1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance
λd
: ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
ABSOLUTE MAXIMUM RATINGS at T
A
=25°C
Parameter
Power Dissipation
Reverse Voltage
Junction Temperature
Operating Temperature
Storage Temperature
DC Forward Current
Peak Forward Current
Electrostatic Discharge Threshold (HBM)
Symbol
P
D
V
R
T
j
T
op
T
stg
I
F
I
FM [1]
Value
75
5
115
-40 to +85
-40 to +85
30
185
3000
Unit
mW
V
°C
°C
°C
mA
mA
V
-
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is
more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone
encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the
side surfaces by using forceps or
appropriate tools.
2. Do not directly touch or handle the silicone lens
surface. It may damage the internal circuitry.
3. Do not stack together assembled
PCBs containing exposed LEDs.
Impact may scratch the silicone lens
or damage the internal circuitry.
4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure
precise pickup and avoid damage during production.
5.
As silicone encapsulation is permeable to gases, some corrosive substances such as H
2
S might corrode silver
plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such
substances.
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at
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