Open Circuit Inductance Test Parameters: 100 kHz, 0.250 Vrms, 0.0 Adc
2)
RMS current, delta temp. of 40 ° C ambient temperature of
+85
° C
3)
Peak current for approximately 10% roll-off @
+20
°C
4)
Values @
+20
° C
Dimensions-mm
Recommended PCB Layout
TOP VIEW
2.92
2.63
max
FRONT VIEW
9.4
max
12.9
max
7.37
2.8
max
2.79
UP2 .8B
xxx
wwllyy R
9.4
max
wwllyy = date code R = (revision level)
xxx = Inductance value per family chart
Component View
Do not route traces or vias underneath the inductor
Packaging information-mm
4.0
1.5 dia
+0.1/-0.0
2.0
1.5 dia
min
A
1.7
1
11.5
Bo
24.0
+/-0.3
2
Ko
A
Ao
Ao=9.7mm
Bo=13.4mm
Ko=3.1mm
12.0
User direction of feed
Packaging Information:
Parts packaged on a
13" Dia. EIA-481 compliant reel.
1,750 parts per reel.
SECTION A-A
2
www.eaton.com/electronics
UP2.8B
UNI-PAC™ low profile drum core power inductors
Inductance characteristics
Effective
August
2017
Technical Data
4106
120
% of Initial Inductance
100
80
60
40
20
0
0
40
80
% of Isat
120
160
www.eaton.com/electronics
3
Technical Data
4106
Effective
August
2017
UP2.8B
UNI-PAC™ low profile drum core power inductors
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020
Profile Feature
Preheat
and Soak
• T
e
mperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
T
able
2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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stm32/stm8
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