TPA3118ClassDAudioAmpTestBoard-V2

PDF_TPA3118ClassDAudioAmpTestBoard-V2.zip

Altium_TPA3118ClassDAudioAmpTestBoard-V2.zip

PADS_TPA3118ClassDAudioAmpTestBoard-V2.zip

97262

The Mate 60 Pro NFC card is far ahead of its competitors.

A simple NFC chip, with a leading-edge outer casing printed in color.

The NFC card, far ahead of its competitors
, needs no further explanation. The circuit diagram above
is very simple and virtually identical to all open-source NFC cards available online.
It has already been tested and is usable.

PDF_The Leading Mate 60 Pro NFC Card.zip

Altium_Leading the Way Mate 60 Pro NFC Card.zip

PADS_Leading the Way Mate 60 Pro NFC Card.zip

BOM_The Leading Mate 60 Pro NFC Card.xlsx

97263

Desktop step-up/step-down UPS power supply

It uses the XL6009 chip and SEPIC circuit, and has both boost and buck capabilities. The input voltage is 3.5~20V (the maximum voltage can be increased, requiring a higher voltage capacitor), the output voltage is 1.26~20V, and the maximum current is 4A.

To facilitate circuit board debugging, a power supply with multiple voltage options is typically required. Therefore, this power supply was created. Its main functions are as follows: 1) Input: Type-C, DC plug, 18650 battery; 2) Output: DC 1.26-26V, current Max=4A, interface: USB-A, pH terminal, pin header. The main features of this circuit are the use of the XL6009 chip and SEPIC circuitry, providing step-up/step-down capability. The input voltage is 3.5~20V (the maximum voltage can be increased by matching a higher voltage capacitor). The layout of the FB and SW terminals has been meticulously designed. Actual testing shows that the output voltage meets the above requirements, and it has strong load capacity (continuous operation of a 20W motor load does not generate excessive heat).

PDF_Desktop Step-Up/Step-Down UPS Power Supply.zip

Altium Desktop Buck-Boost UPS Power Supply.zip

PADS_Desktop Step-Up/Step-Down UPS Power Supply.zip

BOM_Desktop Step-Up/Step-Down UPS Power Supply.xlsx

97265

thermal imager

The thermal imager was redesigned and 3D printed to make it a more compact, portable, and aesthetically pleasing finished product!

Project Source
: 【Ultra-Small】Infrared Thermal Imager 1 - JLCPCB EDA Open Source Hardware Platform (oshwhub.com).
I only modified the PCB appearance of this project. For details, please see the link above or the source project link: https://github.com/huxiangjs/hoozz_play.
Source Author Video: 【Implementing Mobile Phone Thermal Imaging Hoozz Play - MLX90640】 https://www.bilibili.com/video/BV1qh4y1v7mr.
Rendering and Display.
3D Structure
and Physical Display.
Due to a sudden malfunction of the 3D printer, the back cover was not properly made and looks a bit ugly. It is recommended to apply some B7000 glue.
Step 1: Direct Insertion and Connection
Function Demonstration.
Using my computer case as a reference.
Tutorial:
1. Material Preparation:


Solder the components according to the PCB (do not solder the CC2 resistor and header pins here), and burn the firmware into it. The pull-down resistor on the left side does not need to be soldered!
Inject the T-shaped nut into the 3D shell. You can use a soldering iron here, set the temperature to about 120℃, and carefully inject the nut into the 3D shell (care is required).
First, solder the pin headers to the Type-C board (the first PCB). This is crucial; adjust the pin header length so that they are just exposed on the second PCB (the one with the main controller and sensors) for easy installation of the back cover. See the pin header port in the second image. (If you don't understand, continue reading.)
Next, install the first board into the 3D housing. This requires a little skill. Then, tighten the screws.
The back cover has been slightly recessed where there is solder. You can apply a little B7000 glue to the edge of the back cover before screwing in the four screws.
Here, the back cover flew off, and the 3D printer collapsed!
Manufacturing Instructions:
    1. Select a board thickness of 0.8mm
    . 2. The board has already been assembled in the project.
    3. The thermal imaging sensor has been rotated at a slight angle; the initial design using the default angle resulted in a rotated image
    . 4. The CC2 resistor does not need to be soldered.
    5. Before inserting the phone, ensure that VCC and GND are not short-circuited (measured with a multimeter), and that the LDO input is approximately 5V and the LDO output is 3.3V (tested with a power bank and measured with a multimeter) to avoid potential damage to your property.
    6. Please be aware!
 

