MAX801_C_A/MAX808_C_A...............................0°C to +70°C
MAX801_E_A/MAX808_E_A ............................-40°C to +85°C
MAX801_MJA/MAX808_MJA.........................-55°C to +125°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
"It's graduation time again." Seeing batches of students leave the ivory tower of life and take up their respective jobs; thinking about how I was once full of vigor and ambition, I can't help but sig...
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Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
Abstract:
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Preface
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0 Introduction
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MCU
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