EEWORLDEEWORLDEEWORLD

Part Number

Search

NAND256R4A2AV1

Description
32M X 16 FLASH 3V PROM, 35 ns, PDSO48
Categorystorage    storage   
File Size398KB,56 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

NAND256R4A2AV1 Overview

32M X 16 FLASH 3V PROM, 35 ns, PDSO48

NAND256R4A2AV1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeSOIC
package instructionVSSOP, TSSOP48,.71,20
Contacts48
Reach Compliance Code_compli
ECCN code3A991.B.1.A
Maximum access time35 ns
command user interfaceYES
Data pollingNO
JESD-30 codeR-PDSO-G48
JESD-609 codee0
length15.4 mm
memory density268435456 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size2K
Number of terminals48
word count16777216 words
character code16000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVSSOP
Encapsulate equivalent codeTSSOP48,.71,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
page size256 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8 V
Programming voltage1.8 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height0.65 mm
Department size8K
Maximum standby current0.00005 A
Maximum slew rate0.015 mA
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeSLC NAND TYPE
width12 mm
NAND128-A, NAND256-A
NAND512-A, NAND01G-A
128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16)
528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
PRELIMINARY DATA
FEATURES SUMMARY
HIGH DENSITY NAND FLASH MEMORIES
– Up to 1 Gbit memory array
– Up to 32 Mbit spare area
– Cost effective solutions for mass storage
applications
NAND INTERFACE
– x8 or x16 bus width
– Multiplexed Address/ Data
– Pinout compatibility for all densities
SUPPLY VOLTAGE
– 1.8V device: V
DD
= 1.7 to 1.95V
– 3.0V device: V
DD
= 2.7 to 3.6V
PAGE SIZE
– x8 device: (512 + 16 spare) Bytes
– x16 device: (256 + 8 spare) Words
BLOCK SIZE
– x8 device: (16K + 512 spare) Bytes
– x16 device: (8K + 256 spare) Words
PAGE READ / PROGRAM
– Random access: 12µs (max)
– Sequential access: 50ns (min)
– Page program time: 200µs (typ)
COPY BACK PROGRAM MODE
– Fast page copy without external buffering
FAST BLOCK ERASE
– Block erase time: 2ms (Typ)
STATUS REGISTER
ELECTRONIC SIGNATURE
CHIP ENABLE ‘DON’T CARE’ OPTION
– Simple interface with microcontroller
AUTOMATIC PAGE 0 READ AT POWER-UP
OPTION
– Boot from NAND support
– Automatic Memory Download
SERIAL NUMBER OPTION
Figure 1. Packages
TSOP48 12 x 20mm
WSOP48 12 x 17 x 0.65mm
FBGA
VFBGA55 8 x 10 x 1mm
TFBGA55 8 x 10 x 1.2mm
VFBGA63 8.5 x 15 x 1mm
TFBGA63 8.5 x 15 x 1.2mm
HARDWARE DATA PROTECTION
– Program/Erase locked during Power
transitions
DATA INTEGRITY
– 100,000 Program/Erase cycles
– 10 years Data Retention
DEVELOPMENT TOOLS
– Error Correction Code software and
hardware models
– Bad Blocks Management and Wear
Leveling algorithms
– PC Demo board with simulation software
– File System OS Native reference software
– Hardware simulation models
July 2004
1/56
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
Share the silkscreen search method of TI device models
[i=s]This post was last edited by qwqwqw2088 on 2019-2-26 08:16[/i] [size=4] [/size] [size=4] The TI official website provides a method. On the homepage of the official website, click "Support and Tra...
qwqwqw2088 Analogue and Mixed Signal
Creating a Windows CE Image
[img]http://pb.images22.51img1.com/6000/ivyzhou85/b47ff16e633e094d81c7e01ad7da4919.jpg[/img] Windows CE has a very small core, which basically only includes scheduling, memory management and Kernel AP...
星空世界 Embedded System
What is the model of this chip?
[color=#000][font=Simsun][size=12px]I have a problem now. I have a chip circuit pin definition, but I don't know the model. Could any expert help me tell me the model of this chip? The package is MSOP...
chen163jun 51mcu
Some thoughts on the development of embedded technology
In the 1970s, the emergence of microprocessors made it possible to embed microcomputers into an object system and realize intelligent control of the object system. People call computer systems that re...
华清远见创客学院 Robotics Development
Can anyone tell me the general method of dynamic debugging driver
01:0000000046:ERRORE] GPIO.def : error LNK2001: unresolved external symbol GPI_Deinit BUILD: [01:0000000047:ERRORE] GPIO.def : error LNK2001: unresolved external symbol GPI_IOControl BUILD: [01:000000...
yangliu Embedded System
Cool car development platform
[align=left][color=#000000][size=3]Yesterday I listened to the special report [font=Arial]"[/font]Development Trends of China's Automotive Electronics Technology and Fujitsu's Platform-based Developme...
lord Automotive Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 353  2655  157  1929  641  8  54  4  39  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号