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MX3AWT-A1-0000-0008F7

Description
Thermal Substrates - MCPCB 1-UP INDV STAR CREE MX-6
CategoryLED optoelectronic/LED   
File Size1MB,11 Pages
ManufacturerCree
Websitehttp://www.cree.com/
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Thermal Substrates - MCPCB 1-UP INDV STAR CREE MX-6

MX3AWT-A1-0000-0008F7 Parametric

Parameter NameAttribute value
Product CategoryHigh Power LEDs - White
ManufacturerCree
RoHSDetails
Package / CasePLCC-2
Illumination ColorWhite (Warm White)
Wavelength/Color Temperature3200 K
Luminous Intensity-
Luminous Flux/Radiant Flux73.9 lm
Color Rendering Index - CRI80
Viewing Angle120 deg
Lens Color/StyleTinted, Clear
If - Forward Current350 mA
Vf - Forward Voltage3.7 V
Power Rating2 W
Mounting StyleSMD/SMT
Length5 mm
Width5 mm
Height1.35 mm
Maximum Operating Temperature-
Minimum Operating Temperature-
PackagingReel
Color Temperature3200 K
Features-
LED Size5 mm x 5 mm x 1.35 mm
Lens Dimensions4.65 mm x 4.65 mm
Lens ShapeSquare
Factory Pack Quantity1400
TypeXLamp MX-3 LEDs
Vr - Reverse Voltage5 V
Unit Weight0.007055 oz
CLD-DS28 Rev 6G
Product family data sheet
Cree
®
XLamp
®
MX-3 LEDs
ProDuCt DEsCriPtion
The Cree XLamp
®
MX-3 LeD provides the
proven lighting-class performance and
reliability of Cree XLamp LEDs in a flat‑top
PLCC package. The XLamp MX-3 LeD
continues Cree’s history of innovation in
LeDs for lighting applications with a wide
viewing angle, unlimited floor life, uniform
light output without secondary optics and
electrically neutral thermal path.
The XLamp MX-3 LeD brings high
performance and quality of light to a wide
range of lighting applications, including
linear lighting, LED light bulbs, fluorescent
retrofits and retail‑display lighting.
FEAturEs
Available in white (2600 K to 8300 K
CCT)
Maximum drive current: 500 mA
Wide viewing angle: 120°
electrically neutral thermal path
Qualification at maximum drive
current
RoHS and ReACh compliant
UL
®
recognized component
(e349212)
tAbLE oF ContEnts
Characteristics ....................................... 2
Flux Characteristics ............................... 2
Relative Spectral Power Distribution .... 3
Relative Flux vs. Junction
Temperature ........................................... 3
electrical Characteristics ....................... 4
Relative Flux vs. Current ........................ 4
Typical Spatial Distribution.................... 5
Thermal Design ...................................... 5
Reflow Soldering Characteristics
.......... 6
Notes ...................................................... 7
Mechanical Dimensions ........................ 9
Tape and Reel ....................................... 10
Packaging ............................................. 11
www.CRee.Com/XLAmp
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
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