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BC817-16-TP

Description
RF Connectors / Coaxial Connectors SMT ML REC AU 50 OHM W/ANTI SLDR WCKNG RL
Categorysemiconductor    Discrete semiconductor   
File Size450KB,4 Pages
ManufacturerMCC
Websitehttp://www.mccsemi.com
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BC817-16-TP Overview

RF Connectors / Coaxial Connectors SMT ML REC AU 50 OHM W/ANTI SLDR WCKNG RL

BC817-16-TP Parametric

Parameter NameAttribute value
Product CategoryBipolar Transistors - BJT
ManufacturerMCC
RoHSDetails
Mounting StyleSMD/SMT
Package / CaseSOT-23-3
Transistor PolarityNPN
Collector- Emitter Voltage VCEO Max45 V
Emitter- Base Voltage VEBO5 V
Maximum DC Collector Current1000 mA
Gain Bandwidth Product fT100 MHz
Maximum Operating Temperature+ 150 C
Continuous Collector Current800 mA
PackagingCut Tape
PackagingMouseReel
PackagingReel
Pd - Power Dissipation310 mW
Factory Pack Quantity3000
Unit Weight0.000282 oz
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla
Street Chatsworth

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BC817-16
THRU
BC817-40
NPN Small
Signal Transistor
310mW
SOT-23
A
D
Features
Halogen
free available upon request by adding suffix "-HF"
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
Moisure Sensitivity Level 1
Ideally Suited for Automatic Insertion
150 C Junction Temperature
For Switching and AF Amplifier Applications
Epitaxial Planar Die Construction
Mechanical Data
Case: SOT-23, Molded Plastic
Terminals: Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Weight: 0.008 grams ( approx.)
Marking:
BC817-16
BC817-25
BC817-40
6A
6B
6C
G
K
F
C
B
C
B
E
E
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Charateristic
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Peak Collector Current
Peak Emitter Current
Power Dissipation@T
s
=50
o
C(Note1)
Operating & Storage Temperature
Symbol Value
V
45
CEO
V
EBO
I
C
H
J
Unit
V
V
mA
mA
mA
mW
o
DIM
A
B
C
D
E
F
G
H
J
K
DIMENSIONS
INCHES
MIN
MAX
.110
.120
.083
.104
.047
.055
.035
.041
.070
.081
.018
.024
.0005
.0039
.035
.044
.003
.007
.015
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
5
500
1000
1000
300
I
CM
I
EM
P
d
T
j
, T
STG
-55~150
2
C
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
Note:
1.
Device mounted on Ceramic Substrate 0.7mm X 2.5cm area
.037
.950
.037
.950
www.mccsemi.com
Revision:
C
1 of 4
2013/06/04
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