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IDT71V30L35TFGI8

Description
Multi-Port SRAM, 1KX8, 35ns, CMOS, PQFP64
Categorystorage    storage   
File Size118KB,14 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
Download Datasheet Parametric Compare View All

IDT71V30L35TFGI8 Overview

Multi-Port SRAM, 1KX8, 35ns, CMOS, PQFP64

IDT71V30L35TFGI8 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
package instructionQFP, QFP64,.47SQ,20
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time35 ns
I/O typeCOMMON
JESD-30 codeS-PQFP-G64
JESD-609 codee3
memory density8192 bit
Memory IC TypeMULTI-PORT SRAM
memory width8
Humidity sensitivity level3
Number of ports2
Number of terminals64
word count1024 words
character code1000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP64,.47SQ,20
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
Minimum standby current3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
Base Number Matches1
HIGH-SPEED 3.3V
1K X 8 DUAL-PORT
STATIC RAM
Features
IDT71V30S/L
High-speed access
– Commercial: 25/35/55ns (max.)
Low-power operation
– IDT71V30S
Active: 375mW (typ.)
Standby: 5mW (typ.)
– IDT71V30L
Active: 375mW (typ.)
Standby: 1mW (typ.)
On-chip port arbitration logic
Interrupt flags for port-to-port communication
Fully asynchronous operation from either port
Battery backup operation, 2V data retention (L Only)
TTL-compatible, single 3.3V ±0.3V power supply
Industrial temperature range (-40
O
C to +85
O
C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
OE
L
CE
L
R/
W
L
OE
R
CE
R
R/
W
R
I/O
0L
- I/O
7L
I/O
Control
BUSY
L
(1)
I/O
0R
-I/O
7R
I/O
Control
BUSY
R
(1)
A
9L
A
0L
Address
Decoder
10
MEMORY
ARRAY
10
Address
Decoder
A
9R
A
0R
CE
L
OE
L
R/W
L
ARBITRATION
and
INTERRUPT
LOGIC
CE
R
OE
R
R/W
R
INT
L
(2)
INT
R
3741 drw 01
(2)
NOTES:
1. IDT71V30:
BUSY
outputs are non-tristatable push-pulls.
2.
INT
outputs are non-tristable push-pull output structure.
NOVEMBER 2009
1
©2009 Integrated Device Technology, Inc.
DSC 3741/10

IDT71V30L35TFGI8 Related Products

IDT71V30L35TFGI8 IDT71V30L35TFGI IDT71V30S55TFG8 IDT71V30S55TFG
Description Multi-Port SRAM, 1KX8, 35ns, CMOS, PQFP64 Multi-Port SRAM, 1KX8, 35ns, CMOS, PQFP64 Multi-Port SRAM, 1KX8, 55ns, CMOS, PQFP64 Dual-Port SRAM, 1KX8, 55ns, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, STQFP-64
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
package instruction QFP, QFP64,.47SQ,20 QFP, QFP64,.47SQ,20 QFP, QFP64,.47SQ,20 QFF, QFP64,.47SQ,20
Reach Compliance Code compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 35 ns 35 ns 55 ns 55 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-F64
JESD-609 code e3 e3 e3 e3
memory density 8192 bit 8192 bit 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM DUAL-PORT SRAM
memory width 8 8 8 8
Humidity sensitivity level 3 3 3 3
Number of ports 2 2 2 2
Number of terminals 64 64 64 64
word count 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C 70 °C
organize 1KX8 1KX8 1KX8 1KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP QFP QFF
Encapsulate equivalent code QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Minimum standby current 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING GULL WING FLAT
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 30 30 30
Base Number Matches 1 1 1 1
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