LDA212 is a dual bidirectional-input optocoupler with
Darlington-transistor outputs. The LDA212 has a
minimum current transfer ratio (CTR) of 300% with a
typical value of 8500%.
Approvals
Features
•
•
•
•
•
•
100mA Continuous Load Rating
3750V
rms
Input/Output Isolation
Bidirectional Input
Small 8-Pin Package, Thru-Hole or Surface Mount
Machine Insertable, Wave Solderable
Surface Mount Tape & Reel Packaging Available
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Ordering Information
Part Number
LDA212
LDA212S
LDA212STR
Description
8-Pin DIP (50/tube)
8-Pin Surface Mount (50/tube)
8-Pin Surface Mount (1000/Reel)
Applications
•
•
•
•
•
•
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Loop Detect
Ringing Detect
Current Sensing
Pin Configuration
1
A/K
7
E
3
A/K
6
C
8
C
2
K/A
4
K/A
5
E
Pb
DS-LDA212-R05
e
3
www.ixysic.com
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Breakdown Voltage
Input Control Current
Peak (10ms)
Power Dissipation
Input Power Dissipation
1
Phototransistor
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LDA212
Ratings
30
100
1
150
150
3750
-40 to +85
-40 to +125
Units
V
P
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33mW /
ºC
Derate linearly 2mW /
ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Phototransistor Breakdown Voltage
Phototransistor Dark Current
Saturation Voltage
Current Transfer Ratio
Output Capacitance
Input Characteristics
Input Control Current
Input Voltage Drop
Common Characteristics
Capacitance, Input to Output
Conditions
I
C
= 100µA
V
CEO
= 5V, I
F
= 0mA
I
C
= 3mA, I
F
= 1mA
I
F
= 1mA, V
CE
= 2V
50V, f =1MHz
I
C
= 3mA, V
CE
= 2V
I
F
= 5mA
-
Symbol
BV
CEO
I
CEO
V
CE(sat)
CTR
C
OUT
I
F
V
F
C
I/O
Min
30
-
-
300
-
-
0.9
-
Typ
50
50
-
8500
3
0.07
1.2
3
Max
-
500
1
30000
-
1
1.4
-
Units
V
nA
V
%
pF
mA
V
pF
Switching Characteristics @ 25ºC
Characteristic
Turn-On Time
Turn-Off Time
Symbol
t
on
t
off
Test Condition
V
CC
=5V, I
F
=1mA, R
L
=500
Typ
8
345
Units
s
Switching Time Test Circuit
V
CC
R
L
I
F
V
CE
90%
10%
t
on
t
off
Pulse Width=5ms
Duty Cycle=1%
I
F
V
CE
2
www.ixysic.com
R05
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Voltage vs. Current
50
LED Forward Current (mA)
40
30
20
10
0
1.0
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
1.6
100
LED Forward Current (mA)
LED Forward Voltage (V)
LDA212
LED Voltage vs. Current (Log)
1.6
1.5
1.4
1.3
1.2
1.1
LED Forward Voltage vs. Temperature
I
F
=50mA
I
F
=20mA
I
F
=10mA
10
1
0.1
1.0
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
1.6
1.0
-40
I
F
=5mA
I
F
=2mA
I
F
=1mA
-20
0
20
40
60
Temperature (ºC)
80
100
20000
Typical CTR vs. LED Forward Current
(V
CE
=5V)
-40ºC
Collector Current I
C
(mA)
Typical Collector Current
vs. Collector Voltage
0.25
0.20
0.15
0.10
0.05
0.00
I
F
=2mA
I
F
=1mA
I
F
=0.5mA
0
1
2
3
4
Collector Voltage V
CE
(V)
5
6
I
F
=20mA
I
F
=10mA
I
F
=5mA
250
200
I
CE
Current (mA)
150
100
50
0
-40
I
CE
Current vs. Temperature
(V
CE
=5V)
I
F
=10mA
I
F
=5mA
I
F
=2mA
I
F
=1mA
15000
CTR (%)
25ºC
10000
85ºC
5000
I
F
=0.2mA
I
F
=0.1mA
I
F
=0.5mA
0
0
2
4
6
8
LED Forward Current (mA)
10
-20
0
20
40
60
Temperature (ºC)
80
100
0.95
0.90
V
CE(sat)
vs. Temperature
(I
F
=1mA, I
C
=3mA)
Leakage Current vs. Temperature
1400
1200
Leakage (nA)
1000
800
600
400
200
V
CC
=10V
V
CC
=5V
V
CC
=3V
V
CE(sat)
(V)
0.85
0.80
0.75
0.70
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Turn-On Time vs. Load Resistance
(I
F
=1mA, V
CC
=5V)
8.0
7.9
7.8
7.7
7.6
7.5
7.4
7.3
7.2
7.1
7.0
6.9
6.8
1x10
2
15000
Turn-Off Time ( s)
Turn-Off Time vs. Load Resistance
(I
F
=1mA, V
CC
=5V)
Turn-On Time ( s)
10000
5000
