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GRM32MR11C225KA01B

Description
Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, R, 15% TC, 2.2uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size18KB,1 Pages
ManufacturerMurata
Websitehttps://www.murata.com
Environmental Compliance
Download Datasheet Parametric View All

GRM32MR11C225KA01B Overview

Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, R, 15% TC, 2.2uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT

GRM32MR11C225KA01B Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMurata
package instruction, 1210
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance2.2 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.15 mm
JESD-609 codee3
length3.2 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK
positive tolerance10%
Rated (DC) voltage (URdc)16 V
size code1210
surface mountYES
Temperature characteristic codeR
Temperature Coefficient15% ppm/°C
Terminal surfaceTin (Sn)
Terminal shapeWRAPAROUND
width2.5 mm
Base Number Matches1
Capacitors > Monolithic Ceramic Capacitors
Data Sheet
Monolithic Ceramic Capacitors
GRM32MR11C225KA01p
(1210, R, 2.2µF, 16Vdc)
p:
packaging code
RoHS regulation conformity parts
e
g
e
L
W
(in mm)
I
Dimensions
Length L
Width W
Thickness T
Electrode e
Electrode Gap g (min.)
3.2mm±0.3mm
2.5mm±0.2mm
1.15mm±0.1mm
0.3mm min.
1.0mm
I
Packaging
Code
L
K
B
Packaging
180mm Embossed Tape
330mm Embossed Tape
Bulk(Bag)
Minimum Quantity
3000
10000
1000
I
Specifications
I
Rated Value
Murata PN Code
Tenperature Char.
Capacitance
Capacitance Change
Rated Voltage
R1
225
K
1C
Spec
R (JIS),
±15%
2.2µF
±10%
16Vdc
Please refer to
'GRM Series Specification and Test Methods (1)'
PDF file.
o
This
data sheet is applied for CHIP MONOLITHIC CERAMIC CAPACITOR used for General Electronics equipment for your design.
<Notice>
o
Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin
melting point is used. Please confirm the solderability of Tin plating termination chip before use.
o
Use of Sn-Zn based solder will deteriorate reliability of MLCC. Please check with our sales represetatives for the use of Sn-Zn based solder in advance.
• The RoHS compliance means that we judge from EU Directive 2002/95/EC the products do not contain lead, cadmium, mercury, hexavalent
chromium, PBB and PBDE, except exemptions stated in EU Directive 2002/95/EC annex and impurities existing in natural world.
• This statement does not insure the compliance of any of the listed parts with any laws or legal imperatives developed by any EU members
individually with regards to the RoHS Directive.
!
Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
specifications or transact the approval sheet for product specifications before ordering.
T
2008.3.6
http://www.murata.com/
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