The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
Memory Stick
®
Connectors
CB1 Series
Card Push Insert/Push Eject
<CB1G Series>
q
Card ejection distance of 10 mm
q
Mounting height of 3.5 mm
q
Mounting area: Smaller design is 78% of former
size
s
Outline
Receptacle connectors for use with the new generation of
digital media devices requiring “Memory Stick
®
” type of
consumer removable memory card.
Several variations are available: Miniature, Low Profile and
with or without ejection mechanism.
Button Touch Ejection
<CB1F Series>
s
Features
1. Indication of Incorrect Card Insertion
The connector will not allow the card to be complete
inserted from the wrong end or reversed.
The card will stop about 7mm before complete insertion
Incorrect insertion of the card will not damage the
contacts. The card can be easily withdrawn and re-
inserted correctly.
q
Card ejection with tactile button operation
q
Card ejection distance of 10 mm
q
Equipped with card ejection switch
3. Excellent Card Handling
The type that is equipped with an ejection mechanism
provides a long ejection of the card which offers excellent
card handling qualities.
*Memory Stick is a registered trademark of the Sony Corporation.
Without Card Ejection
<CB1D Series>
q
Miniaturized, low profile design
q
Improved installation to the equipment is permitted
using (M1.7) tapping screws
q
Can be equipped with an ejection mechanism
depending on the design of the equipment side
portion
Note: Please position the card ejection button at the side of the equipment.
C18
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
sProduct
Specifications
Current rating 0.5A
Rating
Voltage rating 125V AC
Operating temperature range
-20
ç
to +85
ç(Note)
-40
ç
to +85
ç
Operating humidity range
Relative humidity 96% max.
(No condensation)
Storage temperature range
Item
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
5. Humidity
1000 Mø min.
Specification
500 V DC
No flashover or insulation breakdown
100 mø max.
No electrical discontinuity of 1 µs or more
Contact resistance: 40 mø max. from initial value
Insulation resistance: 100 Mø min.
Contact resistance: 40 mø max. from initial value
Insulation resistance: 100 Mø min.
Contact resistance: 40mø max. from initial value
No deformation of any component.
No affect on contacts
Conditions
500 V AC / one minute
100mA DC
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis
96 hours at temperature of 40ç±2ç and humidity
of 90% to 95%
Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç
Duration: 30/5/30/5(Minutes)
5 cycles
12000 cycles at 400 to 600 cycles per hour
Reflow: At the recommended temperature profile
Manual soldering: 300ç for 3 seconds
6. Temperature cycle
7. Durability
(mating/unmating)
8. Resistance to
soldering heat
Note :Includes temperature rise caused by current flow.
sMaterials
Part
Insulator
Contacts
Material
Heat resistant glass reinforced
therm oplastic compound
Phosphor bronze
Finish
Color: Black
Contact area: Gold plated
Termination area: Tin-Iead plated or
tinned copper plated
Contact area: Nickel plating
Termination area: Tin-Iead plated or
tinned copper plated
----------
----------
Remarks
UL94V-0
----------
Metal hold down
Cover
Eject mechanism components
Phosphor bronze or stainless steel
Stainless steel or cupper alloy
Stainless steel
Heat resistant glass reinforced
therm oplastic compound
CB1E,CB1F,CB1G Series is
without the termination area.
The CB1E Series has termination
area with tin-lead plated.
UL94V-0
sOrdering
information
CB 1 E - 10 S - 1.5 H - PEJC -
*
1
2
3
: CB
:1
4
5
6
7
8
9
1
Series name
2
Series No.
3
Ejector type
:C
E
With eject mechanism
F
G
D
Without eject mechanism
A
4
Number of contacts : 10
5
Connector type S : Receptacle
}
}
6
Contact pitch : 1.5 mm
7
Surface mount
8
Eject mechanism codes:
PEJC : Card Push insert/Push eject
EJL : Left button eject
EJR : Right button eject
9
Suffix
C19
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
sLow
Profile, Push Insert-Push Eject
Card pushed for ejection
Card ejected
Card fully inserted
29.4
26.8
(5.525)
Memory stick card outline
BPCB
mounting pattern
3.85
(3.25)
(31)
1.9±0.1
(19.8)
(21)
26.8±0.1
1.9±0.1
26.6±0.1
33
Part No.