1x10
3
1x10
4
Load Resistance ( )
1x10
5
0
1x10
2
1x10
3
1x10
4
Load Resistance ( )
1x10
5
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R05
www.ixysic.com
3
I
NTEGRATED
C
IRCUITS
D
IVISION
Manufacturing Information
Moisture Sensitivity
LDA212
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LDA212 / LDA212S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LDA212 / LDA212S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
[i=s]This post was last edited by damiaa on 2021-5-7 11:37[/i]Operational amplifier parameter analysis and LTspice application simulation" Reading notes 1 Remember the gap between ideal and reality
Id...
I would like to ask you: 1. When an integrated operational amplifier is used as a voltage comparator and an operational circuit, what is the difference in their working states? 2. In an RC series-para...
I am a person who installed Mac OS X on X86 architecture. Now the network card of the motherboard cannot be driven normally under Mac.... Is there any expert who can write a network card driver under ...
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Logic analyzers are widely used tools in digital design verification and debugging. They can verify the proper functioning of digital circuits and help users identify and troubleshoot faults. They ...[Details]
Amidst the wave of intelligent automotive transformation, advanced driver assistance is gradually emerging from cutting-edge technology into the mainstream, becoming a new frontier of industry comp...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
Since the beginning of this year, price wars have intensified, new models have been launched one after another, used cars with zero kilometers have become a hot topic, and the industry's internal c...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
While the current industry consensus is that autonomous vehicles are robots and that their systems are managed using robotics-developed thinking, there are also cases where autonomous driving is ac...[Details]
Charging is a familiar process for new energy vehicles, and as a source of battery energy, charging piles are crucial. New energy vehicle charging can be divided into fast charging and slow chargin...[Details]
A human-machine interface (HMI) refers to the platform used by people to operate a PLC. This platform provides an interface between programs and humans, serving as a medium for information transmis...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
Wearable technology is taking off, with applications evolving rapidly, from smartwatches to fitness trackers and even smart wigs! Bluetooth Smart is at the center of this revolution. This is the se...[Details]
Introduction: Traditionally, lead-acid batteries have primarily been used to provide backup power and power regulation based on location. In typical applications, the battery's actual use (discharg...[Details]
Automotive electronics systems are facing a dual challenge of functional safety and cybersecurity.
The NXP
S32K3
series MCUs utilize a deep protection system built with a Hardware Sec...[Details]
The number of new energy vehicles in use is increasing, and there are multiple choices available. New energy vehicles can be divided into hybrid and pure electric, and the types of hybrid include m...[Details]
The BB-Black is a development platform based on the TI AM335X processor, manufactured and sold by Embest under license from BeagleBoard.org. The BB-Black boasts superior graphics performance among ...[Details]
Power technology
京公网安备 11010802033920号
EEWORLD
