or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1-1
DS1024
Introduction_01.4
Introduction
LatticeXP2 Family Data Sheet
Introduction
LA-LatticeXP2 devices combine a Look-up Table (LUT) based FPGA fabric with non-volatile Flash cells in an archi-
tecture referred to as flexiFLASH.
The flexiFLASH approach provides benefits including instant-on, infinite reconfigurability, on chip storage with
FlashBAK embedded block memory and Serial TAG memory and design security. The parts also support Live
Update technology with TransFR, 128-bit AES Encryption and Dual-boot technologies.
The LA-LatticeXP2 FPGA fabric was optimized for the new technology from the outset with high performance and
low cost in mind. LA-LatticeXP2 devices include LUT-based logic, distributed and embedded memory, Phase
Locked Loops (PLLs), pre-engineered source synchronous I/O support and enhanced sysDSP blocks.
Lattice Diamond
®
design software allows large and complex designs to be efficiently implemented using the LA-
LatticeXP2 family of FPGA devices. Synthesis library support for LA-LatticeXP2 is available for popular logic syn-
thesis tools. The Diamond software uses the synthesis tool output along with the constraints from its floor planning
tools to place and route the design in the LA-LatticeXP2 device. The Diamond design tool extracts the timing from
the routing and back-annotates it into the design for timing verification.
Lattice provides many pre-designed Intellectual Property (IP) LatticeCORE™ modules for the LA-LatticeXP2 fam-
ily. By using these IPs as standardized blocks, designers are free to concentrate on the unique aspects of their
design, increasing their productivity.
1-2
LA-LatticeXP2 Family Data Sheet
Architecture
February 2015
Data Sheet DS1024
Architecture Overview
Each LA-LatticeXP2 device contains an array of logic blocks surrounded by Programmable I/O Cells (PIC). Inter-
spersed between the rows of logic blocks are rows of sysMEM™ Embedded Block RAM (EBR) and a row of sys-
DSP™ Digital Signal Processing blocks as shown in Figure 2-1.
On the left and right sides of the Programmable Functional Unit (PFU) array, there are Non-volatile Memory Blocks.
In configuration mode the nonvolatile memory is programmed via the IEEE 1149.1 TAP port or the sysCONFIG™
peripheral port. On power up, the configuration data is transferred from the Non-volatile Memory Blocks to the con-
figuration SRAM. With this technology, expensive external configuration memory is not required, and designs are
secured from unauthorized read-back. This transfer of data from non-volatile memory to configuration SRAM via
wide busses happens in microseconds, providing an “instant-on” capability that allows easy interfacing in many
applications. LA-LatticeXP2 devices can also transfer data from the sysMEM EBR blocks to the Non-volatile Mem-
ory Blocks at user request.
There are two kinds of logic blocks, the PFU and the PFU without RAM (PFF). The PFU contains the building
blocks for logic, arithmetic, RAM and ROM functions. The PFF block contains building blocks for logic, arithmetic
and ROM functions. Both PFU and PFF blocks are optimized for flexibility allowing complex designs to be imple-
mented quickly and efficiently. Logic Blocks are arranged in a two-dimensional array. Only one type of block is used
per row.
LA-LatticeXP2 devices contain one or more rows of sysMEM EBR blocks. sysMEM EBRs are large dedicated 18 kbit
memory blocks. Each sysMEM block can be configured in a variety of depths and widths of RAM or ROM. In addition,
LA-LatticeXP2 devices contain up to two rows of DSP Blocks. Each DSP block has multipliers and adder/accumula-
tors, which are the building blocks for complex signal processing capabilities.
Each PIC block encompasses two PIOs (PIO pairs) with their respective sysIO buffers. The sysIO buffers of the LA-
LatticeXP2 devices are arranged into eight banks, allowing the implementation of a wide variety of I/O standards.
PIO pairs on the left and right edges of the device can be configured as LVDS transmit/receive pairs. The PIC logic
also includes pre-engineered support to aid in the implementation of high speed source synchronous standards
such as 7:1 LVDS interfaces, found in many display applications, and memory interfaces including DDR and DDR2.
Other blocks provided include PLLs and configuration functions. The LA-LatticeXP2 architecture provides up to
four General Purpose PLLs (GPLL) per device. The GPLL blocks are located in the corners of the device.
The configuration block that supports features such as configuration bit-stream de-encryption, transparent updates
and dual boot support is located between banks two and three. Every device in the LA-LatticeXP2 family supports
a sysCONFIG port, muxed with bank seven I/Os, which supports serial device configuration. A JTAG port is pro-
vided between banks two and three.
This family also provides an on-chip oscillator. LA-LatticeXP2 devices use 1.2 V as their core voltage.
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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