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XQDAWT-00-0000-00000HF51

CategoryLED optoelectronic/LED   
File Size1013KB,12 Pages
ManufacturerCree
Websitehttp://www.cree.com/
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XQDAWT-00-0000-00000HF51 Parametric

Parameter NameAttribute value
Product CategoryHigh Power LEDs - White
ManufacturerCree
RoHSDetails
Package / CaseSMD-2
Illumination ColorWhite (Cool White)
Wavelength/Color Temperature6200 K
Luminous Intensity-
Luminous Flux/Radiant Flux122 lm
Color Rendering Index - CRI80
Viewing Angle145 deg
Lens Color/StyleTinted
If - Forward Current350 mA
Vf - Forward Voltage3.1 V
Power Rating2.3 W
Mounting StyleSMD/SMT
Length1.6 mm
Width1.6 mm
Height1.44 mm
Maximum Operating Temperature-
Minimum Operating Temperature-
PackagingReel
Color Temperature6200 K
Features-
LED Size1.6 mm x 1.6 mm x 1.44 mm
Lens Dimensions1.41 mm x 1.41 mm
Lens ShapeSquare
Factory Pack Quantity2000
TypeXLamp XQ-D LEDs
Vr - Reverse Voltage5 V
Unit Weight0.001764 oz
CLD-DS52 Rev 3I
Product family data sheet
Cree
®
XLamp
®
XQ-D LED
PRODUCT DESCRIPTION
Cree XLamp
®
XQ-D LeDs revolutionize
low-cost, high-power LeDs by delivering
lighting-class reliability and a wider
spread of light than typical plastic
packages.
The
XQ-D’s
innovative
wide light emission can improve the
omnidirectionality of replacement lamps,
while also reducing system cost by using
fewer LeDs.
Using Cree’s newest generation of
silicon carbide-based LeD chips, XQ-D is
optimized to dramatically lower system
cost in replacement lamp, non-directional
and outdoor area lighting applications.
FEATURES
Cree’s smallest lighting class LeD:
1.6 X 1.6 X 1.6 mm
Available in white, 80-minimum CRI
white, and 70-minimum CRI cool
white
• Binned at 25 °C
• 700 mA maximum drive current
• Low thermal resistance: 7.5 °C/W
• Wide viewing angle: 145°
• Reflow solderable - JEDEC
J-STD-020C compatible
• Unlimited floor life at ≤ 30 °C/85% RH
• RoHS and REACh compliant
UL
®
recognized component
(E349212)
TAbLE OF CONTENTS
Characteristics ....................................... 2
Flux Characteristics
............................... 3
Relative Spectral Power Distribution ....
4
Relative Flux vs. Junction
Temperature ...........................................
4
electrical Characteristics ....................... 5
Relative Flux vs. Current
........................ 5
Typical Spatial Distribution.................... 6
Thermal Design ...................................... 6
Reflow Soldering Characteristics
.......... 7
Notes ...................................................... 8
Mechanical Dimensions ...................... 10
Tape and Reel ....................................... 11
Packaging ............................................. 12
www.CRee.Com/XLAmp
Copyright © 2013-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
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