑤
Capacitance
tolerance
⑥
Rated Voltage
⑦
Thickness
21
②
B
③
104
④
K
⑤
B
⑥
F
⑦
N
⑧
· Samsung P/N:
· Description :
(Reference sheet)
CL21B104KBFNNNF
CAP, 100nF, 50V, ±10%, X7R, 0805
N
⑨
N
⑩
F
⑪
Samsung Multi-layer Ceramic Capacitor
0805 (inch code)
L:
2.00 ± 0.10 ㎜
X7R
100 nF
±10 %
50 V
1.25 ± 0.10 ㎜
⑧
Inner electrode
Termination
Plating
⑨
Product
⑩
Special
⑪
Packaging
W:
1.25 ± 0.10 ㎜
Ni
Cu
Sn 100%
(Pb Free)
Normal
Reserved for future use
Embossed Type, 13" reel
B. Structure & Dimension
Dimension(㎜)
Samsung P/N
L
CL21B104KBFNNNF
2.00 ± 0.10
W
1.25 ± 0.10
T
1.25 ± 0.10
BW
0.50 +0.20/-0.30
C. Samsung Reliablility Test and Judgement Condition
Judgement
Capacitance
Tan
δ
(DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characteristics
Adhesive Strength
of Termination
Bending Strength
Solderability
Within specified tolerance
0.025 max.
Test condition
1㎑ ±10% / 1.0±0.2Vrms
*A capacitor prior to measuring the capacitance is heat
treated at 150℃+0/-10℃ for 1 hour and maintained in
ambient air for 24±2 hours.
10,000Mohm or 500Mohm×㎌
Rated Voltage
60~120 sec.
Whichever is smaller
No abnormal exterior appearance
Microscope (×10)
250% of the rated voltage
No dielectric breakdown or
mechanical breakdown
X7R
(From-55℃ to 125℃, Capacitance change should be within ±15%)
No peeling shall be occur on the
500g·f, for 10±1 sec.
terminal electrode
Capacitance change : within ±12.5%
Bending to the limit (1㎜)
More than 75% of terminal surface
is to be soldered newly
with 1.0mm/sec.
SnAg3.0Cu0.5 solder
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Solder pot : 270±5℃, 10±1sec.
Amplitude : 1.5mm
From 10㎐ to 55㎐ (return : 1min.)
2hours × 3 direction (x, y, z)
With rated voltage
40±2℃, 90~95%RH, 500+12/-0hrs
Resistance to
Soldering Heat
Vibration Test
Capacitance change :
Tan
δ,
IR : initial spec.
Capacitance change :
Tan
δ,
IR : initial spec.
within ±7.5%
within ± 5%
Moisture
Resistance
Capacitance change : within ±12.5%
Tan
δ
: 0.05 max
500Mohm or 25Mohm ×
㎌
IR :
Whichever is smaller
Capacitance change : within ±12.5%
Tan
δ
: 0.05 max
1,000Mohm or 50Mohm ×
㎌
IR :
Whichever is smaller
Capacitance change :
Tan
δ,
IR : initial spec.
within ±7.5%
High Temperature
Resistance
With 200% of the rated voltage
Max. operating temperature
1000+48/-0hrs
1 cycle condition
Min. operating temperature
→
Max. operating temperature
5 cycle test
Temperature
Cycling
→
→
25℃
25℃
※
The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
- Disclaimer & Limitation of Use and Application -
The products listed in this Specification sheet are
NOT
designed and manufactured for any use
and applications set forth below.
Please note that any misuse of the products deviating from products specifications or information
provided in this Spec sheet may cause serious property damages or personal injury.
We will
NOT
be liable for any damages resulting from any misuse of the products, specifically
including using the products for high reliability applications as listed below.
If you have any questions regarding this 'Limitation of Use and Application', you should first contact
our sales personnel or application engineers.
①
②
③
④
⑤
⑥
Aerospace/Aviation equipment
Automotive or Transportation equipment (vehicles
,
trains
,
ships
,
etc)
Medical equipment
Military equipment
Disaster prevention/crime prevention equipment
Any other applications with the same as or similar complexity or reliability to the applications
set forth above.
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