• continuous short circuit, over current protection
• six-sided shielded case
• high vibration tolerance
• rapid dynamic response
• temperature range (-40~85°C)
• high efficiency at light load
• efficiency up to 86%
MODEL
typ
(Vdc)
input
voltage
range
(Vdc)
output
voltage
(Vdc)
min
(mA)
output
current
max
(mA)
output
power
max
(W)
ripple
and noise
1
max
(mVp-p)
efficiency
typ
(%)
PQZ6-Q24-S3-D
PQZ6-Q24-S5-D
PQZ6-Q24-S12-D
PQZ6-Q24-S15-D
PQZ6-Q24-D5-D
PQZ6-Q24-D12-D
PQZ6-Q24-D15-D
PQZ6-Q48-S3-D
PQZ6-Q48-S5-D
PQZ6-Q48-S12-D
PQZ6-Q48-S15-D
PQZ6-Q48-D5-D
PQZ6-Q48-D12-D
PQZ6-Q48-D15-D
Notes:
24
24
24
24
24
24
24
48
48
48
48
48
48
48
9~36
9~36
9~36
9~36
9~36
9~36
9~36
18~75
18~75
18~75
18~75
18~75
18~75
18~75
3.3
5
12
15
±5
±12
±15
3.3
5
12
15
±5
±12
±15
75
60
25
20
±30
±12
±10
75
60
25
20
±30
±12
±10
1500
1200
500
400
±600
±250
±200
1500
1200
500
400
±600
±250
±200
5
6
6
6
6
6
6
5
6
6
6
6
6
6
80
80
100
100
80
100
100
80
80
100
100
80
100
100
79
83
87
88
83
87
87
80
84
87
88
83
87
88
1. ripple and noise are measured at 20 MHz BW by “parallel cable” method
PART NUMBER KEY
PQZ6 - QXX -
XXX
-D
Base Number
Input Voltage
Output
S = single
D = dual
Output Voltage
Packaging Style
DIP
cui.com
For more information, please visit the
product page.
CUI Inc
│
SERIES:
PQZ6-D
│
DESCRIPTION:
DC-DC CONVERTER
date
06/05/2013
│
page
2 of 6
INPUT
parameter
operating input voltage
start-up voltage
surge voltage
fi
lter
conditions/description
24 V input models
48 V input models
24 V input models
48 V input models
for maximum of 1 second
24 V input models
48 V input models
pi
fi
lter
-0.7
-0.7
min
9
18
typ
24
48
max
36
75
9
18
50
100
units
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
OUTPUT
parameter
line regulation
load regulation
cross regulation
voltage accuracy
voltage balance
switching frequency
transient recovery time
transient response deviation
temperature coeffecient
conditions/description
full load, input voltage from low to high
5% to 100% load
dual output
main output 50% load, supplement output from
10%-100% load
5% to 100% load
dual output, balanced loads
dual output, unbalanced loads
5% to 100% load
25% load step change
25% load step change
100% load
±1
±0.5
300
300
±3
500
±5
±0.03
min
typ
±0.2
±0.5
max
±0.5
±1
±5
±2
±1.5
±5
units
%
%
%
%
%
%
KHz
μs
%
%/°C
PROTECTIONS
parameter
short circuit protection
over voltage protection
conditions/description
continuous, automatic recovery
110
140
%Vo
min
typ
max
units
SAFETY AND COMPLIANCE
parameter
isolation voltage
isolation resistance
isolation capacitance
conducted emissions
radiated emissions
ESD
radiated immunity
EFT/burst
surge
conducted immunity
voltage dips & interruptions
MTBF
RoHS compliant
conditions/description
for 1 minute at 1 mA max.
at 500 Vdc
input to output, 100 KHz/0.1 V
min
1,500
1,000
1,000
typ
max
units
Vdc
MΩ
pF
CISPR22/EN55022, class A, class B (external circuit required, see Figure 1-b)
CISPR22/EN55022, class A, class B (external circuit required, see Figure 1-b)
IEC/EN61000-4-2, class B, contact ± 4kV
IEC/EN61000-4-3, class A, 10V/m
IEC/EN61000-4-4, class B, ± 2kV (external circuit required, see Figure 1-a)
IEC/EN61000-4-5, class B, ± 2kV (external circuit required, see Figure 1-a)
IEC/EN61000-4-6, class A, 3 Vr.m.s
IEC/EN61000-4-29, class B, 0%-70%
as per MIL-HDBK-217F @ 25°C
yes
1,000,000
hours
cui.com
For more information, please visit the
product page.
