Data Sheet
FEATURES
Dual-mode inclinometer system
Dual-axis, horizontal operation, ±90°
Single-axis, vertical operation, ±180°
High accuracy, 0.1°
Digital inclination data, 0.025° resolution
Digital acceleration data, 0.244 mg resolution
±1.7
g
accelerometer measurement range
Digital temperature sensor output
Digitally controlled bias calibration
Digitally controlled sample rate
Digitally controlled frequency response
Dual alarm settings with rate/threshold limits
Auxiliary digital I/O
Digitally activated self-test
Digitally activated low power mode
SPI-compatible serial interface
Auxiliary 12-bit ADC input and DAC output
Single-supply operation: 3.0 V to 3.6 V
3500
g
powered shock survivability
High Accuracy, Dual-Axis
Digital Inclinometer and Accelerometer
ADIS16209
FUNCTIONAL BLOCK DIAGRAM
AUX
ADC
AUX
DAC VREF
ADIS16209
TEMPERATURE
SENSOR
DUAL-AXIS
ACCELEROMETER
SIGNAL
CONDITIONING
AND
CONVERSION
CALIBRATION
AND
DIGITAL
PROCESSING
CS
SCLK
SPI
PORT
DIN
SELF-TEST
DIGITAL
CONTROL
DOUT
VDD
POWER
MANAGEMENT
ALARMS
AUXILIARY
I/O
GND
07096-001
RST
DIO1 DIO2
Figure 1.
APPLICATIONS
Platform control, stabilization, and alignment
Tilt sensing, inclinometers, leveling
Motion/position measurement
Monitor/alarm devices (security, medical, safety)
Navigation
GENERAL DESCRIPTION
The
ADIS16209
is a high accuracy, digital inclinometer that
accommodates both single-axis (±180°) and dual-axis (±90°)
operation. The standard supply voltage (3.3 V) and serial
peripheral interface (SPI) enable simple integration into most
industrial system designs. A simple internal register structure
handles all output data and configuration features. This
includes access to the following output data: calibrated
acceleration, accurate incline angles, power supply, internal
temperature, auxiliary analog and digital input signals,
diagnostic error flags, and programmable alarm conditions.
Configurable operating parameters include sample rate,
power management, digital filtering, auxiliary analog and
digital output, offset/null adjustment, and self-test for sensor
mechanical structure.
The
ADIS16209
is available in a 9.2 mm × 9.2 mm × 3.9 mm
LGA package that operates over a temperature range of −40°C
to +125°C. It can be attached using standard RoHS-compliant
solder reflow processes.
Rev. H
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ADIS16209
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 4
Timing Specifications .................................................................. 6
Timing Diagrams.......................................................................... 6
Absolute Maximum Ratings ............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution .................................................................................. 7
Pin Configuration and Function Descriptions ............................. 8
Recommended Pad Geometry.................................................... 8
Typical Performance Characteristics ............................................. 9
Theory of Operation ...................................................................... 11
Basic Operation............................................................................... 12
Data Sheet
Introduction ................................................................................ 12
Register Structure ....................................................................... 12
SPI................................................................................................. 12
Reading Sensor Data .................................................................. 12
Device Configuration ................................................................ 12
Output Data Registers................................................................ 15
Operation Control Registers ..................................................... 17
Calibration Registers .................................................................. 20
Alarm Registers .......................................................................... 20
Applications Information .............................................................. 22
Power Supply Considerations ................................................... 22
Assembly...................................................................................... 22
Interface Board ........................................................................... 23
X-Ray Sensitivity ........................................................................ 23
