SM2
D-Sub connectors - Stamped and Formed Contacts
SURFACE MOUNT CONNECTORS
CHARACTERISTICS
• Connectors according to MIL C24308 - NFC 93425-HE5
Materials and Platings
Shells
Insulator
Socket contact
Steel with tin plating
High temperature (peak at 260°C) glass-filled
thermoplastic, UL 94V-0
Stamped and formed brass, selected gold in mating area;
2.54µm (100µ”) min. tin on termination area, with entire
contact under-plated 1.27µm (50µ”) min. nickel
Brass, 3µm up to 5µm (118µ” up to 197µ”) tinned over
nickel 2µm up to 3 µm (78µ” to 118µ”)
Tin plating 4µm up to 6µm (157µ” up to 236µ”) over nickel
2µm up to 3µm (78µ” up to 118µ”), insertion force:
Low Insertion Force = LIF (bronze)
Zero Insertion Force = ZeFo (bronze)
Brass, 6µm up to 10µm (236µ” up to 394µ”) tinned over
nickel 2µm up to 3µm (78µ” up to 118µ”)
Grounding strap: brass, 4µm up to 6µm tin plating over
nickel 2µm up to 3µm (78µ” up to 118µ”)
DESCRIPTION
APPLICATIONS
Specifications
Amphenol SMT D-Sub is offered in
right angle, receptacle with brackets,
as an industry standard for I / O
connections.
Boardlock features:
-LIF (Low Insertion Force) boardlock
especially designed to be fully
compatible with pick and place
machine.
-ZeFo (Zero Force Insertion) boardlock
has been designed so that once placed
and expanded, secures a safe locking.
Rear insert
Boardlock
Screwlock
Grounding
Electrical Data
Current rating
Voltage rating
Withstanding voltage
Insulation resistance
Contact resistance
3A
300V AC/rms 50Hz
1000V AC/rms 50Hz for one minute
5000MΩ
10mΩ max
Designed for
Pick and Place
SMT process
• Industrial
• Telecom
• Any industry standard
I / O connections
Climatic Data
Operating temperature
85°C, peak at 105°C
Damp heat
56 days (40°C - 95% HR)
Mechanical Data
Single contact insertion force
Single contact withdrawal force
LIF boardlock
Coplanarity of contacts
Mating and unmating force
Unit: N
No. of Cts
9 (size E)
15 (size A)
25 (size B)
Mate (max)
30
50
83
Unmate (min)
3.5
4.5
8.0
1.2N < F < 2.5N
0.4N min
8N max per connector
0.2mm (.008”) max
SM2 / E2
NOTES
How to order
L 17 SM2 ...
RoHS Compliant
configuration:
09
15
25
S ... ... ... ...
packaging:
R
= reel (100 / reel, 9 Pos only)
T
= tube
board locks / grounding tab:
1
= V1 grounding tab +ZeFo
boardlocks (PCB = 1.6)
4
= ZeFo boardlocks only
(PCB = 1.6)
7
= V1 grounding tab only
8
= no grounding tab and no
boardlocks
B
= V2 grounding tab + LIF
boardlocks (PCB = 1.6)
: Standard options
contact plating:
1
= 0.2µm Au (7.9µ”)
2
= 0.4µm Au (15.7µ”)
3
= 0.5µm Au (19.7µ”)
4
= 0.8µm Au (31.5µ”)
6
= 1.27µm Au (50µ”)
mounting options:
1
= rear insert 4-40
2
= rear insert M3
5
= installed front screwlock
4-40
6
= fixed front screwlock 4-40
The information given in this document are as a guideline only. We reserve the right to modify our products in any way we deem necessary. Any duplication is prohibited, unless approved in writing.
E13/B
For special request, please consult factory
Memo
Do not hesitate to contact us for further information
Amphenol IT & Communication Products
Block A3/A4, The 4th Industrial District of
Industrial Headquarters, Dong Keng Road
Gong Ming Town, Shen Zhen China
Fax:+86(0)755 2754 9955
Technical Support
Tel:+86(0)755 2717 7945
Info-dsub@amphenol.com.cn
http://www.dsubconnector.com
stm32/stm8
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EEWORLD
