MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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by MPX5700/D
MPX5700
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPX5700 series piezoresistive transducer is a state–of–the–art monolithic silicon
pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This patented, single
element transducer combines advanced micromachining techniques, thin–film metalliza-
tion, and bipolar processing to provide an accurate, high level analog output signal that
is proportional to the applied pressure.
Features
•
2.5% Maximum Error over 0° to 85°C
•
Ideally Suited for Microprocessor or Microcontroller–Based Systems
•
Available in Differential and Gauge Configurations
•
Patented Silicon Shear Stress Strain Gauge
•
Durable Epoxy Unibody Element
BASIC CHIP
CARRIER ELEMENT
CASE 867–08, STYLE 1
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 700 kPa (0 to 101.5 psi)
0.2 to 4.7 V OUTPUT
VS
3
X–ducer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
2
GND
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
1
Vout
DIFFERENTIAL
PORT OPTION
CASE 867C–05, STYLE 1
PINS 4, 5 AND 6 ARE NO CONNECTS
PIN NUMBER
1
2
3
Vout
Gnd
VS
4
5
6
N/C
N/C
N/C
Figure 1. Fully Integrated Pressure Sensor Schematic
MAXIMUM RATINGS(1)
v
1 Atmosphere)
Burst Pressure (P2
v
1 Atmosphere)
Overpressure (P2
Storage Temperature
Operating Temperature
Parametrics
Symbol
P1max
P1burst
Tstg
TA
Value
2800
5000
– 40 to +125
– 40 to +125
Unit
kPa
kPa
°C
°C
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the Lead.
1. TC = 25°C unless otherwise noted. Maximum Ratings apply to Case 867–08 only.
2. Extended exposure at the specified limits may cause permanent damage or degradation to the device.
3. This sensor is designed for applications where P1 is always greater than, or equal to P2.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 2
Motorola Sensor Device Data
©
Motorola, Inc. 1997
1
MPX5700 SERIES
OPERATING CHARACTERISTICS
(VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Pressure Range(1)
Supply Voltage(2)
Supply Current
Zero Pressure Offset(3)
Full Scale Output(4)
Full Scale Span(5)
Accuracy(6)
Sensitivity
Response Time(7)
Output Source Current at Full Scale Output
Warm–Up Time(8)
Decoupling circuit shown in Figure 4 required to meet electrical specifications.
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Symbol
POP
VS
Io
Voff
VFSO
VFSS
—
V/P
tR
IO+
—
Min
0
4.75
–
0.088
4.587
—
—
—
—
—
—
Typ
—
5.0
7.0
0.2
4.7
4.5
—
6.4
1.0
0.1
20
Max
700
5.25
10
0.313
4.813
—
±
2.5
—
—
—
—
Unit
kPa
Vdc
mAdc
Vdc
Vdc
Vdc
%VFSS
mV/kPa
ms
mAdc
ms
MECHANICAL CHARACTERISTICS
Characteristic
Weight, Basic Element (Case 867)
Cavity Volume
Volumetric Displacement
Symbol
—
—
—
Min
—
—
—
Typ
4.0
—
—
Max
—
0.01
0.001
Unit
Grams
IN3
IN3
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
•
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
•
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•
TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
•
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
•
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm–up is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
9. P2 max is 500 kPa.
2
Motorola Sensor Device Data
MPX5700 SERIES
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 3 illustrates both the Differential/Gauge and the Ab-
solute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm. (For use of the
MPX5700D in a high pressure, cyclic application, consult the
factory.)
The MPX5700 series pressure sensor operating character-
istics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media, other than dry
air, may have adverse effects on sensor performance and
long–term reliability. Contact the factory for information re-
garding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the sensor to the A/D input of a microprocessor. Proper de-
coupling of the power supply is recommended.
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0° to
85°C using the decoupling circuit below. (The output will sat-
urate outside of the specified pressure range.)
5.0
TRANSFER FUNCTION:
Vout = VS*(0.0012858*P+0.04)
±
ERROR
4.0 VS = 5.0 Vdc
TEMP = 0 to 85°C
3.5
4.5
OUTPUT (V)
3.0
2.5
2.0
1.5
1.0
0.5
0
0
100
200
400
600
300
500
DIFFERENTIAL PRESSURE (kPa)
700
800
MAX
MIN
TYPICAL
Figure 2. Output versus Pressure Differential
FLUORO SILICONE
DIE COAT
DIE
P1
WIRE BOND
STAINLESS STEEL
METAL COVER
MPX5700
OUTPUT
(PIN 1)
50 pF
51 k
LEAD
FRAME
Motorola Sensor Device Data
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
P2
EPOXY CASE
A/D
µ
PROCESSOR
RTV DIE
BOND
Figure 3. Cross–Sectional Diagram
(Not to Scale)
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
3
MPX5700 SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The Motorola MPX
pressure sensor is designed to operate with positive differen-
tial pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Pressure (P1)
Side Identifier
Stainless Steel Cap
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Port Attached
Part Number
MPX5700D
MPX5700DP
MPX5700GP
MPX5700GS
MPX5700GSX
Case Type
867–08C
867C–05
867B–04
867E–03
867F–03
ORDERING INFORMATION
The MPX5700 pressure sensor is available in differential and gauge configurations. Devices are available in the basic ele-
ment package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connec-
tions.
MPX Series
Device Type
D i T
Basic Element
Ported Elements
Differential
Differential Dual Ports
Gauge
Gauge, Axial
Gauge, Axial PC Mount
Options
O i
Case Type
C
T
867–08C
867C–05
867B–04
867E–03
867F–03
Order Number
MPX5700D
MPX5700DP
MPX5700GP
MPX5700GS
MPX5700GSX
Device Marking
MPX5700D
MPX5700DP
MPX5700GP
MPX5700D
MPX5700D
4
Motorola Sensor Device Data
MPX5700 SERIES
PACKAGE DIMENSIONS
C
R
M
B
–A–
N
PIN 1
SEATING
PLANE
1
2
3
4
5
6
POSITIVE PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MIN
MAX
0.595
0.630
0.514
0.534
0.200
0.220
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
30
_
NOM
0.475
0.495
0.430
0.450
0.090
0.105
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
15.11
16.00
13.06
13.56
5.08
5.59
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.40
17.65
18.42
30
_
NOM
12.07
12.57
10.92
11.43
2.29
2.66
L
–T–
G
F
D
6 PL
0.136 (0.005)
M
J
S
T A
M
DIM
A
B
C
D
F
G
J
L
M
N
R
S
CASE 867–08
ISSUE N
BASIC ELEMENT (A, D)
VOUT
GROUND
VCC
V1
V2
VEX
–T–
R
SEATING
PLANE
A
U
L
V
PORT #1
POSITIVE
PRESSURE (P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
S
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.305
0.325
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.230
0.250
0.220
0.240
0.910 BSC
0.182
0.194
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
4.62
4.93
N
–Q–
B
K
1
2
3
4
5
6
PIN 1
S
G
D
6 PL
0.13 (0.005)
C
J
–P–
0.25 (0.010)
M
T Q
M
F
M
T P
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867B–04
ISSUE E
PRESSURE SIDE PORTED (AP, GP)
Motorola Sensor Device Data
5
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