Light Emitting Diodes
LNJ826W83RA
Surface Mounting Chip LED
UTSS Type
Absolute Maximum Ratings
T
a
= 25°C
Parameter
Power dissipation
Forward current
Pulse forward current
*
Reverse voltage
Operating ambient temperature
Storage temperature
Symbol
P
D
I
F
I
FP
V
R
T
opr
T
stg
Rating
45
20
60
4
–30 to +85
–40 to +100
Unit
mW
mA
mA
V
°C
°C
Lighting Color
Orange
Note) *: The conditon of I
FP
is duty 10%, pulse width 10 ms.
Electro-Optical Characteristics
T
a
= 25°C±3°C
Parameter
Luminous intensity
Reverse current
Forward voltage
Peak emission wavelength
Dominant emission wavelength
Spectral half band width
I
O
I
F
Symbol
I
O
I
R
V
F
λ
P
λ
d
Δλ
I
F
= 5 mA
V
R
= 4 V
I
F
= 5 mA
I
F
= 5 mA
I
F
= 5 mA
I
F
= 5 mA
Conditions
Min
11.5
Typ
19.0
1.9
630
Max
47.3
100
2.1
627
Unit
mcd
µA
V
nm
nm
nm
615
620
13
Note) Be careful of the product destruction by static electricity.
100
100
50
30
I
F
V
F
Relative luminous intensity (%)
1.6
1.8
2.0
2.2
2.4
500
300
Relative luminous intensity
T
a
Luminous intensity I
O
(mcd)
10
5
Forward current I
F
(mA)
50
10
5
3
100
50
30
1
1
3
5
10
30
50
100
1
10
−20
0
20
40
60
80
100
Forward current I
F
(mA)
Forward voltage V
F
(V)
Ambient temperature T
a
(°C)
Relative luminous intensity (%)
Relative luminous intensity
λ
P
100
80
60
40
20
0
60°
70°
80°
550
600
650
700
90°
100
80
60
40
20
40°
50°
25
I
F
T
a
Forward current I
F
(mA)
Directive characteristics
30°
20° 10°
0°
80°
60°
40°
20°
0
20
40
60
80
10° 20°
30°
40°
50°
60°
70°
20
15
10
5
80°
90°
100
0
0
20
40
60
80
100
Peak emission wavelength
λ
P
(nm)
Publication date: December 2016
Relative luminous intensity (%)
Ver. DEK
Ambient temperature T
a
(°C)
1
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
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other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
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ment. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in
advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or
preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
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