SerieS overview
*SoP (Small outline PaCkageS, gullwing leadS)
1.27mm
PitCh
SerieS iC51 (ClamShell - th) - SoP, tSoP tyPe i & ii
SPeCifiCationS
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
1,000MΩ min. at 500V DC
700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
–40°C to +150°C (for type PSF)
–55°C to +170°C (for type PES & PEI)
10,000 insertions min.
Part number
iC51 - 028 2 - 334-1 - mf
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
MF = Flanged
Unmarked = Not Flanged
materialS and finiSh
Housing:
Contacts:
Plating:
Polyetherimide (PEI), glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
SerieS iC189 (oPen toP - th) - SoP, tSoP tyPe i & ii
SPeCifiCationS
Insulation Resistance:
Dielectric Withstanding Voltage:
1,000MΩ min. at 100V DC, pitch 0.4, 0.5
1,000MΩ min. at 500V DC, pitch 0.65, 0.8,1.27
100V AC for 1 minute, pitch 0.4, 0.5
500V AC for 1 minute, pitch 0.65
700V AC for 1 minute, pitch 0.8, 1.27
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
10,000 insertions
20g to 80g per pin
Part number
iC189 - 016 2 - 019 - * *
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
Protection Key**
K = With Protection Key
Unmarked = Without Protectin Key
** Protection Key: Prevents IC from releasing during transportation
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Contact Force:
materialS and finiSh
Housing:
Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-filled
Polyetherimide (PEI), glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
Contacts:
Plating:
SerieS iC235 (oPen toP - th) - SoP, tSoP tyPe ii
SPeCifiCationS
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC
700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
10,000 insertions min.
20g to 80g per pin
Part number
iC235 - 020 2 - 201 - *
Series No.
No. of Contact Pins
Number of Sides with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
materialS and finiSh
Housing:
Contacts:
Plating:
Polyetherimide (PEI), glass-filled
Beryllium Copper (BeCu)
Gold over Nickel
16
SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
ContaCting - SemiConduCtor