CB1G-10S-1.5H-PEJC2
CL No.
CL689-0037-5
26.2
1.9±0.1
3.2
4±0.1
0.9±0.05
P=1.5±0.03
3.5
9.3±0.05
0.6
P=1.5
13.5
CONTACT No.1
9.3
sButton
Touch Eject
Card ejected
27.75
22.75
Card fully inserted
11.975 (5.525)
Memory stick card outline
3.85
(3.25)
Eject stroke
(2)
BPCB
mounting pattern
(23)
32.5±00.3
.2
Ø3
4-
1
0. 05
+ 0.
-
(13)
(0.8)
18.3
34.9
10.9
Part No.
CB1F-10S-1.5H-TEJL-PA
CL No.
CL689-0028-4
16.5±0.03
1.5±0.03
4.5
11.15±0.03
3.4±0.1
0.6±0.05
0.6
P=1.5
13.5
32.5
37
Ø0.55
0.4
3
4.2
3.5
0.9±0.05
P=1.5±0.05
13.5±0.05
CONTACT No.1
3±0.05
4.2±0.05
11.15
Ø1.2
1.5
16.5
sWithout
Card Ejection
24.7
BPCB
mounting pattern
3.5
5.3±0.1
2.65±0.03
2-Ø
1.3
.05
+0
0
19.5
Ø1
.3
Ø1
.
3
+0.
0 05
6.1±0.05
.3
Ø1
1.4
5.5
1.05±0.05
4.15±0.05
+0
0 .05
18.7±0.03
Ø
8
1.
1
0.
+ 0
10.9±00.3
39.8
18.3±00.3
1.45
CONTACT No.1
0.6
P=1.5
13.5
24.5
4.15
5.8
6.95
0.3
3.55
2±0.1
1±0.1
P=1.5±0.05
13.5±0.05
5.8±0.05
1±0.1
Part No.
CB1D-10S-1.5H
CL No.
CL689-0021-5
0.6
Ø1.2
18.7
4.15
C20
2±0.1
6.1±0.05
Ø
4-
2.4
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
sPush
Insert-Push Eject
(19.5)
Card ejected
(13.3)
Card fully inserted
Card pushed for ejection
(12)
q
Normal type
30.4
26.8
(5.525)
Memory stick card outline
(3.25)
BPCB
mounting pattern
2.4±0.1
26.8±0.1
2.4±0.1
24±0.03
3.2
Part No.
CB1EB-10S-1.5H-PEJC2
CL No.
CL689-0026-9
10.1
10.5±0.1
8.6±0.1
40.8
24
4±0.1
4±0.1
0.9±0.05
P=1.5±0.03
9.3±0.05
CONTACT No.1
0.6
P=1.5
13.5
9.3
(3.5)
(19.5)
Card ejected
Card fully inserted
(13.3)
Card pushed for ejection
(12)
q
With "U" cut-out
30.4
26.8
13.4
(5.525)
BPCB
mounting pattern
8.85
3.85
Memory stick (3.25)
card outline
2.4±0.1
26.8±0.1
2.4±0.1
24
15.1
3.2
24±0.03
10.5±0.1
8.6±0.1
4±0.1
Part No.
CB1EBG-10S-1.5H-PEJC2
CL No.
CL689-0034-7
10.1
40.8
4±0.1
0.9±0.05
P=1.5±0.03
9.3±0.05
0.6
P=1.5
13.5
CONTACT No.1
3.5
9.3
Card pushed for ejection
q
With square window
(19.5)
Card ejected
(13.3)
Card fully inserted
8.1
29.4
26.8
8.3
(5.525)
Memory stick
card outline 3.85
(3.25)
BPCB
mounting pattern
1.9±0.1
26.8±0.1
1.9±0.1
3.6
23.8
3.2
24±0.03
10.5±0.1
8.6±0.1
4±0.1
24
Part No.
CB1EBH-10S-1.5H-PEJC2
CL No.
CL689-0035-0
10.1
40.8
4±0.1
(12)
0.9±0.05
P=1.5±0.03
9.3±0.05
0.6
P=1.5
13.5
CONTACT No.1
3.5
9.3
C21
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
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