1.6mm Round Subminiature Reverse Package
Phototransistor
PT26-21B/TR8
Features
․Fast
response time
․High
photo sensitivity
․Small
junction capacitance
․Pb
free
․The
product itself will remain within RoHS compliant version.
․Compliance
with EU REACH
Descriptions
․PT26-21B/TR8
is a phototransistor in miniature SMD package
which is molded in a black with spherical top view lens.
The device is Spectrally matched to visible and infrared emitting
diode.
Applications
․Miniature
switch
․Counters
and sorter
․Position
sensor
․Infrared
applied system
․Encoder
Device Selection Guide
Part Category
PT
1
Chip Material
Silicon
Lens Color
Black
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Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/26. Issue No:DPT-0000129. Rev:5
Revision
:5
Release Date:2015-10-16 11:09:38.0
Expired Period: Forever
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Data Sheet
1.6mm Round Subminiature Reverse Package Phototransistor
PT26-21B/TR8
Package Dimensions
Notes:
1.All dimensions are in millimeters
Notes:
2.Tolerances unless dimensions ±0.1mm
Notes:
3.Suggested pad dimension is just for reference only
Please modify the pad dimension based on individual need
2
Copyright © 2015, Everlight All Rights Reserved. Release Date :2015/9/26 . Issue No: DPT-0000129. Rev:5
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:5
Release Date:2015-10-16 11:09:38.0
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Data Sheet
1.6mm Round Subminiature Reverse Package Phototransistor
PT26-21B/TR8
Absolute Maximum Ratings (Ta=25℃)
Parameter
Collector-Emitter Voltage
Emitter-Collector-Voltage
Collector Current
Operating Temperature
Storage Temperature
Soldering Temperature *1
Power Dissipation at(or below)
25℃Free Air Temperature
Symbol
V
CEO
V
ECO
I
C
T
opr
T
stg
T
sol
P
d
Rating
30
5
20
-25 ~ +85
-40 ~ +85
260
75
Units
V
V
mA
℃
℃
℃
mW
Notes:
*1: Soldering time
≦
5 seconds.
Electro-Optical Characteristics (Ta=25℃)
Parameter
Rang Of Spectral Bandwidth
Wavelength Of Peak Sensitivity
Collector-Emitter Breakdown
Voltage
Emitter-Collector Breakdown
Voltage
Collector-Emitter Saturation
Voltage
Collector Dark Current
On State Collector Current
Symbol
λ
0.5
λ
P
BV
CEO
BV
ECO
V
CE(sat)
I
CEO
I
C(ON)
Condition
---
---
I
C
=100μA
Ee=0mW/cm
2
I
E
=100μA
Ee=0mW/cm
2
I
C
=2mA
Ee=1mW/cm
2
V
CE
=20V
Ee=0mW/cm
2
V
CE
=5V
Ee=1mW/cm
2
Min
730
---
30
5
---
---
---
Typ
---
940
---
---
---
---
2.6
Max
1100
---
---
---
0.4
100
---
Unit
nm
nm
V
V
V
nA
mA
3
Copyright © 2015, Everlight All Rights Reserved. Release Date :2015/9/26 . Issue No: DPT-0000129. Rev:5
www.everlight.com
Revision
:5
Release Date:2015-10-16 11:09:38.0
Expired Period: Forever
LifecyclePhase:
Data Sheet
1.6mm Round Subminiature Reverse Package Phototransistor
PT26-21B/TR8
Typical Electro-Optical Characteristics Curves
Fig.1 Spectral Sensitivity
Fig.2 Collector Current vs. Irradiance
1.0
Ta=25 C
0.8
0.6
10
C
1
0.1
0.4
0.01
0.2
0
700
800
900
1000 1100 1300
0.001
0.01
0.1
1
2
10
Fig.3 Collector Current vs. Collector-Emitter
Voltage
4
Copyright © 2015, Everlight All Rights Reserved. Release Date :2015/9/26 . Issue No: DPT-0000129. Rev:5
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Revision
:5
Release Date:2015-10-16 11:09:38.0
Expired Period: Forever
LifecyclePhase:
Data Sheet
1.6mm Round Subminiature Reverse Package Phototransistor
PT26-21B/TR8
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause
big current change (Burn out will happen).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package, the Phototransistor should be kept at 10℃~30℃ and
90%RH or less.
2.3 The Phototransistor suggested be used within one year.
2.4 After opening the package, the devices must be stored at 10°C~30°C and
60%RH, and used within 168 hours (floor life). If unused Phototransistor remain, it
should be stored in moisture proof packages.
2.5 If the moisture absorbent material (desiccant
material)
has faded or unopened bag
has exceeded the shelf life or devices (out of bag) have exceeded the floor life,
baking treatment is required.
2.6 If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure or
recommend the following conditions:
96 hours at 60°C ± 5°C and < 5 % RH (reeled/tubed/loose units)
3. Soldering Condition
3.1 Lead solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
5
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Copyright © 2015, Everlight All Rights Reserved. Release Date :2015/9/26 . Issue No: DPT-0000129. Rev:5
Revision
:5
Release Date:2015-10-16 11:09:38.0
Expired Period: Forever
LifecyclePhase:
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