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74LVC2G32DP

Description
Dual 2-input OR gate
Categorylogic    logic   
File Size78KB,14 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
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74LVC2G32DP Overview

Dual 2-input OR gate

74LVC2G32DP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionTSSOP, TSSOP8,.16
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G8
Load capacitance (CL)50 pF
Logic integrated circuit typeOR GATE
MaximumI(ol)0.024 A
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.16
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
power supply3.3 V
Prop。Delay @ Nom-Su5.3 ns
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
DATA SHEET
74LVC2G32
Dual 2-input OR gate
Product specification
Supersedes data of 2003 Oct 27
2004 Sep 22

74LVC2G32DP Related Products

74LVC2G32DP 74LVC2G32 74LVC2G32DC 74LVC2G32GM
Description Dual 2-input OR gate Dual 2-input OR gate Dual 2-input OR gate Dual 2-input OR gate
Is it Rohs certified? conform to - conform to incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction TSSOP, TSSOP8,.16 - TSSOP, TSSOP8,.12,20 SON, SOLCC6,.04,20
Reach Compliance Code unknow - unknow unknow
JESD-30 code R-PDSO-G8 - R-PDSO-G8 R-PDSO-N6
Load capacitance (CL) 50 pF - 50 pF 50 pF
Logic integrated circuit type OR GATE - OR GATE OR GATE
MaximumI(ol) 0.024 A - 0.024 A 0.024 A
Number of terminals 8 - 8 6
Maximum operating temperature 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP - TSSOP SON
Encapsulate equivalent code TSSOP8,.16 - TSSOP8,.12,20 SOLCC6,.04,20
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
method of packing TAPE AND REEL - TAPE AND REEL TAPE AND REEL
power supply 3.3 V - 3.3 V 3.3 V
Prop。Delay @ Nom-Su 5.3 ns - 5.3 ns 5.3 ns
Certification status Not Qualified - Not Qualified Not Qualified
Schmitt trigger NO - NO NO
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V
surface mount YES - YES YES
technology CMOS - CMOS CMOS
Temperature level AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal form GULL WING - GULL WING NO LEAD
Terminal pitch 0.635 mm - 0.5 mm 0.5 mm
Terminal location DUAL - DUAL DUAL
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