DATASHEET
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
+5V Powered RS-232 Transmitters/Receivers
The HIN232-HIN241 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not available. They require a single +5V power supply (except
HIN239) and feature onboard charge pump voltage converters
which generate +10V and -10V supplies from the 5V supply.
The family of devices offer a wide variety of RS-232
transmitter/receiver combinations to accommodate various
applications (see “Selection Table” on page 1).
The drivers feature true TTL/CMOS input compatibility,
slew-rate-limited output, and 300 power-off source
impedance. The receivers can handle up to ±30V, and have
a 3k to 7k input impedance. The receivers also feature
hysteresis to greatly improve noise rejection.
FN3138
Rev 17.00
August 6, 2015
Features
• Meets All RS-232E and V.28 Specifications
• Requires Only Single +5V Power Supply
- (+5V and +12V - HIN239)
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps
• Onboard Voltage Doubler/Inverter
• Low Power Consumption
• Low Power Shutdown Function
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
- ±10V Output Swing for 5V lnput
- 300 Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
• Multiple Receivers
- ±30V Input Voltage Range
- 3k to 7k Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
• Pb-free Available (RoHS compliant)
Applications
• Any System Requiring RS-232 Communication Ports
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
PART
NUMBER
HIN232
HIN236
HIN237
HIN238
HIN239
HIN240
HIN241
POWER SUPPLY
VOLTAGE
+5V
+5V
+5V
+5V
+5V and +7.5V to 13.2V
+5V
+5V
NUMBER OF
RS-232
DRIVERS
2
4
5
4
3
5
4
NUMBER OF
RS-232
RECEIVERS
2
3
3
4
5
5
5
EXTERNAL
COMPONENTS
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
2 Capacitors
4 Capacitors
4 Capacitors
LOW POWER
SHUTDOWN/TTL
THREE-STATE
No/No
Yes/Yes
No/No
No/No
No/Yes
Yes/Yes
Yes/Yes
NUMBER OF
LEADS
16
24
24
24
24
44
28
FN3138 Rev 17.00
August 6, 2015
Page 1 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pin Descriptions
PIN
V
CC
V+
V-
GND
C1+
C1-
C2+
C2-
T
IN
T
OUT
R
IN
R
OUT
EN
SD
NC
Power Supply Input 5V ±10%.
Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.
Internally generated negative supply (-10V nominal).
Ground lead. Connect to 0V.
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kpull-up resistor to
V
CC
is connected to each lead.
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kpull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed
in a high impedance state.
Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the
transmitters are shut off.
No Connect. No connections are made to these leads.
FUNCTION
FN3138 Rev 17.00
August 6, 2015
Page 2 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Ordering Information
PART
NUMBER
HIN232CBZ*
(Note)
HIN232CPZ
(Note)
HIN232IBZ*
(Note)
HIN232IPZ
(Note)
HIN236CBZ
(No longer
available or supported
recommended replacement
part ICL3243E)
(Note)
HIN237CBZ*
(No longer
available or supported
recommended replacement
part ICL3243E)
(Note)
HIN238CBZ*(Note)
HIN238IBZ*
(Note)
HIN239CBZ*
(Note)
HIN239CPZ
(Note)
PART
MARKING
HIN232CBZ
HIN232CPZ
HIN232IBZ
HIN232IPZ
HIN236CBZ
TEMP. RANGE
(°C)
0 to +70
0 to +70
-40 to +85
-40 to +85
0 to +70
PACKAGE
16 Ld SOIC
(Pb-free)
16 Ld PDIP**
(Pb-free)
16 Ld SOIC
(Pb-free)
16 Ld PDIP**
(Pb-free)
24 Ld SOIC
(Pb-free)
M16.3
E16.3
M16.3
E16.3
M24.3
PKG.
