IC,LOGIC GATE,3 3-INPUT AND,H-TTL,DIP,14PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | AND GATE |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MC3006P | MC3110F | MC3003L | MC3060L | |
|---|---|---|---|---|
| Description | IC,LOGIC GATE,3 3-INPUT AND,H-TTL,DIP,14PIN,PLASTIC | IC,LOGIC GATE,DUAL 4-INPUT NAND,H-TTL,FP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT OR,TTL,DIP,14PIN,CERAMIC | IC,FLIP-FLOP,DUAL,D TYPE,H-TTL,DIP,14PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP |
| package instruction | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | AND GATE | NAND GATE | OR GATE | D FLIP-FLOP |
| Number of terminals | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DFP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Schmitt trigger | NO | NO | NO | - |