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BCM400P500T1K8A30

Description
Isolated DC/DC Converters 300VIN DCM DC/DC Converter 24VOUT600W
Categorysemiconductor    Power management   
File Size3MB,26 Pages
ManufacturerVICOR
Websitehttp://www.vicorpower.com/
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Isolated DC/DC Converters 300VIN DCM DC/DC Converter 24VOUT600W

BCM400P500T1K8A30 Parametric

Parameter NameAttribute value
Product CategoryIsolated DC/DC Converters
ManufacturerVICOR
RoHSDetails
Number of Outputs1 Output
Output Power1750 W
Input Voltage400 VDC
Output Voltage-Channel 150 V
Isolation Voltage4.242 kVDC
Mounting StyleThrough Hole
Length63.34 mm
Width22.8 mm
Height7.26 mm
Dimensions63.34 mm x 22.8 mm x 7.26 mm
Operating Temperature Range- 40 C to + 125 C
PackagingTray
Factory Pack Quantity1
Unit Weight1.446232 oz
BCM
®
Bus Converter
BCM400x500y1K8A3z
®
S
C
US
C
NRTL
US
Fixed Ratio DC-DC Converter
Features
Up to 1750 W continuous output power
2735 W/in
3
power density
98% peak efficiency
4,242 Vdc isolation
Parallel operation for multi-kW arrays
OV, OC, UV, short circuit and thermal protection
6123 through-hole ChiP package
Product Ratings
V
PRI
= 400 V (260 – 410 V)
V
SEC
= 50 V (32.5 – 51.3 V)
(
NO LOAD
)
P
SEC
= up to 1750 W
K = 1/8
Product Description
The VI Chip® Bus Converter (BCM®) is a high efficiency
Sine Amplitude Converter™ (SAC™), operating from a 260 to
410 VDC primary bus to deliver an isolated, ratiometric output
from 32.5 to 51.3 VDC.
The BCM400x500y1K8A3z offers low noise, fast transient
response, and industry leading efficiency and power density. In
addition, it provides an AC impedance beyond the bandwidth
of most downstream regulators, allowing input capacitance
normally located at the input of a POL regulator to be located at
the primary side of the BCM module. With a primary to
secondary K factor of 1/8, that capacitance value can be
reduced by a factor of 64x, resulting in savings of board area,
material and total system cost.
Leveraging the thermal and density benefits of Vicor’s ChiP
packaging technology, the BCM module offers flexible thermal
management options with very low top and bottom side
thermal impedances. Thermally-adept ChiP-based power
components, enable customers to achieve low cost power
system solutions with previously unattainable system size,
weight and efficiency attributes, quickly and predictably.
This product can operate in reverse direction, at full rated
power, after being previously started in forward direction.
n
2.494” x 0.898” x 0.286”
(63.34 mm x 22.80 mm x 7.26 mm)
Typical Applications
380 DC Power Distribution
High End Computing Systems
Automated Test Equipment
Industrial Systems
High Density Power Supplies
Communications Systems
Transportation
BCM
®
Bus Converter
Page 1 of 25
Rev 1.4
07/2015
vicorpower.com
800 927.9474

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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