Chinese application note "AN3500 - SP1F and SP3F Power Module Installation Guide"

Introduction

This application note provides key recommendations for correctly attaching a printed circuit board (PCB) to an SP1F or SP3F power module and correctly mounting the module to a heat sink. Follow these mounting instructions to limit thermal and mechanical stress.

Main content

in conclusion

This application note provides key recommendations for installing an SP1F or SP3F power module. Following these instructions will help reduce mechanical stress on the PCB and power module, ensuring long-term system operation. Furthermore, it is crucial to follow the instructions for mounting the power module on a heat sink to minimize the thermal resistance from the power chip to the cooler. All of these steps are crucial to ensuring optimal system reliability.