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10112684-G03-16ULF

Description
Headers u0026 Wire Housings MINITEK HEADER
CategoryThe connector   
File Size191KB,7 Pages
ManufacturerFCI [First Components International]
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Headers u0026 Wire Housings MINITEK HEADER

10112684-G03-16ULF Parametric

Parameter NameAttribute value
Product CategoryHeaders & Wire Housings
ManufacturerFCI [First Components International]
RoHSDetails
ProductHeaders
TypePin Strip
Number of Positions16 Position
Pitch2 mm
Number of Rows1 Row
Mounting Style-
Termination StyleSMD
Mounting AngleRight Angle
Contact PlatingGold
PackagingTube
Contact MaterialPhosphor Bronze
Current Rating2 A
Housing MaterialThermoplastic
Insulation Resistance1000 MOhms
Mating Post Length4 mm
Factory Pack Quantity18
Voltage Rating650 V
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-0804
REVISION
MINITEK
TM
Header SMT HORIZONTAL
1 of 7
AUTHORIZED BY
DATE
A
11 Jan 2011
JM COMPAGNON
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality, and reliability requirements of the Minitek
2.0 millimeters centerline SMT R/A.
TM
Header
2.0
SCOPE
This specification is applicable to the termination characteristics of the Minitek Header, when mated with
TM
FCI Minitek terminals or other 0.51mm pin compatible receptacles, 2mm centerline. This product provides
board to board, board to cable, board to discrete wire capabilities in horizontal one or two row configurations.
TM
3.0
REQUIREMENTS
3.1
MATERIAL
3.1.1 Pins: Pins shall be Phosphor Bronze Alloy UNS C51000 drawn wire in accordance with
ASTMB159
3.1.2 Insulator: High temperature Glass-filled polymer with a flame retardant rating of UL-94-V0
3.2
FINISH
The finish of the pins shall be as specified herein.
3.2.1 Solder tails: 2-6µm pure matte Tin over 1.27µm nickel MIN under plating.
3.2.2 Contact areas: As defined by product drawings, will be plated with the specified thickness
Class II -
0.76µm Gold/GXT over 1.27µm nickel MIN under plating.
Class III
Gold flash over 1.27µm nickel MIN under plating
2µm MIN full Tin MIN over 1.27µm nickel MIN under plating
3.2.3 All other areas will be plated with 1.27µm min of nickel.
3.3
Copyright FCI
Form E-3334
Rev E
DESIGN AND CONSTRUCTION
GS-01-001

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