1. Have more than three years of project development experience; 2. Proficient in digital baseband modulation and demodulation technology, such as FSK, CPM, GMSK, QPSK, etc., and proficient in channel...
I want to install a program written in eVC on a WinCE system industrial computer. Is there any way to create an installation program and copy it to the industrial computer to automatically complete th...
1. Aluminum oxide power reduces porosity, and the formation speed of crystal nuclei is greater than the growth speed, which promotes the refinement of crystal nuclei. 2. Aluminum oxide power improves ...
1. UnboxingFortunately, I got the opportunity to evaluate the STM32L552. After receiving the express, I couldn't wait to open the package and start testing. The following figure is the outer packaging...
The function of the circuit shown in Figure 1 is to route an RF signal through an IF bandpass filter. The circuit uses three 140 MHz IF SAW filters with different bandwidths and two ADG904-R SP4T CMOS...
Can I ask a prawn, can I use EVC4.0+POCKET2003 to develop in WINCE5.0 environment? What is the relationship between WINCE version and development environment?...
On August 23rd, Geely's subsidiary, Jiyao Tongxing, announced it has the industry's largest advanced production capacity for tandao
batteries
, with eight production bases across China. Jiy...[Details]
Abstract:
With the increasing complexity of smart vehicle electrical and electronic architectures, the full lifecycle management of vehicle electronic control components faces multiple challe...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
When you are happily watching NBA or football, your wife asks you to turn off the lights in the bedroom. Would you be depressed? Of course, unless you are not afraid of your wife.
Now you are ...[Details]
In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
We are entering a new era where people are increasingly affordably equipped with more electronic gadgets. Electronics have become essential to our lives. For example, the average consumer now owns ...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
With the increasing number of new energy vehicles on the road, the deployment of supporting facilities for these vehicles has accelerated, and new energy vehicles have gradually entered the vision ...[Details]
Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
According to Nikkei, a survey found that global electric vehicle battery supply is expected to reach more than three times the required quantity due to
cooling
demand for electric vehicles,...[Details]
Tiantai Robot's official Weibo account announced on the evening of August 20 that Tiantai Robot Co., Ltd., together with strategic partners including Shandong Future Robot Technology Co., Ltd., Sha...[Details]
High-definition media consumption is experiencing a dual growth: an increase in the number of consumers and a transition to higher-definition content. This growth is driven by increasingly widespre...[Details]
The fracture mechanism is stress concentration, which typically occurs at the capacitor lead pins or pad connection points, as shown in the figure. Under vibration, the capacitor lead pins and pad ...[Details]
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