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XMLHVW-Q0-0000-0000HS5F7

Description
Thermal Substrates - MCPCB 1-UP INDV STAR CREE XML
CategoryLED optoelectronic/LED   
File Size952KB,10 Pages
ManufacturerCree
Websitehttp://www.cree.com/
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Thermal Substrates - MCPCB 1-UP INDV STAR CREE XML

XMLHVW-Q0-0000-0000HS5F7 Parametric

Parameter NameAttribute value
Product CategoryHigh Power LEDs - White
ManufacturerCree
RoHSDetails
Package / CaseSMD-2
Illumination ColorWhite (Warm White)
Wavelength/Color Temperature3250 K
Luminous Intensity-
Luminous Flux/Radiant Flux172 lm
Color Rendering Index - CRI80
Viewing Angle110 deg
Lens Color/StyleWater Clear
If - Forward Current44 mA
Vf - Forward Voltage46 V
Power Rating6 W
Mounting StyleSMD/SMT
Length5 mm
Width5 mm
Height3.02 mm
Maximum Operating Temperature-
Minimum Operating Temperature-
PackagingReel
Color Temperature3250 K
Features-
LED Size5 mm x 5 mm x 3.02 mm
Lens Dimensions4.52 mm
Lens ShapeDome
Factory Pack Quantity1000
TypeXLamp XM-L HVW LEDs
Vr - Reverse Voltage5 V
Unit Weight0.007055 oz
CLD-DS44 rev 7H
Product family data sheet
Cree
®
XLamp
®
XM-L™ HVW LEDs
ProDuCt DEsCriPtion
The Cree XLamp
®
XM-L™ High-voltage
White
(HvW)
LeD
provides
the
lighting-class performance and reliability
of Cree XLamp LeDs in the standard
XM package. The XM-L HvW LeD is an
order of magnitude smaller than other
high-voltage LeD arrays, allowing easy
implementation
of
space-constrained
lighting applications with smaller, more
efficient high-voltage drivers. Among
these applications are lamps such as A19,
B10, GU10, MR16, PAR30 and E17.
FEAturEs
• Binned at 85 °C
• Typical forward voltage of 46 V @
44 mA, with Vf binning available
Cree-standard XM mechanical
footprint, with electrically neutral
thermal path
• Low thermal resistance: 3.5 °C/W
• Wide viewing angle: 110°
• Maximum drive current: 125 mA
Maximum junction temperature:
150 °C
• Unlimited floor life at ≤ 30 ºC/85% RH
• Reflow solderable
• Available in standard CRI and
80-minimum CRI configurations
roHS compliant
• UL
®
recognized component (E349212)
tAbLE oF ContEnts
Characteristics ......................................
2
Flux Characteristics ..............................
2
Relative Spectral Power Distribution
...
3
relative Flux vs. Junction
Temperature ..........................................
3
electrical Characteristics ...................... 4
relative Flux vs. Current ....................... 4
Typical Spatial Distribution................... 5
Thermal Design ..................................... 5
Reflow Soldering Characteristics
.........
6
Notes ..................................................... 7
Mechanical Dimensions ....................... 8
Tape and reel ........................................
9
Packaging
............................................
10
www.CRee.CoM/XLAMp
Copyright © 2011-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are
registered trademarks and the Cree logo and XM-L™ are trademarks of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
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