5962-3829425MUA datasheet, PDF

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5962-3829425MUA: DescriptionStandard SRAM, 8KX8, 45ns, CMOS, CQCC28, CERAMIC, QCC-28; Categorystorage storage; File Size228KB，8 Pages; ManufacturerCypress Semiconductor

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5962-3829425MUA Overview

Standard SRAM, 8KX8, 45ns, CMOS, CQCC28, CERAMIC, QCC-28

5962-3829425MUA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	QLCC
package instruction	QCCN, LCC28,.35X.55
Contacts	28
Reach Compliance Code	not_compliant
ECCN code	3A001.A.2.C
Maximum access time	45 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	R-CQCC-N28
JESD-609 code	e0
length	13.97 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC28,.35X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	1.905 mm
Maximum standby current	0.02 A
Minimum standby current	4.5 V
Maximum slew rate	0.125 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.89 mm
Base Number Matches	1

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Description	Standard SRAM, 8KX8, 45ns, CMOS, CQCC28, CERAMIC, QCC-28	Standard SRAM, 8KX8, 20ns, CMOS, CQCC28, CERAMIC, QCC-28	Standard SRAM, 8KX8, 35ns, CMOS, CQCC28, CERAMIC, QCC-28	Standard SRAM, 8KX8, 25ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 8KX8, 20ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28	Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28
Parts packaging code	QLCC	QLCC	QLCC	QLCC	QLCC	DIP	DIP
package instruction	QCCN, LCC28,.35X.55	CERAMIC, QCC-28	QCCN, LCC28,.35X.55	QCCN,	QCCN,	DIP,	DIP,
Contacts	28	28	28	28	28	28	28
Reach Compliance Code	not_compliant	_compli	_compli	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	45 ns	20 ns	35 ns	25 ns	20 ns	20 ns	25 ns
JESD-30 code	R-CQCC-N28	R-CQCC-N28	R-CQCC-N28	R-CQCC-N28	R-CQCC-N28	R-GDIP-T28	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	65536 bit	65536 bi	65536 bi	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	QCCN	QCCN	QCCN	QCCN	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1
Other features	AUTOMATIC POWER-DOWN	-	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
length	13.97 mm	-	13.97 mm	13.97 mm	13.97 mm	37.0205 mm	37.0205 mm
Number of ports	1	-	1	1	1	1	1
Exportable	YES	-	YES	YES	YES	YES	YES
Maximum seat height	1.905 mm	-	1.905 mm	1.905 mm	1.905 mm	5.08 mm	5.08 mm
width	8.89 mm	-	8.89 mm	8.89 mm	8.89 mm	7.62 mm	7.62 mm

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