Series 655000 TSOP-to-DIP 0.600 [15.24]
Adapter
FEATURES
• Designed to allow user to cut 32-position adapter down to any size desired.
• Pins are mechanically fastened and soldered to board using Aries’ patented process,
creating a reliable electrical connection and rugged contact.
GENERAL SPECIFICATIONS
• ADAPTER BODY: FR-4 with 1-oz. Cu traces
• PADS: bare Cu protected with Entek
®
by Enthone or immersion white Sn to
eliminate coplanarity concerns and solder bridges associated with hot air solder
leveling
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ]
CUSTOMIZATION:
In addition to the standard products shown
Ni per SAE AMS-QQ-N-290
on this page, Aries specializes in custom design and production.
• OPERATING TEMPERATURE: 221°F [105°C]
Special materials, platings, sizes, and configurations can be
MOUNTING CONSIDERATIONS
• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
• Will plug into standard IC sockets
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
furnished, depending on the quantity.
NOTE:
Aries reserves the
right to change product general specifications without notice.
ORDERING INFORMATION
32-655000-10
32-655000-10-P
for Panelized Version
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18041
Rev. AA
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