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UE86-3G1420-00361

Description
Telecom and Datacom Connector
CategoryThe connector    The connector   
File Size318KB,2 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
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UE86-3G1420-00361 Overview

Telecom and Datacom Connector

UE86-3G1420-00361 Parametric

Parameter NameAttribute value
Objectid7099848259
Reach Compliance Codeunknown
ECCN codeEAR99
Samacsys ManufacturerAmphenol
Samacsys Modified On2018-09-10 13:56:45
Connector typeTELECOM AND DATACOM CONNECTOR
ExpressPort
TM
SFP+ 2xN
UE86-D2527-20321
Amphenol’s ExpressPort
TM
SFP+ 2xN Combo provides data transfer speeds of up to 25 Gbps per port.
ExpressPort
TM
SFP+ 2xN Combos consist of an integrated stacked connector system and a cage with
compliant press- t pins.
Amphenol’s unique ExpressPort
TM
SFP+ cage construction features EMI shielding available in the form of
an elastomeric gasket or metal spring ngers. These cages also eliminate ventilation holes near the front
of the cage to prevent potential catch points for the mating module EMI springs.
UE86-K8427-20321
UE86-D1427-10321
UE86-D4627-10321
Speci cation Highlights
The interconnect system is comprised of a 2-row stacked,
20-position, 0.8 mm pitch SFP+ connector and cage
assembly as one unit with all press- t construction.
General Characteristics
RoHS Compliant
Press-fit Cage and Connector Combo for min
1.57 +/- 10% mm (0.0625”) PCB Thickness
Industry Standard EIA-364
Mechanical Characteristics
Card Entry Slot Accepts 1.0 mm Thick
Integrated Circuit Cards
Durability: 250 Mating Cycles min
Electrical Characteristics
Hot Swappable
Operating Voltage: 3.3 V
Operating Current: 0.5 A
Differential Impedance: 100 Ω +/- 10 Ω
DWV: 300 V AC
Insulation Resistance: 1000 MΩ min
Contact Resistance: 70 mΩ max
Packaging
Tray Packaging: Cage and Connector
Assembly
Bulk Packaging: Dust Cover
Materials
Cage
o
Base Material: Copper Alloy
o
Plating: Nickel or Tin
o
Light Pipe: Optical Grade Polycarbonate
o
Dust Cover: Thermoplastic
Connector
o
Contact Base Material: Copper Alloy
o
Contact Plating: Gold on Mating Area,
Matte Tin on Termination
o
Housings: Glass Reinforced, Lead-Free Solder
Reflow Process Compatible Thermoplastic,
UL94V-0 Rated
Temperature Rating
Operating Temperature: -55°C to +85°C
Storage Temperature: -55°C to +105°C
Con gurations
(Rows x Ports per Row)
2x1
2x2
2x4
2x5
2x6
2x8
Options
Dust Cover
Light Pipe
o
4 Light Pipes per 2x1
o
2 Inner Light Pipes per 2x1
o
2 Outer Light Pipes per 2x1
EMI Shielding
o
Metal Spring Fingers
o
Conductive Elastomeric Gasket
6

UE86-3G1420-00361 Related Products

UE86-3G1420-00361 UE76A203010T UE76-3GA20-3600T UE76A203000T UE86-3G1420-10361
Description Telecom and Datacom Connector Clock Generators u0026 Support Products Clock Generator 4-output 1GHz I/O Connectors Connector I/O Connectors SFP PLUS 30 GOLD MATTE TIN TAILS Telecom and Datacom Connector
Product Category - I/O Connectors I/O Connectors I/O Connectors -
Manufacturer - Amphenol Amphenol Amphenol -
RoHS - Details Details Details -
Product - SFP Connectors SFP+ Connectors SFP Connectors -
Gender - Female Female Female -
Number of Positions - 20 Position 20 Position 20 Position -
Contact Plating - Gold Gold Gold -
Mounting Style - Panel Panel Panel -
Termination Style - SMD SMD SMD -
Mounting Angle - Right Right Angle Right -
Packaging - Tray Reel Reel -
Contact Material - Phosphor Bronze Phosphor Bronze Phosphor Bronze -
Flammability Rating - UL 94 V-0 UL 94 V-0 UL 94 V-0 -
Housing Material - Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP) -
Factory Pack Quantity - 500 500 500 -

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