DWG. #
HIN237CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN238CBZ
HIN238IBZ
HIN239CBZ
HIN239CPZ
0 to +70
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
-40 to +85
24 Ld SOIC
(Pb-free)
24 Ld SOIC
(Pb-free)
24 Ld SOIC
(Pb-free)
24 Ld PDIP**
(Pb-free)
44 Ld MQFP
(Pb-free)
28 Ld SSOP
(Pb-free)
28 Ld SOIC
(Pb-free)
28 Ld SOIC
(Pb-free)
M24.3
M24.3
M24.3
E24.3
Q44.10X10
M28.209
M28.3
M28.3
HIN240CNZ*
(No longer
HIN240CNZ
available or supported)
(Note)
HIN241CAZ
(No longer
HIN241CAZ
available or supported)
(Note)
HIN241CBZ*
(No longer
HIN241CBZ
available or supported)
(Note)
HIN241IBZ
(No longer
HIN241IBZ
Available or supported)
(Note)
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
FN3138 Rev 17.00
August 6, 2015
Page 3 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
HIN232
(16 LD PDIP, SOIC)
TOP VIEW
T3
OUT
T1
OUT
T2
OUT
R1
IN
R1
OUT
T2
IN
T1
IN
GND
V
CC
1
2
3
4
5
6
7
8
9
HIN236
(24 LD SOIC)
TOP VIEW
24 T4
OUT
23 R2
IN
22 R2
OUT
21 SD
20 EN
19 T4
IN
18 T3
IN
17 R3
OUT
16 R3
IN
15 V-
14 C2-
13 C2+
C1+ 1
V+ 2
C1- 3
C2+ 4
C2- 5
V-
6
16 V
CC
15 GND
14 T1
OUT
13 R1
IN
12 R1
OUT
11 T1
IN
10 T2
IN
9 R2
OUT
T2
OUT
7
R2
IN
8
C1+ 10
V+ 11
C1- 12
+5V
1µF
+
16
1µF
1
NOTE 1
+
3
4
NOTE 1
+
5
V
CC
C1+
C1-
C2+
C2-
+5V TO 10V
VOLTAGE DOUBLER
V+
2
+
NOTE 1
+5V
9
10
V
CC
C1+
+
+5V TO 10V
12
C1- VOLTAGE DOUBLER
13
C2+
+
+10V TO -10V
14
VOLTAGE INVERTER
C2-
7
+5V
400k
+5V
400k
+5V
400k
+5V
400k
T1
+
1µF
V+
11
1µF
V- 15
+
2
1µF
T1
OUT
+10V TO -10V
VOLTAGE INVERTER
T1
V- 6
+
14
NOTE 1
T1
IN
T1
IN
11
+5V
400k
+5V
400k
T2
IN
T1
OUT
T3
IN
6
T2
3
T2
OUT
18
19
5
T3
T4
1
24
4
T3
OUT
T4
OUT
R1
IN
T2
IN
R1
OUT
10
12
T2
7
13
T2
OUT
R1
IN
T4
IN
R1
OUT
R1
9
R2
5k
8
5k
R3
OUT
15
EN
17
20
R2
OUT
22
R1
5k
23
R2
IN
R2
OUT
R2
IN
R2
5k
16
R3
IN
SD
R3
5k
21
NOTE:
1. Either 0.1
µ
F or 1
µ
F capacitors may be used.
8
FN3138 Rev 17.00
August 6, 2015
Page 4 of 22
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
(Continued)
HIN237
(24 LD SOIC)
TOP VIEW
T3
OUT
1
T1
OUT
2
T2
OUT
3
R1
IN
T2
IN
T1
IN
GND
V
CC
4
R1
OUT
5
6
7
8
9
24 T4
OUT
23 R2
IN
22 R2
OUT
21 T5
IN
20 T5
OUT
19 T4
IN
18 T3
IN
17 R3
OUT
16 R3
IN
15 V-
14 C2-
13 C2+
HIN238
(24 LD PDIP, SOIC)
TOP VIEW
T2
OUT
1
T1
OUT
2
R2
IN
T1
IN
R1
IN
GND
V
CC
3
R2
OUT
4
5
R1
OUT
6
7
8
9
24 T3
OUT
23 R3
IN
22 R3
OUT
21 T4
IN
20 T4
OUT
19 T3
IN
18 T2
IN
17 R4
OUT
16 R4
IN
15 V-
14 C2-
13 C2+
C1+ 10
V+ 11
C1- 12
C1+ 10
V+ 11
C1- 12
+5V
9
1µF
10
C1+
+
12
C1-
13
C2+
+
14
C2-
7
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
V+
11
+
1µF
1µF
10
C1+
+
12
C1-
13
C2+
+
14
C2-
5
+5V
9
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
V+
11
+
1µF
1µF
V- 15
1µF
+
2
T1
OUT
1µF
V- 15
+
2
1µF
T1
OUT
T1
IN
+5V
400k
+5V
400k
+5V
400k
+5V
400k
+5V
400k
T1
IN
+5V
400k
+5V
400k
+5V
400k
+5V
400k
T2
IN
6
T2
3
T2
OUT
T2
IN
18
T2
1
T2
OUT
T3
IN
T4
IN
T5
IN
R1
OUT
18
19
21
5
T3
T4
T5
1
24
20
4
T3
OUT
T4
OUT
T5
OUT
R1
IN
T3
IN
T4
IN
R1
OUT
19
21
6
T3
T4
24
20
7
T3
OUT
T4
OUT
R1
IN
R1
R2
OUT
4
R2
5k
3
5k
23
R3
IN
R1
R2
OUT
22
R2
17
R3
5k
23
5k
16
5k
R2
IN
R2
IN
R3
OUT
22
R3
5k
R3
OUT
R3
IN
R4
OUT
17
R4
5k
16
R4
IN
8
8
FN3138 Rev 17.00
August 6, 2015
Page 5 of 22
PCB Design
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