Outline Dimensions ....................................................................... 24
Ordering Guide .......................................................................... 24
REVISION HISTORY
3/2019—Rev. G to Rev. H
Added Endnote 1, Table 1; Renumbered Sequentially ................ 5
Deleted Figure 20; Renumbered Sequentially............................. 11
Changes to Basic Operation Section ............................................ 12
Added Introduction Section, Register Structure Section,
Figure 20, SPI Section, Figure 21, Reading Sensor Data Section,
Figure 22, Figure 23, and Device Configuration Section .......... 12
Added Table 6 and Table 7; Renumbered Sequentially ............. 12
Added Figure 24, Memory Structure Section, Figure 25, and
Figure 26 .......................................................................................... 13
Moved Table 8 ................................................................................. 14
Changes to Global Commands Section ....................................... 19
Change to the Power Supply Considerations Section................ 22
Added X-Ray Sensitivity Section .................................................. 23
Changes to Ordering Guide .......................................................... 24
8/2018—Rev. F to Rev. G
Change to Note 5, Table 1 ................................................................ 4
Changes to Accelerometers Section ............................................. 12
Change to Digital Filtering Section .............................................. 14
Changes to Global Commands Section ....................................... 16
Changes to Assembly Section ....................................................... 19
Added Figure 23; Renumbered Sequentially .............................. 19
5/2017—Rev. E to Rev. F
Changes to Figure 3 and Figure 4 ....................................................5
Change to Basic Operation Section ............................................. 11
1/2015—Rev. D to Rev. E
Changes to Power Supply Considerations Section and
Assembly Section ............................................................................ 19
Deleted VDD Ramp Rate Requirements Section and Transient
Current Demand from ADIS16209 Section ............................... 19
Added Power-On Reset Function Section .................................. 19
Changes to Figure 23...................................................................... 20
6/2014—Rev. C to Rev. D
Changes to Table 2.............................................................................5
Changes to Table 26 and Self-Test Section .................................. 15
Changes to Status Section.............................................................. 18
Added Power Supply Considerations Section ............................ 19
7/2012—Rev. B to Rev. C
Changes to Endnote 5 in Table 1 .....................................................4
Changed Digital Input/Output Voltage to GND Maximum
Rating from 5.5 V to 5.3 V ...............................................................6
Added 0x40 to 0x49 and 0x4A Addresses to Table 6 ................. 11
Changes to Output Data Registers Section ................................ 12
Changes to Digital Filtering Section ............................................ 14
Changes to Self-Test Section ......................................................... 15
Added Applications Information Section ................................... 18
Updated Outline Dimensions ....................................................... 19
Rev. H | Page 2 of 24
Data Sheet
8/2009—Rev. A to Rev. B
Changes to Features Section ............................................................ 1
Changes to Input Low Voltage, VINL, Parameter, Table 1 .......... 4
Changes to Figure 18 and Figure 19 .............................................10
Changes to Table 7, Table 8, and Table 10 ....................................12
Updated Outline Dimensions ........................................................16
Changes to Ordering Guide ...........................................................16
ADIS16209
7/2008—Rev. 0 to Rev. A
Changes to Figure 19 ...................................................................... 10
Changes to Table 21 ........................................................................ 15
3/2008—Revision 0: Initial Version
Rev. H | Page 3 of 24
ADIS16209
SPECIFICATIONS
T
A
= 25°C, VDD = 3.3 V, tilt = 0°, unless otherwise noted.
Table 1.
