Smartphone Project Based on the Taishan School

This document outlines
my participation in the LCSC Taishan Training Camp project. Based on the project's learning content, I transformed a development board into a small smartphone. Considering I had already purchased a 6-inch screen, I modified the schematic and 3D printed model of the original 3.1-inch screen to meet the requirements.
I. Schematic :
The connection relationship between the 6-inch and 3.1-inch screens is basically similar; only a few additional interfaces need to be added to accommodate the 6-inch screen. The schematic was modified to accommodate the screen's display. After modification, soldering was performed, as shown in the figure.
 
After soldering, the screen was connected to the development board.
II. Program:
Screen Display: Based on the learned content, the program needed to be rewritten according to the screen parameters. Download the attached file tspi-rk3566-dsi-v10.dtsi and manually replace the file kernel/arch/arm64/boot/dts/rockchip/tspi-rk3566-dsi-v10.dtsi to make the screen display correspond to the 6-inch screen.
For touchscreen, download and extract the gt9xx.zip attachment, manually replace the contents of the kernel/drivers/input/touchscreen/gt9xx folder, and
after completing the above steps, recompile the kernel and flash boot.img separately.