P
OWE R
T
RAN S FO R M E R
P C M O U N T : SPLIT PACK
FS24-800
Description:
The FS24-800 is a dual primary and dual secondary, split bobbin design which
operates with either a parallel input of 115V or a series input of 230V. The output
voltage will be either 24.0V with a center-tap under a 0.8A load with the
secondaries wired in series, or 12.0V under a 1.6A load with the secondaries
wired in parallel. The split bobbin design eliminates the need for costly
electrostatic shielding.
Electrical Specifications (@25C)
1. Maximum Power: 20.0VA
2. Primary:
Series: 230V; Parallel: 115V
3. Secondary: Series: 24.0V CT@ 0.8A; Parallel: 12.0V @ 1.6A
4. Voltage Regulation: 25% TYP @ full load to no load
5. Temperature Rise: 25C TYP
6. Hipot tested 100% at 2500 VRMS
W
Construction:
Three flange bobbin construction with primaries and secondaries wound side by
side for low capacitive coupling.
Agency File:
UL: File E53148, UL 5085-2 (506), Class B General Purpose Transformer,
cUL: File E53148, UL 5085-2 (506), Class B General Purpose Transformer,
Canadian Use (CSA 22.2, No.66.2-06)
This model is also available in Class 2, UL 5085-3 (1585) version as
FS24-800-C2
E
L
Dimensions:
H
W
1.437
1.875
Weight: 0.80 lbs
L
2.25
A
0.300
B
0.400
C
1.600
Units in inches.
D
0.041
E
0.020
F
0.234
1
2
3
4
H
Schematic:
PARALLEL
1
115/230V
50/60Hz
2
3
4
5
6
7
8
115/230V
50/60Hz
1
2
3
4
115/230V
50/60Hz
SERIES
1
2
3
4
D
F
A
8
A
5
B
RoHS Compliance:
As of manufacturing date February 2005, all standard products meet
the requirements of 2011/65/EU, known as the RoHS initiative.
C
As of April 7, 2008, UL standards 506 and 1585 will be migrated to UL 5085-2 and
5085-3, respectively.
*Upon printing, this document is considered “uncontrolled”. Please contact Triad
Magnetics website for the most current version.
For soldering and washing information
please see http://www.triadmagnetics.com/faq.html
1
4
0.06" DIAMETER
HOLE
Board Layout
Web: www.TriadMagnetics.com
Phone 951-277-0757
Fax 951-277-2757
460 Harley Knox Blvd.
Perris, California 92571
Publish Date: June 6, 2016
Embedded System
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