supply voltage change, load change, shock and vibration.
± 20 PPM available in extended commercial
temperature only
1st year at 25°C
Extended Commercial
Industrial
Any voltage between 2.5V and 3.3V is supported with 1 decimal
point resolution.
Current Consumption
Standby Current
Idd
I_std
Duty Cycle
Rise/Fall Time
DC
Tr, Tf
Output Voltage High
Output Voltage Low
Input Voltage High
Input Voltage Low
Startup Time
Resume Time
RMS Period Jitter
RMS Phase Jitter (random)
VOH
VOL
VIH
VIL
T_start
T_resume
T_jitt
T_phj
No load condition, f = 20 MHz, Vdd = 2.5 V, 2.8 V or 3.3 V
No load condition, f = 20 MHz, Vdd = 1.8 V
ST = GND, Vdd = 3.3 V, Output is Weakly Pulled Down
ST = GND, Vdd = 2.5 or 2.8 V, Output is Weakly Pulled Down
ST = GND, Vdd = 1.8 V, Output is Weakly Pulled Down
All Vdds. f <= 75 MHz
All Vdds. f > 75 MHz
15pF load, 20% - 80% Vdd=2.5V, 2.8V or 3.3V
15pF load, 20% - 80% Vdd=1.8V
30pF load, 20% - 80% Vdd=2.5V, 2.8V or 3.3V
30pF load, 20% - 80% Vdd=1.8V
45pF load, 20% - 80% Vdd=2.5V, 2.8V or 3.3V
45pF load, 20% - 80% Vdd=1.8V
IOH = -4 mA (Vdd = 3.3 V)
IOH = -3 mA (Vdd = 2.8 V and Vdd = 2.5 V)
IOH = -2 mA (Vdd = 1.8 V)
Pin 1, OE or ST
Pin 1, OE or ST
Measured from the time Vdd reaches its rated minimum value
Measured from the time ST pin crosses 50% threshold
f = 75 MHz, Vdd = 2.5 V, 2.8 V or 3.3 V
f = 75 MHz, Vdd = 1.8 V
f = 75 MHz @ BW: 900 kHz to 7.5 MHz, VDD = 2.5 V to 3.3 V
f = 75 MHz @ BW: 900 kHz to 7.5 MHz, VDD = 1.8 V
Note:
1. All electrical specifications in the above table are measured with 15pF output load, unless stated otherwise in the Condition. For more information about SoftEdge
TM
rise/fall time for driving higher output load or reducing EMI, download http://www.sitime.com/support2/documents/AN10022-rise-and-fall-time-rev1.1.pdf.
SiTime Corporation
Rev. 1.46
990 Almanor Avenue
Sunnyvale, CA 94085
(408) 328-4400
www.sitime.com
Revised August 11, 2011
SiT8103
High Performance 1-110 MHz Oscillator
Pin Description Tables
Pin #1 Functionality
OE
H or
Open
[2]
:
specified frequency output
Pin Map
Pin
1
2
ST
H or Open: specified frequency output
L: output is low level (weak pull down). Oscillation stops
3
4
Connection
OE/ST
GND
CLK
VDD
L: output is high impedance
Absolute Maximum Table
Attempted operation outside the absolute maximum ratings of the part may cause permanent damage to the part. Actual performance of the IC
is only guaranteed within the operational specifications, not at absolute maximum ratings.
Parameter
Storage Temperature
VDD
Electrostatic Discharge
Theta JA (with copper plane on VDD and GND)
Theta JC (with PCB traces of 0.010 inch to all pins)
Soldering Temperature (follow standard Pb free soldering guidelines)
Number of Program Writes
Program Retention over -40 to 125°C, Process, VDD (0 to 3.65 V)
Min.
-65
-0.5
–
–
–
–
–
1,000+
Max.
150
4
6000
75
24
260
1
–
Unit
°C
V
V
°C/W
°C/W
°C
NA
years
Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Temperature Cycle
Solderability
Moisture Sensitivity Level
Condition/Test Method
MIL-STD-883F, Method 2002
MIL-STD-883F, Method 2007
JESD22, Method A104
MIL-STD-883F, Method 2003
MSL1 @ 260°C
Startup and Resume Timing Diagram
90% Vdd: 2.5/2.8/3.3 V parts
95% Vdd: 1.8 V parts
Vdd
ST Voltage
Vdd
Pin 4 Voltage
50% Vdd
T_resume
T_start
CLK Output
CLK Output
T_start: Time to start from power-off
(ST/OE Mode)
Note:
