The above Type Numbers represent the order groups which include only a few brightness groups (see page 5). Only one group will be shipped on each
packing unit (there will be no mixing of two groups on each packing unit). E. g. LP T770-G2J2-1 means that only one group G2, H1, H2, J1, J2 will be
shippable for any packing unit. In order to ensure availability, single brightness groups will not be orderable.
In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one packing unit.
E. g. LP T770-G2J2-1 means that only one wavelength group 1 will be shippable. LP T770-G2J2-1 means that the device will be shipped within the
specified limits as stated on page 5In order to ensure availability, single wavelength groups will not be orderable (see page 5).
Anm.:
Die oben genannten Typbezeichnungen umfassen die bestellbaren Selektionen. Diese bestehen aus wenigen Helligkeitsgruppen (siehe Seite 5). Es
wird nur eine einzige Helligkeitsgruppe pro Verpackungseinheit geliefert. Z. B. LP T770-G2J2-1 bedeutet, dass in einer Verpackungseinheit nur eine
der Helligkeitsgruppen G2, H1, H2, J1, J2 enhalten ist. Um die Liefersicherheit zu gewährleisten, können einzelne Helligkeitsgruppen nicht bestellt
werden.
Gleiches gilt für die Farben, bei denen Wellenlängengruppen gemessen und gruppiert werden. Pro Verpackungseinheit wird nur eine
Wellenlängengruppe geliefert. Z. B. LP T770-G2J2-1 bedeutet, dass in einer Verpackungseinheit nur eine der Wellenlängengruppen 1 enthalten ist
(siehe Seite 5). LP T770-G2J2-1 bedeutet, dass das Bauteil innerhalb der spezifizierten Grenzen geliefert wird. Um die Liefersicherheit zu
gewährleisten, können einzelne Wellenlängengruppen nicht bestellt werden.
2013-06-28
2
Version 1.0 (Replacement in due course)
Maximum Ratings
Grenzwerte
Parameter
Bezeichnung
Operating temperature range
Betriebstemperatur
Storage temperature range
Lagertemperatur
Junction temperature
Sperrschichttemperatur
Forward current
Durchlassstrom
(T
S
= 25 °C)
Surge current
Stoßstrom
(t <= 10
μs;
D = 0.005; T
S
= 25 °C)
Reverse voltage
2)
page 18
Sperrspannung
2)
Seite 18
(T
S
= 25 °C)
ESD withstand voltage
ESD Festigkeit
(acc. to ANSI/ESDA/JEDEC JS-001 - HBM)
Symbol
Symbol
T
op
T
stg
T
j
I
F
Values
Werte
-40 ... 100
-40 ... 100
100
30
LP T770
Unit
Einheit
°C
°C
°C
mA
I
FM
500
mA
V
R
12
V
V
ESD
up to 2
kV
2013-06-28
3
Version 1.0 (Replacement in due course)
Characteristics
(T
S
= 25 °C; I
F
= 10 mA)
Kennwerte
Parameter
Bezeichnung
Wavelength at peak emission
Wellenlänge d. emittierten Lichtes
Dominant Wavelength
3)
page 18
Dominantwellenlänge
3)
Seite 18
Spectral bandwidth at 50% I
rel max
Spektrale Bandbreite b. 50% I
rel max
Viewing angle at 50 % I
V
Abstrahlwinkel bei 50 % I
V
Forward voltage
4)
page 18
Durchlassspannung
4)
Seite 18
Reverse current
Sperrstrom
(V
R
= 12 V)
Temperature coefficient of
λ
peak
Temperaturkoeffizient von
λ
peak
(-10°C
≤
T
≤
100°C)
Temperature coefficient of
λ
dom
Temperaturkoeffizient von
λ
dom
(-10°C
≤
T
≤
100°C)
Temperature coefficient of V
F
Temperaturkoeffizient von V
F
(-10°C
≤
T
≤
100°C)
Real thermal resistance junction / ambient
5)
page 18
, 6)
page 18
LP T770
Symbol
Symbol
(typ.)
(min.)
(typ.)
(max.)
(typ.)
(typ.)
(min.)
(typ.)
(max.)
(typ.)
(max.)
(typ.)
λ
peak
λ
dom
λ
dom
λ
dom
Δλ
2ϕ
V
F
V
F
V
F
I
R
I
R
TC
λpeak
Values
Werte
557
554
560
566
22
120
1.80
2.00
2.50
0.01
10
0.11
Unit
Einheit
nm
nm
nm
nm
nm
°
V
V
V
μA
µA
nm/K
(typ.)
TC
λdom
0.05
nm/K
(typ.)
TC
V
-2.10
mV/K
(max.)
R
th JA real
400
K/W
Realer Wärmewiderstand Sperrschicht /
Umgebung
5)
Seite 18
, 6)
Seite 18
6)
page 18
Real thermal resistance junction / solder point
(max.)
