NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6ULCEC
Rev. 2.2, 05/2017
MCIMX6G0DVM05AA
MCIMX6G2DVM05AA
MCIMX6G3DVM05AA
MCIMX6G2DVK05AA
MCIMX6G3DVK05AA
MCIMX6G0DVM05AB
MCIMX6G2DVM05AB
MCIMX6G3DVM05AB
MCIMX6G2DVK05AB
MCIMX6G3DVK05AB
i.MX 6UltraLite
Applications Processors
for Consumer Products
Package Information
Plastic Package
BGA 14 x 14 mm, 0.8 mm pitch
BGA 9 x 9 mm, 0.5 mm pitch
Ordering Information
See
Table 1 on page 3
1
i.MX 6UltraLite introduction
1.
2.
3.
The i.MX 6UltraLite is a high performance, ultra
efficient processor family featuring NXP’s advanced
implementation of the single ARM Cortex®-A7 core,
which operates at speeds up to 528 MHz. The i.MX
6UltraLite includes an integrated power management
module that reduces the complexity of the external
power supply and simplifies the power sequencing. Each
processor in this family provides various memory
interfaces, including LPDDR2, DDR3, DDR3L, Raw
and Managed NAND flash, NOR flash, eMMC, Quad
SPI, and a wide range of other interfaces for connecting
peripherals, such as WLAN, Bluetooth™, GPS,
displays, and camera sensors.
The i.MX 6UltraLite is specifically useful for
applications such as:
• Electronics Point-of-Sale device
• Telematics
4.
5.
6.
7.
i.MX 6UltraLite introduction . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. Special signal considerations . . . . . . . . . . . . . . . 17
3.2. Recommended connections for unused analog
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 20
4.2. Power supplies requirements and restrictions . . . 28
4.3. Integrated LDO voltage regulator parameters . . . 29
4.4. PLL’s electrical characteristics . . . . . . . . . . . . . . . 31
4.5. On-Chip oscillators . . . . . . . . . . . . . . . . . . . . . . . 32
4.6. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 33
4.7. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 37
4.8. Output buffer impedance parameters . . . . . . . . . 40
4.9. System modules timing . . . . . . . . . . . . . . . . . . . . 43
4.10. Multi-Mode DDR Controller (MMDC) . . . . . . . . . . 53
4.12. External peripheral interface parameters . . . . . . 62
4.13. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 95
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 95
5.2. Boot device interface allocation . . . . . . . . . . . . . . 96
Package information and contact assignments . . . . . . 103
6.1. 14x14 mm package information . . . . . . . . . . . . 103
6.2. 9x9 mm package information . . . . . . . . . . . . . . 116
6.3. GPIO reset behaviors during reset . . . . . . . . . . 129
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
© 2015-2017 NXP B.V.
i.MX 6UltraLite introduction
•
•
•
•
IoT Gateway
Access control panels
Human Machine Interfaces (HMI)
Smart appliances
The features of the i.MX 6UltraLite processor include
1
:
• Single-core ARM Cortex-A7—The single core A7 provides a cost-effective and power-efficient
solution.
• Multilevel memory system—The multilevel memory system of each device is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The device supports
many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR
Flash, NAND Flash (MLC and SLC), OneNAND™, Quad SPI, and managed NAND, including
eMMC up to rev 4.4/4.41/4.5.
• Smart speed technology—Power management implemented throughout the IC that enables
multimedia features and peripherals to consume minimum power in both active and various low
power modes.
• Dynamic voltage and frequency scaling—The processor improves the power efficiency by scaling
the voltage and frequency to optimize performance.
• Multimedia powerhouse—Multimedia performance is enhanced by a multilevel cache system,
NEON™ MPE (Media Processor Engine) co-processor, a programmable smart DMA (SDMA)
controller, an asynchronous audio sample rate converter, and a Pixel processing pipeline (PXP) to
support 2D image processing, including color-space conversion, scaling, alpha-blending, and
rotation.
• Ethernet interfaces—10/100 Mbps Ethernet controllers.
• Human-machine interface—Support digital parallel display interface.
• Interface flexibility—Each processor supports connections to a variety of interfaces: High-speed
USB on-the-go with PHY, multiple expansion card port (high-speed MMC/SDIO host and other),
12-bit ADC module, CAN port, smart card interface compatible with EMV Standard v4.3, and a
variety of other popular interfaces (such as UART, I
2
C, and I
2
S serial audio).
• Advanced security—The processor delivers hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, and secure
software downloads. The security features are discussed in detail in the
i.MX 6UltraLite Security
Reference Manual
(IMX6ULSRM).
• Integrated power management—The processor integrates linear regulators and internally generate
voltage levels for different domains. This significantly simplifies system power management
structure.
For a comprehensive list of the i.MX 6UltraLite features, see
Section 1.2, “Features"”.
1. The actual feature set depends on the part numbers as described in the
Table 1
and
Table 2.
i.MX 6UltraLite Applications Processors for Consumer Products, Rev. 2.2, 05/2017
2
NXP Semiconductors
i.MX 6UltraLite introduction
1.1
Ordering information
Table 1. Ordering Information
Part Number
MCIMX6G0DVM05AA
MCIMX6G0DVM05AB
MCIMX6G2DVM05AA
MCIMX6G2DVM05AB
MCIMX6G3DVM05AA
MCIMX6G3DVM05AB
MCIMX6G2DVK05AA
MCIMX6G2DVK05AB
MCIMX6G3DVK05AA
MCIMX6G3DVK05AB
Feature
Package
Junction
Temperature T
j
(C)
0 to +95
0 to +95
0 to +95
0 to +95
0 to +95
0 to +95
0 to +95
0 to +95
0 to +95
0 to +95
Table 1
provides examples of orderable part numbers covered by this data sheet.
Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA
Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA
Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA
Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA
Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA
Single Core, 528 MHz 14 x 14 mm, 0.8 pitch, BGA
Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA
Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA
Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA
Single Core, 528 MHz 9 x 9 mm, 0.5 pitch, BGA
Figure 1
describes the part number nomenclature so that characteristics of a specific part number can be
identified (for example, cores, frequency, temperature grade, fuse options, and silicon revision). The
primary characteristic which describes which data sheet applies to a specific part is the temperature grade
(junction) field.
• The i.MX 6UltraLite Applications Processors for Consumer Products data sheet (IMX6ULCEC)
covers parts listed with a “D (Consumer temp)”
Ensure to have the proper data sheet for specific part by verifying the temperature grade (junction) field
and matching it to the proper data sheet. If there are any questions, visit the web page nxp.com/imx6series
or contact an NXP representative for details.
i.MX 6UltraLite Applications Processors for Consumer Products, Rev. 2.2, 05/2017
NXP Semiconductors
3
i.MX 6UltraLite introduction
MC
IMX6
X
@
+
VV
$$
%
A
Silicon Rev
A
A
Qualification Level
Prototype Samples
Mass Production
Special
MC
PC
MC
SC
Rev. 1.0 (Maskset ID:
0N52P)
Rev. 1.1 (Maskset ID:
1N52P)
Rev. 1.2 (Maskset ID
2N52P)
B
Fuse Option
Reserved
%
A
i.MX 6 Family
i.MX 6UltraLite
X
G
ARM Cortex-A7 Frequency
528 MHz
696 MHz
$$
05
07
Part Differentiator
Pac Enha Stand eFuse L2
kage nced ard
bit
Cache
Secur Secur
ity
ity
Commercial
Industrial
Commercial
Industrial
Automotive
Commercial
Industrial
Commercial
Industrial
Automotive
Industrial
Commercial
VM
VK
Y
Y
Y
Y
-
-
-
-
-
-
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
-
2048
2048
2048
2048
1536
1536
1536
1536
1536
1024
1024
512
128
128
128
128
128
128
128
128
128
128
KB
KB
KB
KB
KB
KB
KB
KB
KB
KB
USB
with
PHY
2
2
2
2
2
2
2
2
2
2
2
1
Ethernet C U
(10/100M) A A
N R
T
2
2
2
2
2
2
2
2
2
1
1
1
2
2
2
2
2
2
2
2
2
1
1
0
8
8
8
8
8
8
8
8
8
8
8
4
I2
C
SPI I2S Timer ADC CSI
/PWM
L
C
D
Y
Y
Y
Y
Y
Y
Y
Y
Y
-
-
-
@
Package Type
MAPBGA 14x14 0.8 mm
ROHS
VM
MAPBGA 9x9 0.5 mm
VK
VM
VK
VM
VM
4
4
4
4
4
4
4
4
4
4
4
2
4
4
4
4
4
4
4
4
4
4
4
2
3
3
3
3
3
3
3
3
3
3
3
1
4/8
4/8
4/8
4/8
4/8
4/8
4/8
4/8
4/8
4/8
4/8
2/4
2
2
2
2
2
2
2
2
2
1
1
1
Y
Y
Y
Y
Y
Y
Y
Y
Y
-
-
-
3
Junction Temperature (Tj)
Commercial: 0 to + 95 °C
2
+
D
C
A
Industrial: -40 to +105 °C
1
0
128 KB
0 KB
Auto: -40 to + 125 °C
Figure 1. Part Number Nomenclature—i.MX 6UltraLite
Table 2
shows the detailed information about peripherals.
Table 2. Detailed Peripherals Information
1,2,3
Peripheral Name
Ethernet
ENET1
ENET2
USB with PHY
OTG1
OTG2
CAN
FLEXCAN1
FLEXCAN2
CSI
LCD
CSI
LCDIF
Instance
Y
NA
Y
NA
NA
NA
NA
NA
G0
Y
NA
Y
Y
Y
NA
NA
NA
G1
Y
Y
Y
Y
Y
Y
Y
Y
G2
G3
Y
Y
Y
Y
Y
Y
Y
Y
i.MX 6UltraLite Applications Processors for Consumer Products, Rev. 2.2, 05/2017
4
NXP Semiconductors
i.MX 6UltraLite introduction
Table 2. Detailed Peripherals Information (continued)
1,2,3
Peripheral Name
QSPI
SDIO
QSPI
uSDHC1
uSDHC2
UART
UART1
UART2
UART3
UART4
UART5
UART6
UART7
UART8
ISO7816-3
SIM1
SIM2
I2C
I2C1
I2C2
I2C3
I2C4
SPI
ECSPI1
ECSPI2
ECSPI3
ECSPI4
I2S/SAI
SAI1
SAI2
SAI3
Instance
Y
Y
Y
Y
Y
Y
Y
NA
NA
NA
NA
NA
NA
Y
Y
NA
NA
Y
Y
NA
NA
Y
NA
NA
G0
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
G1
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
G2
G3
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
i.MX 6UltraLite Applications Processors for Consumer Products, Rev. 2.2, 05/2017
NXP Semiconductors
5
京公网安备 11010802033920号
EEWORLD
