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MM3Z22VT1G

Description
200mW 5% Zener, SOD323 22 V, SOD-323 2 LEAD, 3000-REEL
CategoryDiscrete semiconductor    diode   
File Size59KB,5 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance  
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MM3Z22VT1G Overview

200mW 5% Zener, SOD323 22 V, SOD-323 2 LEAD, 3000-REEL

MM3Z22VT1G Parametric

Parameter NameAttribute value
Brand Nameonsemi
Is it lead-free?Lead free
Objectid2008537782
Parts packaging codeSOD-323 2 LEAD
Contacts2
Manufacturer packaging code477-02
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN codeEAR99
Factory Lead Time10 weeks
Samacsys DescriptionON Semiconductor MM3Z22VT1G Zener Diode, 22V 5% 300 mW SMT 2-Pin SOD-323
Samacsys Manufactureronsemi
Samacsys Modified On2023-03-07 16:10:32
YTEOL6.95
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance55 Ω
Maximum forward voltage (VF)0.9 V
JESD-30 codeR-PDSO-G2
JESD-609 codee3
Maximum knee impedance100 Ω
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.3 W
Certification statusNot Qualified
Nominal reference voltage22 V
Maximum reverse current0.05 µA
Reverse test voltage15.4 V
surface mountYES
technologyZENER
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature30
Maximum voltage tolerance5.67%
Working test current5 mA
MM3ZxxxT1G Series,
SZMM3ZxxxT1G Series
Zener Voltage Regulators
300 mW SOD−323 Surface Mount
This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 300 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features:
http://onsemi.com
Standard Zener Breakdown Voltage Range − 2.4 V to 75 V
Steady State Power Rating of 300 mW
Small Body Outline Dimensions:
0.067” x 0.049” (1.7 mm x 1.25 mm)
Low Body Height: 0.035” (0.9 mm)
Package Weight: 4.507 mg/Unit
ESD Rating of Class 3 (> 16 kV) per Human Body Model
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices*
1
Cathode
SOD−323
CASE 477
STYLE 1
2
Anode
MARKING DIAGRAM
xx
G
G
Mechanical Characteristics:
CASE:
Void-free, Transfer-Molded Plastic
FINISH:
All External Surfaces are Corrosion Resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
xx = Specific Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
260°C for 10 Seconds
LEADS:
Plated with Pb−Sn or Sn Only (Pb−Free)
POLARITY:
Cathode Indicated by Polarity Band
FLAMMABILITY RATING:
UL 94 V−0
MOUNTING POSITION:
Any
MAXIMUM RATINGS
Rating
Total Device Dissipation FR−4 Board,
(Note 1) @ T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Symbol
P
D
300
2.4
R
qJA
T
J
, T
stg
416
−65 to +150
mW
mW/°C
°C/W
°C
Max
Unit
ORDERING INFORMATION
Device
MM3ZxxxT1G
Package
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
Shipping†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
SZMM3ZxxxT1G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm
2
.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
©
Semiconductor Components Industries, LLC, 2014
1
September, 2014 − Rev. 11
Publication Order Number:
MM3Z2V4T1/D
M

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Brand Name onsemi ON Semiconductor ON Semiconductor ON Semiconductor onsemi ON Semiconductor
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free
Contacts 2 2 2 2 2 2
Manufacturer packaging code 477-02 477-02 477-02 477-02 477-02 477-02
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Configuration SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON
Diode type ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE
Maximum dynamic impedance 55 Ω 30 Ω 15 Ω 90 Ω 25 Ω 200 Ω
JESD-30 code R-PDSO-G2 R-PDSO-G2 R-PDSO-G2 R-PDSO-G2 R-PDSO-G2 R-PDSO-G2
JESD-609 code e3 e3 e3 e3 e3 e3
Humidity sensitivity level 1 1 1 1 1 1
Number of components 1 1 1 1 1 1
Number of terminals 2 2 2 2 2 2
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
polarity UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL
Maximum power dissipation 0.3 W 0.2 W 0.3 W 0.2 W 0.3 W 0.2 W
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal reference voltage 22 V 15 V 9.1 V 36 V 12 V 56 V
surface mount YES YES YES YES YES YES
technology ZENER ZENER ZENER ZENER ZENER ZENER
Terminal surface MATTE TIN Tin (Sn) Tin (Sn) Tin (Sn) MATTE TIN Tin (Sn)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 40 40 40 30 40
Maximum voltage tolerance 5.67% 4.98% 6.08% 5.56% 5.39% 7.14%
Working test current 5 mA 5 mA 5 mA 2 mA 5 mA 2 mA
Factory Lead Time 10 weeks 1 week 1 week 1 week 46 weeks -
Minimum operating temperature -65 °C -65 °C -65 °C -65 °C -65 °C -
package instruction - 0.067 X 0.049 INCH, 0.035 INCH HEIGHT, LEAD FREE, PLASTIC, CASE 477-02, 2 PIN R-PDSO-G2 R-PDSO-G2 - R-PDSO-G2
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