TORX141P
FIBER OPTIC RECEIVING MODULE
TORX141P
Fiber Optic Receiving Module for Digital
Audio Interface
·
Conform to JEITA standard CP-1201 (for digital
audio interface including fiber optic
inter-connections).
Unit: mm
Maximum Ratings
(Ta
=
25°C)
Characteristics
Storage temperature
Operating temperature
Supply voltage
High level output current
Low level output current
Soldering temperature
Symbol
T
stg
T
opr
V
CC
I
OH
I
OL
T
sol
Rating
-40
to 70
-20
to 70
-0.5
to 4.5
-2
2
260
(Note 1)
Unit
°C
°C
V
mA
mA
°C
Note 1: Soldering time
<
10 seconds. (More than 1 mm apart from package)
=
Recommended Operating Conditions
Characteristics
Supply voltage
Symbol
V
CC
Min
2.7
Typ.
3.0
Max
3.6
Unit
V
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TORX141P
Electrical and Optical Characteristics
(Ta
=
25°C, V
CC
=
3 V)
Characteristics
Data rate
Transmission distance
Pulse width distortion
Maximum receivable power
Minimum receivable power
Current consumption
High level output voltage
Low level output voltage
(Note 4)
(Note 5)
(Note 5)
∆tw
P
MAX
P
MIN
I
CC
V
OH
V
OL
Symbol
NRZ code
Test Condition
(Note 2)
Min
0.1
0.2
-20
-14.5
¾
¾
2.1
¾
Typ.
¾
¾
¾
¾
¾
10
2.5
0.2
Max
15
10
20
¾
-27
15
¾
0.4
Unit
Mb/s
m
ns
dBm
dBm
mA
V
V
With APF and TOTX141P (Note 3)
Pulse Width 67 ns
Pulse Cycle 134 ns
CL
=
10 pF
15 Mb/s, Using APF
15 Mb/s, Using APF
Note 2: High level output when optical flux is received. Low level output when optical flux is not received.
The duty factor must be kept 25 to 75%.
Note 3: All Plastic Fiber (970/1000
mm).
Note 4: Between input of TOTX141P and output of TORX141P.
<
Note 5: BER
=
10 , peak value.
-9
Mechanical Characteristics
(Ta
=
25°C)
Characteristics
Mating force
Unmating force
Test Condition
Using TOCP172, Initial value
Using TOCP172, Initial value
Min
¾
5.9
Typ.
¾
¾
Max
39.2
39.2
Unit
N
N
Application Circuit
Fiber optic connector insertion side
Soldered to
PC board
4
3
Fiber optic
receiving
module
2
0.1
mF
1
5
Soldered to
PC board
Less than 7 mm
47
mH
V
CC
GND
(Bottom View)
Output
Applicable Optical Fiber with Fiber Optic Connectors
TOCP172-□□B
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TORX141P
Board Layout Hole Pattern
(for reference)
Unit: mm
Recommended PCB thickness: 1.6 mm
2
- f1.7 ±
0.05
2
- f1.1 ±
0.05
3
- f0.8 ±
0.05
2.54 typ. 2.54 typ.
2.625 typ.
Precautions on Use
(1)
Maximum rating
The maximum ratings are the limit values which must not be exceeded during operation of device. None of
these rating value must not be exceeded. If the maximum rating value is exceeded, the characteristics of
devices may never be restored properly. In extreme cases, the device may be permanently damages.
Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle, optical modules
are optical components. During soldering, ensure that flux does not contact with the emitting surface or
the detecting surface. Also ensure that proper flux removal is conducted after soldering.
Some optical modules come with a protective cap. The protective cap is used to avoid malfunction when the
optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering where there
may be flux residue and flux removal after soldering is not recommended. Toshiba recommend that
soldering be performed without the optical module mounted on the board. Then, after the board has been
cleaned, the optical module should be soldered on to the board manually.
If the optical module cannot be soldered manually, use non-halogen (chlorine-free) flux and make sure,
without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of
flux. In such a cases, be sure to check the devices' reliability.
Noise resistance
It is believed that the use of optical transfer devices improve noise resistance. In theory, optical fiber is not
affected by noise at all. However, receiving modules which handle signals whose level is extremely small,
are susceptible to noise.
TOSLINK improve noise resistance to use a conductive case. However, the current signal output by the
optical receiving modules' photodiode is extremely small. Thus, in some environments, shielding the case
may not achieve sufficient noise resistance.
First systems which incorporate TOSLINK, Toshiba recommend testing using the actual device to check its
noise resistance.
Use a simple noise filter on TOSLINK fiber optic transceiving module's power line. If the ripple in the
power supply used is significant, reinforce the filter.
The optical module is to be used in an area which is susceptible to radiated noise, increase the shielding by
covering the optical module and the power line filter with a metallic cover.
Vibration and shock
This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to
vibration and shock. In actual equipment, there are sometime cases in which vibration, shock, or stress is
applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in the design of
equipment which will be subject to high levels of vibration.
(2)
(3)
(4)
5.6 typ.
2.61 typ.
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2001-10-03
TORX141P
(5)
Support pins
The TORX141P has support pins in order to fix itself to the PCB temporary. Please make the hole for these
pins in the PCB under the condition described in board layout hole pattern.
Attaching the fiber optic receiving module
Solder the fixed pins (pins 4 and 5) of the fiber optic receiving module TORX141P to the printed circuit
board in order to fix it to the board.
Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour
solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off using
cotton tips.
Protective cap
When the TORX141P is not in use, attach the protective cap.
Supply voltage
Use the supply voltage within the recommended operating condition (V
CC
=
2.7 to 3.3 V). Make sure that
supply voltage does not exceed the maximum rating value of 4.5 V, even for an instant.
(6)
(7)
(8)
(9)
(10) Output
If the receiver output is at low and is connected to the power supply, or if the output is high and is
connected to GND, the internal IC may be destroyed.
(11) Soldering condition
Solder at 260°C or less for no more than ten seconds.
(12) Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations in
order to protect the environment against contamination.
(13) Precautions during use
Toshiba is continually working to improve the quality and the reliability of their products. Nevertheless,
semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and
their vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba products,
to observe standards of safety, and to avoid situations in which the malfunction or failure of a Toshiba
product could cause loss of human life, bodily injury or damage to property.
When developing equipment, please ensure that Toshiba products are used within the specified operating
ranges set forth in the most recent product specifications. Also, please keep in mind the precautions and
conditions set forth in the Toshiba Semiconductor Reliability Handbook.
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TORX141P
RESTRICTIONS ON PRODUCT USE
000707EAC
·
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
·
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
·
Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes
are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the
products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with
domestic garbage.
·
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
·
The information contained herein is subject to change without notice.
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2001-10-03
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