2. In 1.8 V mode, a resistor of <100 kΩ between OE pin and VDD is required.
T_resume: Time to resume from ST
(ST Mode Only)
■
Dimensions and Land Patterns
Rev. 1.46
Page 2 of 4
www.sitime.com
SiT8103
High Performance 1-110 MHz Oscillator
Package Size – Dimensions (Unit: mm)
[]
2.5 x 2.0 x 0.75 mm
2.5 ± 0.10
#4
#3
#3
Recommended Land Pattern (Unit: mm)
[5]
1.00
1.9
#4
2.0 ± 0.10
YXXXX
1.1
0.75 ± 0.05
0.75
1.1
3.2 x 2.5 x 0.75 mm
3.2 ± 0.15
#4
#3
#3
2.1
#4
2.2
0.9
YXXXX
2.5 ± 0.15
0.75 ± 0.05
0.9
1.4
5.0 x 3.2 x 0.75 mm
5.0 ± 0.15
#4
#3
#3
2.39
#4
2.54
YXXXX
3.2 ± 0.15
0.8
0.75 ± 0.05
1.15
1.5
7.0 x 5.0 x 0.90 mm
7.0 ± 0.15
#4
#3
#3
5.08
1.7
5.08
#4
5.0 ± 0.15
2.6
1.1
3.81
YXXXX
2.1
No Connect
[5]
#1
#2
#2
#1
0.90 ± 0.10
1.4
2.2
Notes:
3. Top marking: Y denotes manufacturing origin and XXXX denotes manufacturing lot number. The value of “Y” will depend on the assembly location of the device
4. A capacitor of value 0.1
μ
F between Vdd and GND is recommended.
5. The 7050 package with part number designation "-8" has NO center pad.
Rev. 1.46
Page 3 of 4
2.0
1.6
#1
#2
#2
#1
1.1
2.2
1.2
#1
#2
#2
#1
0.7
1.9
1.0
#1
#2
#2
#1
0.5
1.5
www.sitime.com
SiT8103
High Performance 1-110 MHz Oscillator
■
Part No. Guide
-
How to Order
The Part No. Guide is for reference only. For real-time customization and exact part number, use the SiTime
Part Number Generator.
SiT8103AC -13-18E -105.12345T
Packaging
Part Family
“SiT8103”
Revision Letter
“A” is the revision
Temperature Range
“C” Commercial, -20 to 70ºC
“I” Industrial, -40 to 85ºC
Supply Voltage
Output Driver Strength
[6]
“–” Default
Package Size
“1” 2.5 x 2.0 mm
“2” 3.2 x 2.5 mm
“3” 5.0 x 3.2 mm
“4” 7.0 x 5.0 mm
“8” 7.0 x 5.0 mm
[7]
[8]
“T”: Tape & Reel, 3K reel
“Y”: Tape & Reel, 1K reel
Blank for Bulk
Frequency
1.00000 to 110.00000 MHz
Feature Pin
“E” for Output Enable
“S” for Standby
“18” for 1.8 V ±5%
“25” for 2.5 V ±10%
“28” for 2.8 V ±10%
“33” for 3.3 V ±10%
Frequency Stability
“1” for ±20 PPM
“2” for ±25 PPM
“3” for ±50 PPM
“8” for ±30 PPM
Notes:
6. Contact SiTime for different drive strength options for driving loads with faster rise/fall time spec than those shown in the electrical table, or reducing EMI.
7. Without Center Pad.
8. Supply voltage can be configured to any voltage up to 1 decimal place between 2.5V and 3.3V.
Product which is caused in whole or in part by (i) use of any circuitry other than circuitry embodied in a SiTime product, (ii) misuse or abuse including static discharge, neglect or accident, (iii)
unauthorized modification or repairs which have been soldered or altered during assembly and are not capable of being tested by SiTime under its normal test conditions, or (iv) improper
installation, storage, handling, warehousing or transportation, or (v) being subjected to unusual physical, thermal, or electrical stress.
Disclaimer:
SiTime makes no warranty of any kind, express or implied, with regard to this material, and specifically disclaims any and all express or implied warranties, either in fact or by
operation of law, statutory or otherwise, including the implied warranties of merchantability and fitness for use or a particular purpose, and any implied warranty arising from course of dealing or
usage of trade, as well as any common-law duties relating to accuracy or lack of negligence, with respect to this material, any sitime product and any product documentation. products sold by
sitme are not suitable or intended to be used in a life support application or component, to operate nuclear facilities, or in other mission critical applications where human life may be involved or
at stake. all sales are made conditioned upon compliance with the critical uses policy set forth below.