CUI Inc
│
SERIES:
PQZ6-D
│
DESCRIPTION:
DC-DC CONVERTER
date
06/05/2013
│
page
3 of 6
ENVIRONMENTAL
parameter
operating temperature
storage temperature
storage humidity
temperature rise
non-condensing
at full load, Ta=25°C
conditions/description
see derating curve
min
-40
-55
5
25
typ
max
105
125
95
units
°C
°C
%
°C
SOLDERABILITY
parameter
hand soldering
wave soldering
conditions/description
1.5 mm from case for 10 seconds
see wave soldering profile
min
typ
max
300
260
units
°C
°C
MECHANICAL
parameter
dimensions
case material
weight
conditions/description
32.00 x 20.00 x 10.80 (1.260 x 0.787 x 0.425 inch)
aluminum alloy
14
g
min
typ
max
units
mm
MECHANICAL DRAWING
units: mm[inch]
tolerance: ±0.25[±0.010]
pin diameter tolerance: ±0.10[±0.004]
Grid Size:
2.54mm x 2.54mm
∅
Front View
PCB Layout
Top View
PIN CONNECTIONS
PIN
2
3
9
11
14
16
22
23
Single Output
GND
GND
NO PIN
NC
+Vo
0V
Vin
Vin
Dual Output
GND
GND
0V
-Vo
+Vo
0V
Vin
Vin
∅
Bottom View
cui.com
For more information, please visit the
product page.
CUI Inc
│
SERIES:
PQZ6-D
│
DESCRIPTION:
DC-DC CONVERTER
date
06/05/2013
│
page
4 of 6
DERATING CURVES
Wave Soldering Profile
Peak Temp. 260°C Max.
250
Wave Soldering Time
4 Sec. Max.
Temperature Derating Curve
100
80
60
200
Temperature (°C)
10 Sec. Max.
150
Load (%)
Safe operating area
40
20
100
50
0
Time (sec.)
-40
-20
0
20
40
60 71
85
100
Ambient Temperature (°C)
EMC RECOMMENDED CIRCUIT
FUSE
V in
LDM1
LDM2
CY2
Vin
+
MOV
GND
TVS
C0
C1
+Vo
Figure 1
EUT
GND
LOAD
(a)
(b)
CY1
-Vo
(0V)
Recommended external circuit components
Vin (Vdc)
FUSE
MOV
LDM1
TVS
C0
C1
LDM2
CY1
CY2
24
10D560K
56μH
SMCJ48A
120μF/50V
1μF/50V
4.7μH
1nF/2000V
1nF/2000V
48
10D101K
56μH
SMCJ90A
120μF/100V
1μF/100V
4.7μH
1nF/2000V
1nF/2000V
choose according to practical input current
TEST CONFIGURATION
Oscilloscope
Lin
Cin
Current
Probe
External components
Lin
4.7μH
220μF, ESR < 1.0Ω
at 100 KHz
DC DC
Load
Cin
Note: Input reflected-ripple current is measured with an inductor Lin and Capacitor Cin to simulate source impedance.
cui.com
For more information, please visit the
product page.
CUI Inc
│
SERIES:
PQZ6-D
│
DESCRIPTION:
DC-DC CONVERTER
date
06/05/2013
│
page
5 of 6
APPLICATION NOTES
1.
