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346-99-133-41-013000

Description
IC u0026 Component Sockets Interconnect Socket
CategoryThe connector    socket   
File Size409KB,1 Pages
ManufacturerMill-Max
Websitehttps://www.mill-max.com
Download Datasheet Parametric View All

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346-99-133-41-013000 Overview

IC u0026 Component Sockets Interconnect Socket

346-99-133-41-013000 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresSIP SOCKET
Contact to complete cooperationTIN LEAD (200)
Contact completed and terminatedTin/Lead (Sn/Pb)
Contact materialNOT SPECIFIED
Device slot typeIC SOCKET
Type of equipment usedSIP33
Shell materialPOLYETHYLENE
JESD-609 codee0
Number of contacts33
Base Number Matches1
INTERCONNECTS
SERIES 304, 346 • .100” GRID SOLDERLESS PRESS
-
FIT •
SINGLE ROW STRIPS
Unique compliant tail pins conform to the
plated through-hole without stressing the
inner layers of a multilayer board
series: .036”-.041” use a 1,1mm drill prior to
plating. Using MM #0477 & #0478 pins. See
page 162 for details
.015-.025
.010 .018
Recommended plated through-hole for 304
.175
.102
.110
.150
.044 DIA.
.025 DIA.
.026
.072
.175
For 346 series: .040”+.003” nished plated
through-hole. Using MM #4612 & #4613 pins.
See page 162 for details. Patent No. 4,799,904
Hi-Rel, 4- nger BeCu #30 contact is rated at
3 amps. See page 253 for details
FIG. 1
.015-.025
.010 .018
Insulators are high temperature thermoplastic
ORDERING INFORMATION
Series 304...770
.175
.102
.110
.150
Solderless Press-Fit
For .062” Thick Boards
.044 DIA.
.025 DIA.
.026
.072
.250
FIG. 1
Series 304...780
304 XX 1_ _ 41 770000
Specify number of pins
01-64
Solderless Press-Fit
For .125” Thick Boards
FIG. 2
.015-.025
.010 * .018
.101
.110
.195
FIG. 2
304 XX 1_ _ 41 780000
Specify number of pins
01-64
.150
Mill-Max recommends plating Code 13 for Series 304...770 and 304...780
.173
Series 346...012
Compliant Solderless Press-Fit
346 XX 1_ _ 41 012000
.045 DIA.
.120
.035 DIA.
.018
SLOT
FIG. 3
For .060”-.100” Thick Boards
Specify number of pins
01-64
FIG. 3
.015-.025
.010 * .018
.101
.110
.195
Series 346...013
Compliant Solderless Press-Fit
PAGE 73 | INTERCONNECTS
346 XX 1_ _ 41 013000
FIG. 4
.173
For .090”-.130” Thick Boards
.150
Specify number of pins
RoHS - 2
01-64
For
Electrical, Mechanical
& Enviromental Data,
See page 264
.045 DIA.
.175
2011/65/EU
.035 DIA.
.018
SLOT
XX=Plating Code
See Below
11
10
µ”
Au
10
µ”
Au
SPECIFY PLATING CODE XX=
13
30
µ”
Au
91
10
µ”
Au
93
99
41
43
44
FIG. 4
Sleeve (Pin)
Contact (Clip)
10
µ”
Au
200
µ”
Sn/Pb 200
µ”
Sn/Pb 200
µ”
Sn/Pb
200
µ”
Sn 200
µ”
Sn 200
µ”
Sn
30
µ”
Au
100
µ”
Sn/Pb
10
µ”
Au
30
µ”
Au 100
µ”
Sn
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
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