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MSAFA75N10C

Description
N-CHANNEL ENHANCEMENT MODE POWER MOSFET
CategoryDiscrete semiconductor    The transistor   
File Size82KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MSAFA75N10C Overview

N-CHANNEL ENHANCEMENT MODE POWER MOSFET

MSAFA75N10C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionCHIP CARRIER, R-CBCC-N3
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresHIGH RELIABILITY
Avalanche Energy Efficiency Rating (Eas)1500 mJ
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage100 V
Maximum drain current (Abs) (ID)75 A
Maximum drain current (ID)75 A
Maximum drain-source on-resistance0.019 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-CBCC-N3
JESD-609 codee0
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)540 W
Maximum pulsed drain current (IDM)300 A
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
MSAFA75N10C
SANTA ANA DIVISION
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
PRODUCT PREVIEW
DESCRIPTION
New generation N-channel enhancement mode power MOSFET with
rugged polysilicon gate structure and fast switching intrinsic rectifier. The
TM
very rugged Coolpack2
surface-mount package is lightweight, space
saving and hermetically sealed for high reliability and/or military/space
application.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
KEY FEATURES
Ultrafast body diode
Increased Unclamped
Inductive Switching (UIS)
capability
Hermetically sealed, surface
mount power package
Very low package inductance
Very low thermal resistance
Reverse polarity available
upon request
W W W .
Microsemi
.COM
APPLICATIONS/BENEFITS
APPLICATIONS/BENEFIT S
DC-DC converters
Motor controls
Uninterruptible Power
Supply(UPS)
DC choppers
Synchronous rectification
Inverters
MAXIMUM RATINGS @ 25°C (unless otherwise specified)
Description
Drain-to-Source Voltage (Gate Shorted to Source)
Continuous Gate-to-Source Voltage
Transient Gate-to-Source Voltage
Continuous Drain Current
Peak Drain Current, pulse width limited by
T
Jmax
Repetitive Avalanche Current
Repetitive Avalanche Energy
Single Pulse Avalanche Energy (3)
Total Power Dissipation @T
c
=25°C
Junction Temperature Range
Storage Temperature Range
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode)
Thermal Resistance, Junction to Case
Symbol
V
DSS
V
GS
V
GSM
I
D25
I
D10
0
I
DM
I
AR
E
AR
E
AS
P
D
Tj
Max.
100
+/-30
+/-40
75
60
300
75
30
1500
540
-55 to
+150
-55 to
+150
75
300
0.23
Unit
Volts
Volts
Volts
Amps
Amps
Amps
mJ
mJ
Watts
°C
°C
Amps
Amps
°C/W
T
j
= 25°C
T
j
= 100°C
T
stg
I
S
I
SM
θ
JC
MSAFA75N10C
MSAFA75N10C
Copyright
2000
MSC1594.PDF 2000-09-20
Microsemi
Santa Ana Division
2830 S. Fairview Street, Santa Ana, CA. 92704, 714-979-8220, Fax: 714-557-5989
Page 1

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