CRITICAL USE EXCLUSION POLICY
BUYER AGREES NOT TO USE SITIME'S PRODUCTS FOR ANY APPLICATION OR IN ANY COMPONENTS USED IN LIFE SUPPORT DEVICES OR TO OPERATE NUCLEAR FACILITIES
OR FOR USE IN OTHER MISSION-CRITICAL APPLICATIONS OR COMPONENTS WHERE HUMAN LIFE OR PROPERTY MAY BE AT STAKE.
SiTime owns all rights, title and interest to the intellectual property related to SiTime's products, including any software, firmware, copyright, patent, or trademark. The sale of SiTime products
does not convey or imply any license under patent or other rights. SiTime retains the copyright and trademark rights in all documents, catalogs and plans supplied pursuant to or ancillary to
the sale of products or services by SiTime. Unless otherwise agreed to in writing by SiTime, any reproduction, modification, translation, compilation, or representation of this material shall be
How many times can an SD card be written? Some say it can be written 500 times, and some say it can be written 100,000 times. The SD card in our mobile phone has been used for several years without an...
1. I am a computer science graduate who has been using VC++ to write programs. 2. I know nothing about circuits, but I know a little bit about Protel DXP. 3. I want to use a NEC microcontroller to mak...
[size=5][b][font=微软雅黑][color=RoyalBlue]Solution Overview: [/color][/font][/b][/size] [font=微软雅黑][b]· Application Value: [/b]Energy consumption is a universal problem facing the world, and many industr...
Source: Technology Golden Eye
This article is excerpted from the latest publication "China Science and Technology Hotspot Review 2019" (Science Press, July 2020). In order to avoid misinterpreting t...
[align=left][b][font=宋体][size=15pt]Making an SD card for the boot system[/font][/size][/font][/b][/align][align=left]Note: The purpose of making an SD card for booting is to enable the CPU[/font][font...
I use PB4.2. Every time I select our BSP and create a new project, there is a warning as follows (in bold). If I build PlatForm directly without adding any components, there will always be 3 errors. T...
As the whole equipment is constantly miniaturized and power-saving, low-power-consumption low-dropout linear regulators (LDO) are becoming the mainstream of the linear regulator market for switching p...[Details]
With the continuous improvement of living standards and the increase in the proportion of urban aging, the household use of medical electronic equipment has gradually become a trend. Among them, the...[Details]
At present, a hot spot for the research and development of hearing aids abroad is concentrated in China. To be more precise, it is based on the research of Chinese language and speech, and the deve...[Details]
In the field of software development, the most critical but also the most unpredictable phase is the debugging phase. There are many factors that play a role in the process of software debugging, a...[Details]
Today, various applications such as consumption, computers, industry and instruments urgently need compact and effective power solutions, while also meeting the requirements of efficiency, fast tra...[Details]
Power Integrations (PI) has introduced three charger/adapter reference designs using its new LinkSwitch-II series of AC-DC switching power conversion ICs. The new LinkSwitch-II devices use high-pre...[Details]
Introduction
High voltage power supply is an indispensable part of nuclear radiation detection instrument, which supplies high voltage to nuclear radiation detection devices (such as prop...[Details]
Abstract:
An amplifier solution for ceramic speaker systems is presented.
Keywords:
audio; ceramic speaker; amplifier; Class G
Today's portable devices require smaller, thinne...[Details]
0 Introduction
Implantable medical devices can be divided into two types: passive and active. Most passive implantable medical devices are non-electronic products, such as contact lenses, hear...[Details]
Abstract:
Online dynamic signature authentication is increasingly used in various fields, especially in banking and financial systems and personal identification. As the basis of online signa...[Details]
With the improvement of social automation, human-computer interaction capabilities urgently need a major change, and develop in a direction that is more convenient to use and more intuitive. Laser ...[Details]
Introduction
DFT (Discrete Fourier Transformation) is an important transformation tool for digital signal analysis and processing such as graphics, speech and images.
The amount of calcula...[Details]
With the rapid development of industrialization and urbanization, people's living environment is facing severe challenges due to the environmental damage caused by life and production. As an enviro...[Details]
Abstract: This article introduces several floorplanning techniques for sub-65nm chip partitioning. These techniques help us complete a practical floorplan in a relatively short time, including: ana...[Details]
MCU
京公网安备 11010802033920号
EEWORLD