3D Shell.zip

Photos.zip

PDF_Thermal Imager.zip

Altium_thermal_imager.zip

PADS_Thermal Imaging Device.zip

BOM_Thermal Imaging Device.xlsx

97266

Ultrasonic transducer circuit experiment

Ultrasonic transducer circuit based on 51 microcontroller

Objective: To enable continuous operation of the ultrasonic transducer via continuous pulses. The microcontroller detects when a button is pressed and emits a square wave at a frequency of 500kHz. The duty cycle (from 10% to 90%) is controlled by a detection potentiometer.

PDF_Ultrasonic Transducer Circuit Experiment.zip

Altium_Ultrasonic Transducer Circuit Experiment.zip

PADS_Ultrasonic Transducer Circuit Experiment.zip

BOM_Ultrasonic Transducer Circuit Experiment.xlsx

97267

Multifunctional test pen (based on CW32)

Based on the CW32 multi-functional test pen, the product has been verified to be usable.

This project involved building a CW32-based multi-functional test pen,
 
based on the schematic diagram provided by Engineer He from the training camp. Several components and circuits were modified. Specifically:
1. The LDO chip in the 3.3V voltage regulator circuit was replaced with an RT9013
 
 
. 2. Only the pull-up resistor was retained in the five-way rocker switch circuit; the filter capacitor was removed.
 
 
3. Some modifications were made to the display backlight circuit.
 
 
4. The board size was slightly increased by 4mm; the original width was 14mm, which was increased to 18mm, while the length remained 100mm.
The casing was designed using LCSC EDA.
 
The following is a picture of the actual product.
Due to cost considerations, the Bluetooth chip, antenna, LED lighting, and buzzer were not soldered.
 
 
 
 
 
 
 

4e5d342b7daf84ab9199bef7d8d2d877.mp4

test_pen-master.zip

PDF_Multifunctional Test Pen (based on CW32).zip

Altium Multi-functional Test Pen (based on CW32).zip

PADS Multifunctional Test Pen (based on CW32).zip

BOM_Multifunctional Test Pen (Based on CW32).xlsx

97268

Liclock Improved-1

Based on the work of Xiao Li's Electronics Lab, improvements were made by replacing the originally difficult-to-solder QFN chip with a more easily solderable SOP chip. The relevant resistor configurations were modified according to the instructions, and the system successfully ran.

 
Original project address: oshwhub.com/lxu0423/ESP32-duo-gong-neng-mo-shui-ping
Tutorial address
: blog.csdn.net/qq_51427262/article/details/134097200?spm=1001.2014.3001.5501



 
 

PDF_Liclock Improved Version-1.zip

Altium_Liclock Improved Version-1.zip

PADS_Liclock Improved Version-1.zip

97269

LED rocker

AI-M61-32S-kit Shaker

This is a small toy I made using the Ai-M61-32S-kit development board. It can display graphics or text by shaking it left and right. It's very simple. If you like, you can make one and play with it.
 
 
 
Required materials:
1 vibration sensor, soldered to the infrared part, 16 0603 package resistors and 16 0805 LEDs.

PDF_LED Shaker.zip

Altium_LED shaker.zip

PADS_LED Shaker.zip

BOM_LED Shaker.xlsx

97271

electronic