DF33-4S-33C datasheet, PDF - EEWORLD Datasheet

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DF33-4S-33C: DescriptionBoard to Board u0026 Mezzanine Connectors SOC HSG 4POS 3.3MM; CategoryThe connector; File Size363KB，8 Pages; ManufacturerHirose; Websitehttp://www.hirose-connectors.com/

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DF33-4S-33C Overview

Board to Board u0026 Mezzanine Connectors SOC HSG 4POS 3.3MM

DF33-4S-33C Parametric

Parameter Name	Attribute value
Product Category	Board to Board & Mezzanine Connectors
Manufacturer	Hirose
RoHS	Details
Product	Receptacles
Packaging	Bag
Factory Pack Quantity	100

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3.3mm Pitch Small Size Connectors for Internal Power Source

DF33C Series

Positive

Lock

Completely enclosed

locking system

Protection from

shorts circuits

between adjacent

contacts

Fig.1

Features

1. 5 Amps capacity

When used with 20 AWG wire, this connector has a

maximum capacity of 5A.

(For rated current with other types of wires, please refer to

the table on the next page)

Keying for multiple use

Standard type (Resin: White)

2. Secure lock mechanism

Outer locking mechanism prevents accidental unmating due

to external shocks or drops. (Fig.1)

3. Incorrect mating prevention

Two different housings, a standard and R type, are available

to ensure mis-mating does not occur when using multiple

DF33C connectors on the same design. (Fig.2)

R type (Resin: Black)

4. Accurate board placement

Guide posts are used to help with board placement and

prevent incorrect mating to the PCB.

5. Supports resin sealing

Accepts resin sealing up to 6.5mm without affecting the

performance.

6. Short circuit prevention

The housing protects each contact by enclosing them in a “box”

which also makes each contact independent of each other.

This design prevents short circuits between adjacent contacts.

7. Excellent contact retention

A retainer is available to increase contact/cable retention and

to assure complete contact insertion. The retainer should

also be used when any mechanical stress cold be applied to

the cable.

* The image on the left show header (the board

dip side), the image on the right show the

socket (cabel side).

* This guide key position is indicated in position

facing the mating surface of the header.

Fig.2

8. Prevents solder cracking

To avoid solder crack, a glass-filled resin is used in the

header housing to decrease thermal shrinkage.

9. Easy mating operation

A clear tactile click is delivered upon the completion of the

mating process. This simplifies mating and increases work

efficiency, especially when operating in a noisy environment.

10. Glow Wire compliance (Compliant with IEC 60695-2-11)

2015.11t

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