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FCN-268F036-G-0D

Description
Development Boards u0026 Kits - ARM STEMlab 125-14 Starter Kit
CategoryThe connector   
File Size2MB,16 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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FCN-268F036-G-0D Overview

Development Boards u0026 Kits - ARM STEMlab 125-14 Starter Kit

FCN-268F036-G-0D Parametric

Parameter NameAttribute value
Product CategoryBoard to Board & Mezzanine Connectors
ManufacturerFUJITSU
RoHSDetails
ProductReceptacles
Number of Positions72 Position
Pitch1.5 mm
Number of Rows2 Row
Termination StyleSMD
Mounting AngleVertical
Current Rating500 mA
Voltage Rating30 V
PackagingBulk
Contact MaterialCopper Alloy
Contact PlatingGold
Housing MaterialLiquid Crystal Polymer (LCP)
Factory Pack Quantity40
Differential COnneCtOr
fCn-260(D) Series
roHS Compliant
microGiGaCn
TM
Stacking Connector
n
featureS
• High speed matched impedance (100Ω) differential
signal connector
• Low cross talk
• 2-step sequential mating of contacts
• Self alignment feature
• Hot plugable
• RoHS compliant
n
SpeCifiCatiOnS
It em
Sp ec i f i c at i o n s
-55˚ C to +105˚ C
AC 0.1A (signal)
AC 0.5 A (ground)
AC 30 V
80m ohms max. (signal)
40m ohms max.(ground)
1000Mohms minimu m
AC 500V for 1 minute
100 cycle s
50 N maximum (24 pair )
5 N minimum (24 pair )
Operating temperature
range
Current rating
Voltage rating
Contact resistance
Insulation resistance
Dielectric withstanding
voltage
Durability
Insertion force
Withdrawl force
fujitsu's fCn-260(D)
Differential Signal Connector
As network speeds increase, designers
are moving to differential interconnects
for network switches and hubs, as well
as for connections between components
in high-speed computer clusters,
video systems, test equipment, and
real-time medical equipment (MRI,
etc.). Conventional connectors do not
support the speed and signal integrity
requirements of these applications. By
implementing a connector specifically
for high-speed, high-density, board-to-
board differential applications, designers
can take advantage of a differential
interconnect instead of more costly fiber
optic or coax alternatives.
Differential signals use two conductors
to carry signals that are compliments of
one another. This arrangement reduces
noise effects because any noise
introduced by interference or crosstalk
appears in both signals (common-mode
noise) and is ignored by differential
http://us.fujitsu.com/components

n
MaterialS
It em
Insulator
Conductor
Plating
Specifications
subject to change
Mat er i al s
LCP Resin (UL94V-0 )
Copper Allo y
Contact: Au Plating (PAGOS)
Au over Pd-Ni plating
Dimensions are in millimeters (inches)

FCN-268F036-G-0D Related Products

FCN-268F036-G-0D FCN-268M012-G-2D FCN-268M036-G-0D
Description Development Boards u0026 Kits - ARM STEMlab 125-14 Starter Kit Bluetooth / 802.15.1 Modules BLE USB Dongle 4.0 single mode
Product Category Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors
Manufacturer FUJITSU FUJITSU FUJITSU
RoHS Details Details Details
Product Receptacles Plugs Plugs
Number of Positions 72 Position 24 Position 72 Position
Pitch 1.5 mm 1.5 mm 1.5 mm
Number of Rows 2 Row 2 Row 2 Row
Termination Style SMD SMD SMD
Mounting Angle Vertical Vertical Vertical
Current Rating 500 mA 500 mA 500 mA
Voltage Rating 30 V 30 V 30 V
Packaging Bulk Tray Tray
Contact Material Copper Alloy Copper Alloy Copper Alloy
Contact Plating Gold Gold Gold
Housing Material Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP)
Factory Pack Quantity 40 60 40
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