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50006-1198C

Description
Hard Metric Connectors Header, Vertical 3 Row 0 Guides, Solder-less Press-Fit, 198 Positions
CategoryThe connector   
File Size254KB,22 Pages
ManufacturerFCI [First Components International]
Download Datasheet Parametric View All

50006-1198C Overview

Hard Metric Connectors Header, Vertical 3 Row 0 Guides, Solder-less Press-Fit, 198 Positions

50006-1198C Parametric

Parameter NameAttribute value
Product CategoryHard Metric Connectors
ManufacturerFCI [First Components International]
ProductHeaders
Mounting StyleThrough Hole
Termination StylePress Fit
Mounting AngleVertical
Contact PlatingGold
Pitch2.54 mm
Factory Pack Quantity72
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
BUS-12-090
REVISION
High Pin Count (HPC II) Connectors
1 of 22
AUTHORIZED BY
DATE
G
6 Dec 05
H. T. Brewbaker
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE:
This specification defines the performance, test, quality and reliability requirements of the HPC product.
2.0
SCOPE:
This specification is applicable to the termination characteristics of the HPC II family of products which
provide mechanical and electrical interconnection of a daughter PCB to a mother PCB.
3.0
GENERAL:
This document is composed of the following sections:
Paragraph
1.0
2.0
3.0
4.0
5.0
5.1
5.2
5.3
5.4
6.0
7.0
8.0
9.0
9.1
9.2
9.3
9.4
9.5
9.6
TABLE 1
Title
OBJECTIVE
SCOPE
GENERAL
APPLICABLE DOCUMENTS
REQUIREMENTS
Qualification
Material
Finish
Design and Construction
ELECTRICAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
ENVIRONMENTAL CONDITIONS
QUALITY ASSURANCE PROVISIONS
Equipment Calibration
Inspection Conditions
Sample Quantity and Description
Acceptance
Qualification Testing
Re-qualification Testing
QUALIFICATION TESTING MATRIX
3.1 Banned/Restricted Substances
All product where the part number ends in “LF” meet the European Union directives and other
country regulations as described in GS-22-008. The part numbers that do not end in “LF” meet all
regulations except for Pb in SnPb plating.
3.2 Manufacturing Processability
All products covered by this specification will withstand exposure to 260°C peak temperature for 10-
30 seconds in a convection, infra-red or vapor phase reflow oven.
Copyright 2005 FCI
Form E-3334
Rev B
06/06/05
V05-0553
GS-01-001
PDM: Rev:G
STATUS:
Released
Printed: Nov 27, 2010
.
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