Recommended circuit
This series has been tested according to the following recommended testing circuit before leaving the factory. This series should be
tested under load (see Figure 2). If you want to further decrease the input/output ripple, you can increase the capacitance accordingly
or choose capacitors with low ESR. However, the capacitance of the output
fi
lter capacitor must be appropriate. If the capacitance is
too high, a startup problem might arise. For every channel of the output, to ensure safe and reliable operation, the maximum capaci-
tance must be less than the maximum capacitive load (see table 1).
Single Output
Dual Output
Vin
Cin
+Vo
Vin
Cin
+Vo
DC
DC
0V
Figure 2
DC
DC
0V
-Vo
GND
GND
Table 1
Vin
(V)
12
24
48
Cin
(μF)
100
10~47
10~47
Cout
(μF)
10
10
10
Note:
1. Minimum load shouldn't be less than 5%, otherwise ripple may increase dramatically. Operation under minimum load will not damage the converter, however, they may
not meet all specifications listed.
2. Maximum capacitive load is tested at input voltage range and full load.
3. All specifications are measured at Ta=25°C, humidity<75%, nominal input voltage and rated output load unless otherwise specified.
The USB chip used is Cypress's Cy68013a, and the driver is also provided by Cypress, ezusb.sys, and ezusbw2k.inf files. The driver can be installed on most machines, but it cannot be installed on a fe...
[font=宋体] The new year is coming, and EEWORLD[font=宋体] community activities are also constantly updated. As a regular selection activity of our community - the monthly community celebrity selection, i...
[i=s]This post was last edited by IC Crawler on 2022-7-5 00:07[/i]The schematic design of the OpenMV module based on ESP32S3 has been initially completed.
Functional modules: camera, silicon microphon...
[i=s]This post was last edited by paulhyde on 2014-9-15 03:27[/i] I see that everyone is very enthusiastic about the car... Let me share another one[align=center][color=#000000][font=黑体][size=16pt]Abs...
/***********************************************Program description: P3.4 and P3.5 of the MCU are used as serial ports to receive characters and send out the received characters* and light up LED1, LE...
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
A single-chip microcomputer is also called a single-chip microcontroller. It is not a chip that completes a certain logical function, but a computer system integrated into one chip. In general, a c...[Details]
With the rapid development of science and technology, especially the widespread application of digital technology and various ultra-large-scale integrated circuits, electronic equipment, especially...[Details]
In
circuit design,
current
measurement
is widely used, and the main fields are divided into three categories: in measurement,
the electric meter
is used to measure the curre...[Details]
1. Introduction
Since the 1980s, with the continuous development of automotive electronic technology, there are more and more electronic control units in automobiles, such as electronic fuel i...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
The automotive lighting and signal control system is responsible for controlling the vehicle's lighting, signal lights, electric horns, reversing and brake buzzers. Traditional automotive lighting...[Details]
The typical fault troubleshooting listed below is for reference of maintenance personnel.
When the computer is turned on, the indicator light is off and there is no screen display
Mainte...[Details]
introduction
MAX6636 is a multi-channel precision temperature monitor that can not only monitor local temperature, but also connect up to 6 diodes externally. Each channel has a programmable...[Details]
This article will introduce a design method for a distributed control system used in a tracking car, which can perform distributed control of motor modules, sensor modules, and lighting control mod...[Details]
Introduction
Nowadays, people pay more and more attention to the security alarm system, and people have higher and higher requirements for the functions and performance of the alarm. This paper prop...[Details]
0 Introduction
There are many types of sensors, and the working principles, measurement targets and measurement environments of different types of sensors vary greatly. The corresponding detection s...[Details]
The demand for improved healthcare environments is endless, so medical imaging equipment with higher resolution is needed to better observe the human body. High resolution brings problems with sign...[Details]
Battery clamps, commonly known as battery connectors, come in two sizes depending on the thickness of the battery terminals. One is the battery clamp used on thick terminals, with a positive termin...[Details]
The production process of lithium batteries does not mention the previous processes such as material preparation, winding, liquid injection, and packaging, but only talks about the final formation ...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