R
th JS real
180
K/W
Realer Wärmewiderstand Sperrschicht / Lötpad
6)
Seite 18
2013-06-28
4
Version 1.0 (Replacement in due course)
Brightness Groups
Helligkeitsgruppen
Group
Gruppe
G2
H1
H2
J1
J2
Note:
Anm.:
LP T770
Luminous Intensity
1)
page 18
Luminous Intensity
1)
page 18
Luminous Flux
7)
page 18
Lichtstrom
7)
Seite 18
(typ.)
Φ
V
[mlm]
8
10
12
15
19
Lichtstärke
2.24
2.8
3.55
4.5
5.6
1)
Seite 18
Lichtstärke
1)
Seite 18
(max.) I
v
[mcd]
2.8
3.55
4.5
5.6
7.1
(min.) I
v
[mcd]
The standard shipping format for serial types includes either a lower family group, an upper family group or a grouping of all individual brightness groups
of only a few brightness groups. Individual brightness groups cannot be ordered.
Die Standardlieferform von Serientypen beinhaltet entweder eine untere Familiengruppe, eine obere Familiengruppe oder eine Sammelgruppe, die aus
nur wenigen Helligkeitsgruppen besteht. Einzelne Helligkeitsgruppen sind nicht bestellbar.
Dominant Wavelength Groups
3)
page 18
Dominant Wellenlängengruppen
3)
Seite 18
Group
Gruppe
1
Note:
Anm.:
pure green
(min.)
λ
dom
[nm]
556
(max.)
λ
dom
[nm]
564
No packing unit / tape ever contains more than one color group for each selection.
In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe für jede Farbe enthalten.
RTDX tests DSP Target to transfer data to PC: a) Create a project, edit the source code (.c/.asm), add header files (.h), library files (.lib) and link command files (.cmd) b) Add and modify the RTDX ...
Recently I was looking at the code under the wince OAK/DRIVER/usbfn/MDD layer. In the pipe.CPP under the mdd directory, there is a line of code in the PUSB_ENDPOINT_DESCRIPTOR CDynamicPipe::GetEndpoin...
The sensitivity of electronic devices is getting higher and higher, which requires the anti-interference ability of the equipment to be stronger and stronger. Therefore, PCB design has become more dif...
Dear heroes:I am now involved in the design of BOARDCOM chips with a group of people. If you want relevant design information, please ask for it in cash! My QQ is 259525623, contact...
Abstract:
With the increasing complexity of smart vehicle electrical and electronic architectures, the full lifecycle management of vehicle electronic control components faces multiple challe...[Details]
In June 2014, the Ministry of Industry and Information Technology issued 4G FD-LTE licenses to China Unicom and China Telecom. Together with the 4G TD-LTE licenses issued to China Mobile, China Uni...[Details]
Electric vehicles are becoming increasingly popular, with increasingly longer ranges. There are two ways to charge electric vehicles: slow charging and fast charging. Which is the most suitable? Sl...[Details]
One of the most core components of electric vehicles is the motor. The power supply provides electrical energy to the motor, which converts this electrical energy into mechanical energy, which in t...[Details]
The MCX E series is the most reliability- and safety-focused series in NXP's extensive MCX product portfolio.
With the launch of this series, NXP has further enriched its 5V-compatible MCU pr...[Details]
China, August 21, 2025 – STMicroelectronics (NYSE: STM), a world-leading semiconductor company serving a wide range of electronics applications, has published its IFRS 2025 semi-annual financial re...[Details]
In the period after the switching power supply achieved the "20 kHz" revolution in the 1970s, although improvements and enhancements were made in circuit technology, the development level of the se...[Details]
Consumer demand for premium listening experiences has driven rapid evolution in the wireless headphone market in recent years. Hybrid designs, which utilize two drivers per earbud to enhance sound ...[Details]
Puttshack's Trackaball uses the Nordic nRF54L15 system-on-chip (SoC) to monitor sensors and enable Bluetooth low energy connectivity, while the nPM2100 power management integrated circuit (PMIC) ...[Details]
Wearable technology is taking off, with applications evolving rapidly, from smartwatches to fitness trackers and even smart wigs! Bluetooth Smart is at the center of this revolution. This is the se...[Details]
As a pioneer in the new smart home concept, robot vacuums have captured a significant market share. Robot vacuums, also known as automatic sweepers, smart vacuums, or robot vacuums, are smart home ...[Details]
Analog Devices held a third-quarter fiscal 2025 earnings conference call. Vincent T. Roche, CEO and Chairman of the Board, and Richard C. Puccio, Executive Vice President and Chief Financial Office...[Details]
introduction
The rapid adoption of computers has led to a growing number of tasks being performed on them. People from all walks of life, especially programmers and writers, are spending incre...[Details]
I believe everyone has heard of memory. If your computer is slow, your experts may recommend upgrading it to a larger capacity. But what exactly is computer memory used for? Why does memory capacit...[Details]
On August 20, it was reported that the specifications of Intel's upcoming Panther Lake mobile processor appeared on the Intel GFX CI website, which mainly focuses on Intel's open source Linux drive...[Details]