| Part Number |
TC86R4400Y-M7G |
TC86R4400Y-MAH |
TC86R4400Y-P7G |
TC86R4400Y-PAH |
TC86R4400Y-S7G |
TC86R4400Y-SAH |
TC86R4400YS-M7G |
TC86R4400YS-MAH |
TC86R4400YS-S7G |
TC86R4400YS-SAH |
| Description |
IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor |
IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor |
IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA179, Microprocessor |
IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA179, Microprocessor |
IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor |
IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor |
IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor |
IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor |
IC 64-BIT, 75 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor |
IC 64-BIT, 100 MHz, RISC PROCESSOR, CPGA447, HEAT SINK, PGA-447, Microprocessor |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| package instruction |
HIPGA, |
HIPGA, |
PGA, |
PGA, |
HIPGA, |
HIPGA, |
HIPGA, |
HEAT SINK, PGA-447 |
HIPGA, |
HIPGA, |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
| Other features |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
MMU WITH 96 ENTRY TLB; 8 PIPELINE STAGES |
MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES |
MMU WITH 96 ENTRY TLB; SECONDARY CACHE INTERFACE; 8 PIPELINE STAGES |
| Address bus width |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
| bit size |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
| boundary scan |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| maximum clock frequency |
75 MHz |
100 MHz |
75 MHz |
100 MHz |
75 MHz |
100 MHz |
75 MHz |
100 MHz |
75 MHz |
100 MHz |
| External data bus width |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
| Format |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
| Integrated cache |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| JESD-30 code |
S-CPGA-P447 |
S-CPGA-P447 |
S-CPGA-P179 |
S-CPGA-P179 |
S-CPGA-P447 |
S-CPGA-P447 |
S-CPGA-P447 |
S-CPGA-P447 |
S-CPGA-P447 |
S-CPGA-P447 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
52.32 mm |
52.32 mm |
47.24 mm |
47.24 mm |
52.32 mm |
52.32 mm |
52.32 mm |
52.32 mm |
52.32 mm |
52.32 mm |
| low power mode |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| Number of external interrupt devices |
2 |
2 |
7 |
7 |
2 |
2 |
2 |
2 |
2 |
2 |
| Number of terminals |
447 |
447 |
179 |
179 |
447 |
447 |
447 |
447 |
447 |
447 |
| Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
HIPGA |
HIPGA |
PGA |
PGA |
HIPGA |
HIPGA |
HIPGA |
HIPGA |
HIPGA |
HIPGA |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
6.24 mm |
6.24 mm |
4.52 mm |
4.52 mm |
6.24 mm |
6.24 mm |
6.24 mm |
6.24 mm |
6.24 mm |
6.24 mm |
| speed |
75 MHz |
100 MHz |
75 MHz |
100 MHz |
75 MHz |
100 MHz |
75 MHz |
100 MHz |
75 MHz |
100 MHz |
| Maximum supply voltage |
3.6 V |
3.62 V |
3.6 V |
3.62 V |
3.6 V |
3.62 V |
3.6 V |
3.62 V |
3.6 V |
3.62 V |
| Minimum supply voltage |
3.3 V |
3.28 V |
3.3 V |
3.28 V |
3.3 V |
3.28 V |
3.3 V |
3.28 V |
3.3 V |
3.28 V |
| Nominal supply voltage |
3.3 V |
3.45 V |
3.3 V |
3.45 V |
3.3 V |
3.45 V |
3.3 V |
3.45 V |
3.3 V |
3.45 V |
| surface mount |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
TIN LEAD |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
| Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
| Terminal location |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
52.32 mm |
52.32 mm |
47.24 mm |
47.24 mm |
52.32 mm |
52.32 mm |
52.32 mm |
52.32 mm |
52.32 mm |
52.32 mm |
| uPs/uCs/peripheral integrated circuit type |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
| Maker |
Toshiba Semiconductor |
- |
- |
- |
Toshiba Semiconductor |
Toshiba Semiconductor |
- |
Toshiba Semiconductor |
Toshiba Semiconductor |
Toshiba Semiconductor |
| Parts packaging code |
PGA |
PGA |
- |
- |
PGA |
PGA |
PGA |
PGA |
PGA |
PGA |
| Contacts |
447 |
447 |
- |
- |
447 |
447 |
447 |
447 |
447 |
447 |
| ECCN code |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
- |
3A001.A.3 |
3A001.A.3 |