Parameter
HORIZONTAL INCLINE
Input Range
Relative Accuracy
1
Sensitivity
VERTICAL ROTATION
Input Range
Relative Accuracy
Sensitivity
ACCELEROMETER
Input Range
2
Nonlinearity
2
Alignment Error
Cross Axis Sensitivity
Sensitivity
ACCELEROMETER NOISE PERFORMANCE
Output Noise
Noise Density
ACCELEROMETER FREQUENCY RESPONSE
Sensor Bandwidth
Sensor Resonant Frequency
ACCELEROMETER SELF-TEST STATE
3
Output Change When Active
TEMPERATURE SENSOR
Output at 25°C
Scale Factor
ADC INPUT
Resolution
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
Offset Error
Gain Error
Input Range
Input Capacitance
ON-CHIP VOLTAGE REFERENCE
Accuracy
Reference Temperature Coefficient
Output Impedance
DAC OUTPUT
Resolution
Relative Accuracy
Differential Nonlinearity
Offset Error
Gain Error
Output Range
Output Impedance
Output Settling Time
Test Conditions
Each axis
±30° from horizon, AVG_CNT = 0x08
±30° from horizon
Rotational plane within ±30° of vertical
−180
360° of rotation
−40°C to +85°C
Each axis
25°C
Percentage of full scale
X sensor to Y sensor
−40°C to +85°C, VDD = 3.0 V to 3.6 V
AVG_CNT = 0x00
AVG_CNT = 0x00
±0.25
0.025
±1.7
±0.1
±0.1
±2
0.244
1.7
0.19
50
5.5
At 25°C
706
1343
1278
−0.47
12
±2
±1
±4
±2
0
During acquisition
At 25°C
−10
±40
70
5 kΩ/100 pF to GND
For Code 101 to Code 4095
12
4
1
±5
±0.5
0 to 2.5
2
10
20
2.5
+10
2.5
1973
±0.2
Min
Typ
±90
±0.1
0.025
+180
Max
Data Sheet
Unit
Degrees
Degrees
°/LSB
Degrees
Degrees
°/LSB
g
%
Degrees
%
mg/LSB
mg rms
mg/√Hz rms
Hz
kHz
LSB
LSB
°C/LSB
Bits
LSB
LSB
LSB
LSB
V
pF
V
mV
ppm/°C
Ω
Bits
LSB
LSB
mV
%
V
Ω
µs
0.243
0.245
Rev. H | Page 4 of 24
Data Sheet
Parameter
LOGIC INPUTS
Input High Voltage, V
INH
Input Low Voltage, V
INL
Logic 1 Input High Current, I
INH
Logic 0 Input Low Current, I
INL
All Except RST
RST
4
Input Capacitance, C
IN
DIGITAL OUTPUTS
Output High Voltage, V
OH
Output Low Voltage, V
OL
SLEEP TIMER
Timeout Period
5
START-UP TIME
6
Power-On
Reset Recovery
Sleep Mode Recovery
FLASH MEMORY
Endurance
7
Data Retention
8
CONVERSION RATE SETTING
POWER SUPPLY
Operating Voltage Range
Power Supply Current
Test Conditions
Min
2.0
V
IH
= 3.3 V
V
IL
= 0 V
±0.2
−40
−1
10
I
SOURCE
= 1.6 mA
I
SINK
= 1.6 mA
2.4
0.4
0.5
Time until data is available
Fast mode, SMPL_PRD ≤ 0x07
Normal mode, SMPL_PRD ≥ 0x08
Fast mode, SMPL_PRD ≤ 0x07
Normal mode, SMPL_PRD ≥ 0x08
150
190
30
70
2.5
20,000
20
1.04
3.0
Normal mode, SMPL_PRD ≥ 0x08
Fast mode, SMPL_PRD ≤ 0x07
Sleep mode, −40°C to +85°C
3.3
11
36
140
128
0.8
±10
−60
Typ
Max
ADIS16209
Unit
V
V
µA
μA
mA
pF
V
V
Seconds
ms
ms
ms
ms
ms
Cycles
Years
SPS
V
mA
mA
µA
T
J
= 85°C
2731
3.6
14
42
350
X-ray exposure may degrade this performance metric.
Guaranteed by
iMEMS®
packaged part testing, design, and/or characterization.
3
Self-test response changes as the square of VDD.
4
The RST pin has an internal pull-up.
5
Guaranteed by design.
6
The times presented in this section represent the time it takes to start producing data in the output registers, after the minimum VDD reaches 3.0 V. They do not
represent the settling time of the internal filters.
Note that for the default SENS_AVG and AVG_CNT settings, the typical settling time is ~1.28 seconds. For faster settling times, reduce the AVG_CNT and SMPL_PRD
settings. Note that the trade-off associated with faster settling times is noise and power.
7
Endurance is qualified as per JEDEC Standard 22 Method A117 and measured at −40°C, +25°C, +85°C, and +125°C.
8
Retention lifetime equivalent at junction temperature (T
J
) 55°C as per JEDEC Standard 22 Method A117. Retention lifetime decreases with junction temperature.
1
2
Rev. H | Page 5 of 24
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