infrared LED optically coupled with two photodiodes.
One feedback (input) photodiode is used to generate
a control signal that provides a servomechanism
to the LED drive current, thus compensating
for the LED's nonlinear time and temperature
characteristics. The other (output) photodiode
provides an output signal that is linear with respect
to the servo LED current. The product features
wide bandwidth, high input to output isolation and
excellent servo linearity.
V
rms
Features
•
•
•
•
•
•
•
•
•
•
0.01% Servo Linearity
THD -87dB Typical
Wide Bandwidth (>200kHz)
Couples Analog and Digital Signals
High Gain Stability
Low Input/Output Capacitance
Low Power Consumption
8-Pin Flatpack or DIP Package
Surface Mount and Tape & Reel Versions Available
VDE Compatible
Approvals
•
UL Recognized Component: File # E76270
•
CSA Certified Component: Certificate # 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate # B 13 12 82667 003
Applications
•
Modem Transformer Replacement With No
Insertion Loss
•
Digital Telephone Isolation
•
Power Supply Feedback Voltage/Current
•
Medical Sensor Isolation
•
Audio Signal Interfacing
•
Isolation of Process Control Transducers
Ordering Information
Part Number
LOC112
LOC112P
LOC112PTR
LOC112S
LOC112STR
Description
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1000/Reel)
8-Pin Surface Mount (50/tube)
8-Pin Surface Mount (1000/Reel)
Each tube or reel will contain only devices of one K3-sorted value.
Devices will be individually marked with the letter of their K3 bin.
K3 Sorted Bins
Bin D = 0.733 - 0.805
Bin E = 0.806 - 0.886
Bin F = 0.887 - 0.974
Bin G = 0.975 - 1.072
Devices of any available bin will be shipped.
Pin Configuration
- LED
+ LED
C1
A1
1
2
3
4
8
7
6
5
N/C
N/C
C2
A2
DS-LOC112-R07
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Absolute Maximum Ratings @ 25ºC
Parameter
Reverse LED Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Package Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LOC112
Ratings
5
100
1
150
500
3750
-40 to +85
-40 to +125
Units
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Derate linearly 1.33 mW / °C
Derate linearly 6.67 mW / °C
Electrical Characteristics @ 25ºC
Parameter
Input Characteristics
LED Voltage Drop
Reverse LED Current
Coupler/Detector Characteristics
Dark Current
K1, Servo Gain (I
C1
/I
F
)
K2, Forward Gain (I
C2
/I
F
)
K3, Transfer Gain (K2/K1=I
C2
/I
C1
)
K3,
Transfer Gain Linearity (non-servoed)
K3 Temperature Coefficient
Common-Mode Rejection Ratio
Total Harmonic Distortion
Frequency Response
1
Input/Output Capacitance
1
Conditions
I
F
= 2 - 10mA
V
R
= 5V
I
F
=0mA, V
C1-A1
=V
C2-A2
=15V
I
F
=2 - 10mA, V
C1-A1
=V
C2-A2
=15V
I
F
=2 - 10mA
I
F
=2 - 10mA, V
C1-A1
=V
C2-A2
= 5V
V=20V
P-P
, R
L
=2k, f=100Hz
f
0
=350Hz, 0dBm
Photoconductive Configuration
Photovoltaic Configuration
V
IO
=0V, f=1MHz
Symbol
V
F
I
R
I
D
K1
K2
K3
K3
K3/T
CMRR
THD
f
-3dB
C
IO
Min
0.9
-
-
0.004
0.004
0.733
-
-
-
-96
-
-
Typ
1.2
-
1
0.007
0.007
-
-
0.005
130
-87
200
40
3
Max
1.4
10
25
0.030
0.030
1.072
1
-
-
-80
-
-
Units
V
A
nA
-
-
-
%
% / ºC
dB
dB
kHz
pF
Refer to Application Note, AN-107, for LOC112 configurations.
2
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Forward Current
vs. LED Forward Voltage
60
LED Current (mA)
50
40
30
20
10
0
1.0
1.1
1.2
1.3
1.4
1.5
0.01
1.0
1.1
1.2
1.3
1.4
1.5
100
LED Current (mA)
LOC112
LED Forward Current
vs. LED Forward Voltage
LED Forward Voltage Drop (V)
1.6
1.5
1.4
1.3
1.2
1.1
Typical LED Forward Voltage Drop
vs. Temperature
I
F
=50mA
I
F
=20mA
I
F
=10mA
10
1
0.1
I
F
=5mA
I
F
=2mA
I
F
=1mA
-20
0
20
40
60
Temperature (ºC)
80
100
1.0
-40
LED Forward Voltage (V)
LED Forward Voltage (V)
Servo Gain
vs. LED Current & Temperature
0.016
Servo-Photocurrent ( A)
0ºC
25ºC
50ºC
70ºC
85ºC
140
120
100
80
60
40
20
0
0
2
4
6
8
LED Current (mA)
10
12
0
Servo-Photocurrent
vs. LED Current & Temperature
0ºC
25ºC
50ºC
70ºC
85ºC
Normalized Servo-Photocurrent
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
Normalized Servo-Photocurrent
vs. LED Current & Temperature
0ºC
25ºC
50ºC
70ºC
85ºC
0.012
Servo Gain
0.008
0.004
0.000
2
4
6
8
LED Current (mA)
10
12
2
4
6
8
LED Current (mA)
10
12
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R07
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Manufacturing Information
Moisture Sensitivity
LOC112
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture
Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the
latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LOC112 / LOC112S
LOC112P
Moisture Sensitivity Level (MSL) Classification
MSL 1
MSL 3
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (T
C
) of this product and the maximum dwell time the
body temperature of this device may be above (T
C
- 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other
processes, the guidelines of
J-STD-020
must be observed.
Device
LOC112
LOC112S
LOC112P
Classification Temperature (T
C
)
250ºC
250ºC
240ºC
Dwell Time (t
p
)
30 seconds
Max Reflow Cycles
N/A
3
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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