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DS3182N

Description
Communication ICs - Various Dual ATM/Packet PHYs w/Built-In LIU
CategoryWireless rf/communication    Telecom circuit   
File Size3MB,400 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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DS3182N Overview

Communication ICs - Various Dual ATM/Packet PHYs w/Built-In LIU

DS3182N Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
Parts packaging codeBGA
package instruction27 X 27 MM, 1.27 MM PITCH, CSBGA-400
Contacts400
Reach Compliance Codenot_compliant
appATM;SDH;SONET
JESD-30 codeS-PBGA-B400
JESD-609 codee0
length27 mm
Number of functions1
Number of terminals400
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA400,20X20,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)240
power supply3.3 V
Certification statusNot Qualified
Maximum seat height2.54 mm
Maximum slew rate0.448 mA
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH NETWORK INTERFACE
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width27 mm
DS3181/DS3182/DS3183/DS3184
Single/Dual/Triple/Quad
ATM/Packet PHYs with Built-In LIU
www.maxim-ic.com
GENERAL DESCRIPTION
The DS3181, DS3182, DS3183, and DS3184
(DS318x)
integrate ATM
cell/HDLC
packet
processor(s) with a DS3/E3 framer(s) and LIU(s) to
map/demap ATM cells or packets into as many as
four DS3/E3 physical copper lines with DS3-framed,
E3-framed, or clear-channel data streams on per-port
basis.
FUNCTIONAL DIAGRAM
DS3/E3/STS-1 LIU
DS3/E3/STS-1
PORTS
APPLICATIONS
Access Concentrators
SONET/SDH ADM
SONET/SDH Muxes
PBXs
Digital Cross Connect
Test Equipment
Routers and Switches
Integrated Access
Device (IAD)
Multiservice Access
Platform (MSAP)
Multiservice Protocol
Platform (MSPP)
ATM and Frame Relay
Equipment
PDH Multiplexer/
Demultiplexer
CELL/
DS3/E3
PACKET
FRAMER/
FORMATTER PROCESSOR
SYSTEM
INTERFACE
POS-PHY
OR
UTOPIA
DS318x
FEATURES
Single (DS3181), Dual (DS3182), Triple
(DS3183), or Quad (DS3184) with Integrated LIU
ATM/Packet PHYs for DS3, E3, and Clear-
Channel 52Mbps (CC52)
Pin Compatible for Ease of Port Density
Migration in the Same PC Board Platform
Each Port Independently Configurable
Perform Receive Clock/Data Recovery and
Transmit Waveshaping
Jitter Attenuator can be Placed Either in the
Receive or Transmit Paths
Interfaces to 75Ω Coaxial Cable at Lengths Up to
380 Meters or 1246 Feet (DS3) or 440 Meters or
1443 Feet (E3)
Uses 1:2 Transformers on Both Tx and Rx
Universal PHYs Map ATM Cells and/or HDLC
Packets into DS3 or E3 Data Streams
UTOPIA L2/L3 or POS-PHY™ L2/L3 or SPI-3
Interface with 8-, 16-, or 32-Bit Bus Width
66MHz UTOPIA L3 and POS-PHY L3 Clock
52MHz UTOPIA L2 and POS-PHY L2 Clock
Ports Independently Configurable for Cell or
Packet Traffic in POS-PHY Bus Modes
Direct, PLCP, DSS, and Clear-Channel Cell
Mapping
ORDERING INFORMATION
PART
DS3181
DS3181N
DS3182
DS3182N
DS3183
DS3183N
DS3184
DS3184N
TEMP RANGE
0°C to +70°C
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
0°C to +70°C
-40°C to +85°C
PIN-PACKAGE
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
400 TE-PBGA (27mm x
27mm, 1.27mm pitch)
Note:
Add the “+” suffix for the lead-free package option.
POS-PHY and POS-PHY Level 3 are trademarks of PMC-Sierra, Inc.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here:
www.maxim-ic.com/errata.
1
REV: 102406

DS3182N Related Products

DS3182N DS3183 DS3183N
Description Communication ICs - Various Dual ATM/Packet PHYs w/Built-In LIU Communication ICs - Various Trpl ATM/Packet PHYs w/Built-In LIU Communication ICs - Various Trpl ATM/Packet PHYs w/Built-In LIU
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker Maxim Maxim Maxim
Parts packaging code BGA BGA BGA
package instruction 27 X 27 MM, 1.27 MM PITCH, CSBGA-400 27 X 27 MM, 1.27 MM PITCH, CSBGA-400 27 X 27 MM, 1.27 MM PITCH, CSBGA-400
Contacts 400 400 400
Reach Compliance Code not_compliant not_compliant not_compliant
app ATM;SDH;SONET ATM;SDH;SONET ATM;SDH;SONET
JESD-30 code S-PBGA-B400 S-PBGA-B400 S-PBGA-B400
JESD-609 code e0 e0 e0
length 27 mm 27 mm 27 mm
Number of functions 1 1 1
Number of terminals 400 400 400
Maximum operating temperature 85 °C 70 °C 85 °C
Minimum operating temperature -40 °C - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Encapsulate equivalent code BGA400,20X20,50 BGA400,20X20,50 BGA400,20X20,50
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 240 240 240
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 2.54 mm 2.54 mm 2.54 mm
Maximum slew rate 0.448 mA 0.61 mA 0.61 mA
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
Telecom integrated circuit types ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH NETWORK INTERFACE
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 27 mm 27 mm 27 mm

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