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5962-8866906ZX

Description
FIFO, 2KX9, 20ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32
Categorystorage    storage   
File Size457KB,14 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric View All

5962-8866906ZX Overview

FIFO, 2KX9, 20ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32

5962-8866906ZX Parametric

Parameter NameAttribute value
Parts packaging codeQFJ
package instructionQCCN,
Contacts32
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time20 ns
Other featuresRETRANSMIT
period time30 ns
JESD-30 codeR-CQCC-N32
length13.97 mm
memory density18432 bit
memory width9
Number of functions1
Number of terminals32
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX9
ExportableNO
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusQualified
Filter levelMIL-STD-883
Maximum seat height3.048 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm
Base Number Matches1

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