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CPA241DI80

CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size165KB,2 Pages
ManufacturerCirrus Logic
Websitehttp://www.cirrus.com
Environmental Compliance
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CPA241DI80 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeDIE
package instructionDIE, DIE OR CHIP
Contacts12
Reach Compliance Codecompliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Maximum average bias current (IIB)0.0002 µA
Nominal Common Mode Rejection Ratio94 dB
frequency compensationNO
Maximum input offset voltage40000 µV
JESD-30 codeR-XUUC-N12
low-biasYES
low-dissonanceNO
micropowerNO
Negative supply voltage upper limit-175 V
Nominal Negative Supply Voltage (Vsup)-50 V
Number of functions1
Number of terminals12
Package body materialUNSPECIFIED
encapsulated codeDIE
Encapsulate equivalent codeDIE OR CHIP
Package shapeRECTANGULAR
Package formUNCASED CHIP
Peak Reflow Temperature (Celsius)NOT SPECIFIED
powerYES
power supply+-50/+-175 V
Programmable powerNO
Certification statusNot Qualified
Supply voltage upper limit175 V
Nominal supply voltage (Vsup)50 V
surface mountYES
technologyMOS
Terminal formNO LEAD
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
P r o d u c t
I
I
n n o v a
t i o n
F
F
r
r
o
o
m
nnov
m
CPA241
a
CPA241
CPA241
SUPPLY VOLTAGE, +V
S
to –V
S
OUTPUT CURRENT, continuous
INPUT VOLTAGE, differential
INPUT VOLTAGE, common mode
TEMPERATURE, junction
350V
60mA
±16V
±V
S
150°C
High Power Operational Amplifier
ABSOLUTE MAXIMUM RATINGS
NOTE:
Refer to parent product data sheet PA241 for typical AC electrical characteristics, precautions,
applications and other test parameters.
DC WAFER PROBED SPECIFICATIONS
PARAMETER
OFFSET VOLTAGE, initial
BIAS CURRENT, initial
COMMON MODE REJECTION
VOLTAGE SWING
SUPPLY CURRENT, quiescent
TEST CONDITIONS
1
V
S
= ±50V
V
CM
= ±90 V DC
I
O
= 40mA
V
S
= ±50 V
84
±V
S
–12
1.8
MIN
TYP
15
56
94
±V
S
–10
2.1
MAX
40
200
2.3
UNITS
mV
pA
dB
V
mA
NOTES:
1.
2.
Unless otherwise stated V
S
= ±50 V, T
A
= 25°C, DC input specification ± value given.
Sample tested by wafer to 95%.
TYPICAL EXTERNAL CONNECTIONS
+V
S
R
I
V
IN
5
1
2
6
–V
S
3
4
R
F
DIE LAYOUT
4
5
6
9
8
*
R
CL
R
L
3
7
12
2
10
1
11
*
C
C
8
9
* Required component and value if given.
Optional balance components are recommended values.
C
C
is NPO, rated for full supply voltage –V
S
to +V
S
.
NOTE:
Diagram for connection illustration only.
All op amp configurations are possible.
Pad
1
2
3
4
Function
Output
Compensation
Compensation
Current Limit
Pad
5
6
8
9
Function
+Vs
-Vs
+IN
-IN
Dimension: 154.5 x 117.5 ± 2.5 Mils.
Thickness: 15 Mil (380µ).
Backside Metal: None, Silicon.
Bond pad: 5 Mil sq (127µ) AI.
Make no connection to bond pads not listed by function.
Note: The backside of the CPA241 die is isolated up to
500V. The top side walls of the CPA241 die are isolated up
to 300V.
Ordering Information:
Order #: CPA241DI80:
Die are only available in waffle packages with a total of 80
die per package.
CAUTION
The CPA241 is a MOSFET amplifier. ESD handling
procedures must be observed
CPA241U
http://www.cirrus.com
Copyright © Cirrus Logic, Inc. 2009
(All Rights Reserved)
MAY 2009
1
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